An Extraction Method of SiC Power MOSFET Threshold Voltage

Author(s):  
W. Jouha ◽  
A. El Oualkadi ◽  
P. Dherbécourt ◽  
E. Joubert ◽  
M. Masmoudi
2007 ◽  
Vol 54 (4) ◽  
pp. 833-839 ◽  
Author(s):  
Qi Wang ◽  
Minhua Li ◽  
Joelle Sharp ◽  
Ashok Challa

2019 ◽  
Vol 14 (1) ◽  
pp. 1-6
Author(s):  
Li�gia Martins d'Oliveira ◽  
Valeriya Kilchytska ◽  
Denis Flandre ◽  
Michelly De Souza

This paper proposes a curve extraction method for I-V curves and analog figures-of-merit of self-cascode MOSFET associations (SC) using a code that exploits I-V curves of single transistors as input. The method was validated by using experimental measurements of fabricated SC and the very single transistors that compose them. The results indicate a very low error between the SC generated by the code and the measured reference for operation in saturation regime and above threshold voltage, for both the I-V curves and their derivatives. This method is then valid for the assessment of the SC structures in new technologies, avoiding experimental dedicated layouts or complex set-ups.


2018 ◽  
Vol 33 (11) ◽  
pp. 9130-9133 ◽  
Author(s):  
Wadia Jouha ◽  
Ahmed El Oualkadi ◽  
Pascal Dherbecourt ◽  
Eric Joubert ◽  
Mohamed Masmoudi

2019 ◽  
Vol 41 (8) ◽  
pp. 203-214 ◽  
Author(s):  
Aivars Lelis ◽  
Ronald Green ◽  
Daniel Habersat

Author(s):  
G. Espineira ◽  
A. J. Garcia-Loureiro ◽  
N. Seoane

2012 ◽  
Vol 268-270 ◽  
pp. 1361-1364
Author(s):  
Shen Li Chen ◽  
Wen Ming Lee

The electrostatic discharge (ESD) reliabilities in different power MOSFETs will be investigated in this paper. From the experimental results, ESD zap pulses at the gate terminal will cause electrons or holes trap in the gate oxide and loss the Si-SiO2 interface integrity, especially for the 100V nDEMOS, 200V nDEMOS, and IRF640, in which they do not have any ESD protection strategy. Electrons or holes trapped in the gate SiO2 layer will be caused the transconductance (Gm) or threshold voltage (Vth) of a MOSFET increasing or reduction, and which is resulted from electron mobility degradation. The RFW2N06RLE and RLD03N06CLE power VDMOS ICs, which with different kinds of ESD protection circuit, are less influenced by ESD pulses experimentally.


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