New powder coatings with low curing temperature and enhanced mechanical properties obtained from DGEBA epoxy resins and Meldrum acid using erbium triflate as curing agent

2007 ◽  
Vol 45 (11) ◽  
pp. 2316-2327 ◽  
Author(s):  
S. J. García ◽  
A. Serra ◽  
J. Suay
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resins ◽  
Curing Temperature ◽  
Curing Agent ◽  
Powder Coatings ◽  
Meldrum Acid

Study of rheological behaviours of electrostatic thermoset powder coatings

e-Polymers ◽  
2009 ◽  
Vol 9 (1) ◽  
Author(s):  
Morteza Ehsani ◽  
Ali Akbar Yousefi ◽  
Saeed Samiei Yeganeh
Keyword(s):  
Mechanical Properties ◽  
Dynamic Viscosity ◽  
Physical And Mechanical Properties ◽  
Powder Coating ◽  
Curing Temperature ◽  
Design Parameters ◽  
Powder Coatings ◽  
Gel Time ◽  
Rheological Measurements ◽  
The Impact

AbstractThe use of dynamic viscosity/time (temperature) cure curves is seen as a powerful technique to quantify formulation and resin design parameters. The behaviour of different thermoset powder coating systems, epoxy/polyester (50/50, 40/60 and 30/70) as well as the impact of the filler, the curing temperature and the frequency upon gel-time have been examined based upon the rheological measurements and compared with PE/TGIC systems. Two disparate methodologies have been utilized to determine gel-time. The behaviour of dissimilar systems bearing different formulations has been compared by means of the non-isothermal DSC test. The effects of resin percentage and the formulation on physical and mechanical properties of coating have been studied.

The Effect of Fillers on Chrome-Based Wave-Transparent Material Matrix

2012 ◽  
Vol 557-559 ◽  
pp. 357-361 ◽  
Author(s):  
Zheng Hai Liu ◽  
Ji Chuan Huo ◽  
Hai Bin Wang ◽  
Hong Lei ◽  
Yong Lin Lei
Keyword(s):  
Mechanical Properties ◽  
Dielectric Properties ◽  
Absorption Rate ◽  
Moisture Absorption ◽  
Aluminum Phosphate ◽  
Curing Temperature ◽  
Curing Agent ◽  
Matrix Composites ◽  
Transparent Material ◽  
Properties Of Materials

Phosphate of chrome-alumina (PCA) matrix composites were successfully prepared via thermoforming by using chrome-aluminum phosphate as adhesive, ZnO as curing agent and single component or combination of Al2O3, SiO2, SiC and Si3N4as fillers. We have studied the effect of different fillers on the mechanical properties, dielectric properties and moisture absorption rate of composite materials. Results show that, for the PCA-III system, when curing temperature is 180°C, the dielectric properties of materials are the best and the moisture absorption rate is the minimum; When the amount of filler is 35%, the mechanical properties of PCA-III system are the best (i.e. the tensile strength is 94.4MPa and the flexural strength is 134.7MPa).

Solvent Exchange to Exfoliate Graphene Oxides into Epoxy with Improved Mechanical and Thermal Properties

2015 ◽  
Vol 1110 ◽  
pp. 69-72
Author(s):  
Fu Ke Wang ◽  
Chao Bin He
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Mechanical And Thermal Properties ◽  
Curing Agent ◽  
Solvent Exchange ◽  
Thermal And Mechanical Properties ◽  
Graphene Oxides ◽  
Curing Agents ◽  
Exchange Technique

The dispersion and exfoliation of graphene oxides in polymer matrix remains a challenge for graphene oxides based epoxy nanocomposites fabrication. In the present paper, we reported a simple and facile solvent exchange technique to successfully transfer graphene oxides (GOs) from aqueous solution to ethanol. In addition, we found that GO dispersion in epoxy resins was affected by the curing agents. Good dispersion of GOs in epoxy resin together with enhanced thermal and mechanical properties were observed when epoxy was cured with aliphatic curing agents. For aromatic curing agent, high loading of GOs leaded to GOs aggregation, but well dispersed GOs was observed at low loading of GOs. Especially, a 12 °C increase of glass transition temperature of the epoxy resin was observed with only 0.1 wt% GOs was added to the epoxy resin.

Curing behavior, thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

2013 ◽  
Vol 54 (3) ◽  
pp. 695-703 ◽  
Author(s):  
Le Hoang Sinh ◽  
Nguyen Ngoc Trung ◽  
Bui Thanh Son ◽  
Seunghan Shin ◽  
Dinh Tan Thanh ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dicarboxylic Acid ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Curing Agent ◽  
Thermal And Mechanical Properties ◽  
Curing Behavior

Applied Research of the Flexible Epoxy Resin Curing Agent

2012 ◽  
Vol 535-537 ◽  
pp. 2499-2502
Author(s):  
X. Wang ◽  
S. R. Zheng ◽  
R. M. Wang
Keyword(s):  
Mechanical Properties ◽  
Fracture Toughness ◽  
Fracture Surface ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Applied Research ◽  
Curing Agent ◽  
Structural Adhesives ◽  
Resin Curing ◽  
The Impact

Epoxy resin structural adhesives modified by flexible curing agent. Dependening on the mechanical properties of epoxy resins on the flexible curing agent content was studied. The impact fracture toughness was discussed in terms of fracture surface fractography.

