Effects of “Office of the Future” Technology on Users: Results of a Longitudinal Field Study

1982 ◽  
pp. 191-210 ◽  
Author(s):  
B. A. Gutek
Keyword(s):  
Field Study ◽  
Longitudinal Field ◽  
Future Technology ◽  
The Future

Investigating the Unified Motive Scales

2020 ◽  
pp. 1-5
Author(s):  
Martin Bettschart ◽  
Marcel Herrmann ◽  
Benjamin M. Wolf ◽  
Veronika Brandstätter
Keyword(s):  
Field Study ◽  
Predictive Validity ◽  
Selection Process ◽  
Police Department ◽  
Longitudinal Field ◽  
Explicit Motives ◽  
Achievement Motive

Abstract. Explicit motives are well-studied in the field of personality and motivation psychology. However, the statistical overlap of different explicit motive measures is only moderate. As a consequence, the Unified Motive Scales (UMS; Schönbrodt & Gerstenberg, 2012 ) were developed to improve the measurement of explicit motives. The present longitudinal field study examined the predictive validity of the UMS achievement motive subscale. Applicants of a police department ( n = 168, Mage = 25.11, 53 females and 115 males) completed the UMS and their performance in the selection process was assessed. As expected, UMS achievement predicted success in the selection process. The findings provide first evidence for the predictive validity of UMS achievement in an applied setting.

Positive and negative self-efficacy effects revisited: A longitudinal field study

2010 ◽  
Author(s):  
Shuhua Sun ◽  
Zhaoli Song ◽  
Vivien Kim Geok Lim ◽  
Don J. Q. Chen ◽  
Xian Li
Keyword(s):  
Field Study ◽  
Self Efficacy ◽  
Longitudinal Field

Cognitive development and tonal systems of Greek language: A comparative longitudinal field study

2011 ◽  
Author(s):  
Thalis N. Papadakis ◽  
Evdokia Lagakou ◽  
Christina Terlidou ◽  
Dimitra Vekiari ◽  
Ioannis K. Tsegos
Keyword(s):  
Cognitive Development ◽  
Field Study ◽  
Longitudinal Field ◽  
Greek Language

Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”

2006 ◽  
Vol 970 ◽  
Author(s):  
Manabu Bonkohara ◽  
Makoto Motoyoshi ◽  
Kazutoshi Kamibayashi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Three Dimensional ◽  
Process Time ◽  
Future Technology ◽  
Sensor Device ◽  
Research Level ◽  
Key Technologies ◽  
The Future ◽  
Chip Size ◽  
On Chip ◽  
Chip Chip

ABSTRACTRecently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current and the future 3D-LSI technologies which we have considered and imagined. The current technology is taken our Chip Size Package (CSP) for sensor device, for instance. In the future technology, there are the five key technologies are described. And considering con and pro of the current 3D LSI stacked approach, such as CoC (Chip on Chip), CoW (Chip on Wafer) and WoW (Wafer on Wafer), We confirmed that CoW combined with Super-Smart-Stack (SSS™) technology will shorten the process time per chip at the same level as WoW approach and is effective to minimize process cost.

Biased memory for prior decision making: Evidence from a longitudinal field study

2006 ◽  
Vol 99 (1) ◽  
pp. 34-48 ◽  
Author(s):  
Rik Pieters ◽  
Hans Baumgartner ◽  
Richard Bagozzi
Keyword(s):  
Decision Making ◽  
Field Study ◽  
Longitudinal Field ◽  
Prior Decision
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