Lightweight, Fire‐Retardant, and Anti‐Compressed Honeycombed‐Like Carbon Aerogels for Thermal Management and High‐Efficiency Electromagnetic Absorbing Properties

Small ◽  
2021 ◽  
pp. 2102032
Author(s):  
Jia Xu ◽  
Xiao Zhang ◽  
Zhibo Zhao ◽  
Hui Hu ◽  
Bei Li ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Efficiency ◽  
Fire Retardant ◽  
Carbon Aerogels

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Construction of 3D interconnected diamond networks in Al-matrix composite for high-efficiency thermal management

2020 ◽  
Vol 380 ◽  
pp. 122551 ◽  
Author(s):  
Long Zhang ◽  
Qiuping Wei ◽  
Junjie An ◽  
Li Ma ◽  
Kechao Zhou ◽  
...  
Keyword(s):  
Thermal Management ◽  
Matrix Composite ◽  
High Efficiency ◽  
Al Matrix Composite ◽  
Al Matrix

scholarly journals High efficiency, low offset voltage InGaP/GaAs power heterostructure-emitter bipolar transistors with advanced thermal management

2003 ◽  
Vol 50 (10) ◽  
pp. 2154-2158 ◽  
Author(s):  
Bei-Ping Yan ◽  
E.S. Yang ◽  
Yue-Fei Yang ◽  
Xiao-Qin Wang ◽  
Chung-Chi Hsu
Keyword(s):  
Thermal Management ◽  
High Efficiency ◽  
Bipolar Transistors ◽  
Offset Voltage ◽  
Low Offset

scholarly journals Hyperbolic graphene framework with optimum efficiency for conductive composites

2021 ◽  
Author(s):  
Xiaoting Liu ◽  
Kai Pang ◽  
Yingjun Liu ◽  
Chao Gao ◽  
Zhen Xu
Keyword(s):  
Thermal Management ◽  
Structural Design ◽  
Design Space ◽  
High Efficiency ◽  
Conductive Filler ◽  
Face To Face ◽  
Conductive Composites ◽  
Electrical Conductivities ◽  
Thermally Conductive ◽  
Multifunctional Nanocomposites

Abstract Constructing conductive filler networks with high efficiency is essential to fabricating functional polymer composites. Although two-dimensional (2D) sheets have prevailed in nanocomposites, their efficiency in enhancing conductive functions seems to reach the limit, as if merely addressing the dispersion homogeneity. Here, we exploit the unrecognized geometrical curvature of 2D sheets to break the efficiency limit of filler systems. The hyperbolic curvature meditates the incompatibility between 2D topology and 3D filler space and holds the efficient conductive path through face-to-face contact. The hyperbolic graphene framework exhibits the record efficiency in enhancing electrically and thermally conductive functions of nanocomposites. At volume loading of only 1.6%, the thermal and electrical conductivities reach 31.6 W/(mK) and 13,911 S/m, respectively. Nanocomposites with hyperbolic graphene framework exhibit great potentials in thermal management, sensing and electromagnetic shielding. Our work presents a geometrically optimal filler system to break the efficiency limit of multifunctional nanocomposites and broadens the structural design space of 2D sheets by curvature modulation to meet more applications.

scholarly journals INVESTIGATION THE FIRE HAZARD OF PLYWOODS USING A CONE CALORIMETER

Wood Research ◽  
2021 ◽  
Vol 66 (6) ◽  
pp. 933-942
Author(s):  
ZHIGANG WU ◽  
XUE DENG ◽  
LIFEN LI ◽  
LIPING YU ◽  
JIE CHEN ◽  
...  
Keyword(s):  
Oxygen Consumption ◽  
Heat Release ◽  
Heat Release Rate ◽  
Release Rate ◽  
Cone Calorimeter ◽  
High Efficiency ◽  
Fire Hazard ◽  
Mass Loss Rate ◽  
Fire Retardant ◽  
Safety Level

A high-efficiency fire retardant composition was prepared with dicyandiamide, phosphoric acid, boric acid, borax, urea and magnesium sulfate and it was used to process veneers which were then to prepare the plywood. Meanwhile, heat release and smoke release from combustion of plywood were tested by a cone calorimeter, including heat release rate, mass loss rate, CO yield, CO2 yield and oxygen consumption. Results showed that the plywood with this fire retardant treatment had the better flame-retardant performance and smoke suppression effect as well as the stronger char-forming capability compared to plywood without fire retardant treatment. The average heat release rate, total heat release, average effective heat of combustion, total smoke release, CO yield and oxygen consumption of the plywood with fire retardant treatment were decreased by 63.72%, 91.94%, 53.70%, 76.81%, 84.99% and 91.86%, respectively. Moreover, the fire growth index of plywood treated by fire retardant was relatively low (3.454 kW·m-2·s-1) and it took longer time to reach the peak heat release rate, accompanied with slow fire spreading. The fire performance index was relatively high (0.136 s·m2·kW-1) and it took longer time to be ignited, thus leaving a long time for escaping at fire accidents. The fire hazard of plywood with fire retardant treatment was low, and its safety level was high.

Thermal Analysis of High Efficiency High Speed Drives

2019 ◽  
Author(s):  
Yasmin Khakpour ◽  
Weilun Warren Chen ◽  
Parikshith Channegowda ◽  
Matthew R. Pearson ◽  
Yongduk Lee ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
High Speed ◽  
High Efficiency ◽  
Management Strategies ◽  
Substantial Reduction ◽  
Operating Conditions ◽  
Heat Conducting

Abstract The thermal management of the PCB based power electronics is a key element to ensure safe operating conditions and to meet lifetime, reliability and safety requirements. This is challenging for applications above 1 kW because the substrate material used in a PCB such as FR-4 has very low heat conducting properties. Hence, there is a limit on how much loss can be dissipated from the board and for that reason this approach has only been adopted in the industry for very low power applications. With the proposed multilevel topology, WBG devices, and innovative thermal management strategies it is possible to expand the PCB based power electronics approach to power ratings between 1kW and 10 kW. For instance, an improvement in the thermal resistance of the PCB can be obtained by soldering a discrete WBG device with a TO-263 package directly on a PCB with about one inch square copper area around the device which will act as a heat spreader. Then, a further substantial reduction in the thermal resistance of a PCB is possible by the application of electrical vias. In principle each via is a copper sleeve through the board or through a part of the board. Where, instead of using its electrical function, a via can also be used as a thermal conductor. In this work, the thermal analysis of the PCB and the effect of number of vias as well as the effect of filling the vias with a thermally conductive material has been studied. The design has been optimized for the number of vias and the modeling results have been verified with experimental tests.

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