Influence of Curing Process on the Performance of Epoxy Thermosets

2009 ◽  
Vol 79-82 ◽  
pp. 2175-2178
Author(s):  
Bao Hua Zhang ◽  
Jun Dan Ye ◽  
Bin Chen ◽  
Yan Qing Weng
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Low Temperature ◽  
Tertiary Amine ◽  
Curing Temperature ◽  
Curing Agent ◽  
Hyperbranched Polyester ◽  
Epoxy Curing ◽  
Main Component ◽  
End Group

The performance of epoxy thermosets was greatly influenced by the curing agent and curing temperature. It was known that epoxy thermosets cured under high temperature would have high normal forces which could cause fracture of the structure and then decrease the mechanical properties of the material. It was accepted that epoxy curing system should be cured under low temperature with the thermosets had the same properties as those cured under high temperature. It was important to choose proper curing agent to reach the above goal. Latent epoxy curing agent whose main component was the hyperbranched polyester (HBP) with tertiary amine as the end group was prepared and was used to diglycidyl ether of bisphenol A (DGEBA) in this work. The properties such as tensile intensity, bending intensity, impact resistance and dynamic mechanic properties of the resulting epoxy thermosets were evaluated. It was found that the resulting epoxy thermosets cured under low temperature had better mechanical properties than those cured under high temperature. The latent epoxy curing agent whose main component was the hyperbranched polyester with tertiary amine as the end group was adaptive to be used in the epoxy base of composite.

Modified Epoxy Resins for Perpreg Technology

2021 ◽  
Vol 899 ◽  
pp. 733-738
Author(s):  
Nataly V. Kostromina ◽  
Yu.V. Olikhova ◽  
S.S. Malakhovskii ◽  
I.Yu. Gorbunova
Keyword(s):  
Carbon Fiber ◽  
Epoxy Resins ◽  
High Strength ◽  
Epoxy Oligomer ◽  
Curing Temperature ◽  
Curing Agent ◽  
Pot Life ◽  
Modified Epoxy

A curing system has been developed for obtaining high-strength compositions matrix, which is used in the production of composites based on reinforced carbon fiber using prepreg technology with a curing temperature of . A technology has been developed for combining an epoxy oligomer with a curing agent and modifier. The pot life of the prepared prepregs is at least 15 days.

Study on a Novel Soften Curing Agent for Toughening Epoxy Resins

2012 ◽  
Vol 557-559 ◽  
pp. 224-227
Author(s):  
Chun Hua Lou ◽  
Jian Xin Wang ◽  
Li Qun Ma ◽  
Zhao Hui Chen
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resins ◽  
Epoxy Group ◽  
Curing Agent ◽  
Butyl Ether ◽  
Ft Ir ◽  
Ir Analysis ◽  
The Impact ◽  
Better Than ◽  
Phenylene Diamine

A new soften curing agent for toughening epoxy resins was synthesized by m-phenylene diamine modified with epoxypropyl butyl ether. Fourier transform infrared (FT-IR) analysis showed that the longer the reaction time was, the smaller the absorption peaks of epoxy group were. The results of the mechanical properties demonstrated that the impact property of the epoxy resin cured by modified m-phenylene diamine at the moderate temperature was better than that of cured by un-modified one because of the introduction of soft ether chain.

Preparation and mechanical properties of thermosetting epoxy foams based on epoxy/ 2-ethyl-4-methylimidazol system with different curing agent contents

2017 ◽  
Vol 53 (6) ◽  
pp. 663-681 ◽  
Author(s):  
Jiantong Li ◽  
Guangcheng Zhang ◽  
Xiaolong Fan ◽  
Xun Fan ◽  
Lisheng Zhou ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Tensile Modulus ◽  
Crosslinking Density ◽  
Curing Agent ◽  
Foaming Process ◽  
Lower Tensile Strength ◽  
Scanning Electron ◽  
Thermosetting Epoxy

Epoxy/2-ethyl-4-methylimidazol system with different curing agent content was completely cured for foaming, and the effect of a systematic variation in 2-ethyl-4-methylimidazol content on the crosslinking density of cured epoxy resins was investigated. It was found that the crosslinking density of completed cured epoxy reduced as the 2-ethyl-4-methylimidazol content increased in certain range of contents (10–50 mol%). Then the precursors were foamed by a batch foaming process with supercritical carbon dioxide. The cellular morphologies of foamed epoxy resins were analyzed by scanning electron microscopy. The results revealed that the reduced crosslinking density would improve the foamability of cured epoxy resin. The microcellular epoxy foams could be obtained by maintaining a moderate crosslinking density, which can be controlled by varying 2-ethyl-4-methylimidazol content. For the completely cured epoxy with different curing agent content, when the crosslinking density of epoxy resin was 232.40 mol m–3 (the 2-ethyl-4-methylimidazol content was 35 mol%) or lower, microcellular structure was obtained by adjusting the foaming conditions. The effects of foaming on the mechanical properties were also discussed. The results indicated that microcellular epoxy foams had higher impact strength but lower tensile strength and tensile modulus, validating that the introduction of microcellular structure in epoxy matrix was conducive to the improvement of the ductility of epoxy foams.

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