Application II: Solder Joints Under Temperature and Mechanical Load Cycles

Author(s):  
Mohd N. Tamin ◽  
Norhashimah M. Shaffiar
Author(s):  
Tannaz Harirchian ◽  
Zuyang Frank Liang ◽  
Kyle Yazzie ◽  
Michael A. Schroeder ◽  
Ashish Gupta ◽  
...  

Use of Thermal Interface Materials (TIM) is a common thermal solution approach in handheld devices to reduce junction temperature and control device skin temperature. This work summarizes the thermal benefits of using a TIM for enhancing the user experience and increasing System on Chip (SoC) performance. On the other hand, TIM induces a load on the package which in turn can impose stress on the package solder joints. This paper explains the impact of a variety of parameters such as TIM material and thickness and system boundary conditions on thermal performance of the SoC/system and the load distribution on solder joints. The complexity of mechanical load distribution is discussed through extensive data collection and simulation in phone and tablet form factors. Design guidelines for selection of appropriate TIM are proposed to improve the thermal performance without compromising the reliability of the SoC package.


2018 ◽  
Author(s):  
Grischa Bratke ◽  
Steffen Willwacher ◽  
David Maintz ◽  
Gert-Peter Brüggemann

2019 ◽  
Vol 85 (1(I)) ◽  
pp. 35-44
Author(s):  
S. G. Sandomirski

The main magnetic parameters sensitive to the structure of steels are the parameters of their saturation loop of magnetic hysteresis: the coercive force Hcs and remanent magnetization Mrs. The saturation magnetization or saturation intensity Mr is most sensitive to the phase composition of steels. The variety of steel grades and modes of technological treatment (e.g., heat treatment, mechanical load) determined the use of magnetic structurescopy and magnetic characteristics — the coercive force Hc, remanent magnetization Mr , and specific hysteresis losses Wh on the subloops of the magnetic hysteresis of steels — as control parameters in diagnostics of the stressed and structural states of steel structures and pipelines. It has been shown that changes in Hc, Mr , and Wh are more sensitive to structural stresses and structures of steels than the parameters of the saturation hysteresis loop of magnetic hysteresis (Hcs, Mrs, and Mrs). The formulas for calculating Hc, Mr and Wh are presented to be used for estimation of changes in the parameters upon heat treatment of steels. Features of the structural sensitivity of the subloop characteristics and expediency of their use for magnetic structural and phase analyzes are determined. Thus, the range of changes in Ìr attributed to the structural changes in steels upon gradual Hm decrease is many times wider compared to the range of possible changes in Mrs under the same conditions. Conditions (relations between the magnetic parameters) and recommendations regarding the choice of the field strength Hm are given which provide the justified use of Hc, Mr and Wh parameters in magnetic structurescopy


2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.


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