Preparation of SCA Attacks: Successfully Decapsulating BGA Packages

2016 ◽  
pp. 240-247 ◽  
Author(s):  
Christian Wittke ◽  
Zoya Dyka ◽  
Oliver Skibitzki ◽  
Peter Langendoerfer
Keyword(s):  
Bga Packages

In-Situ Mechanical Sample Preparation of Selected Sites and Components on Large Modules and Boards

2016 ◽  
Author(s):  
Jim Colvin ◽  
Timothy Hazeldine ◽  
Heenal Patel
Keyword(s):  
Sample Preparation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Tilt Table ◽  
Standard Requirement ◽  
Open Design ◽  
Bga Packages ◽  
Silicon Thickness ◽  
Board Level

Abstract The standard requirement for FA Engineers needing to remove components from a board, prior to decapsulation or sample preparation, is shown to be greatly reduced, by the methods discussed here. By using a mechanical selected area preparation system with an open-design it is possible to reach all required areas of a large printed circuit board (PCB) or module to prepare a single component ‘in situ’. This makes subsequent optical or electrical testing faster and often more convenient to accomplish. Electronic End-pointing and 3D curvature compensation methods can often be used in parallel with sample prep techniques to further improve the consistency and efficacy of the decapsulation and thinning uniformity and final remaining silicon thickness (RST). Board level prep eliminates the worry of rework removal of BGA packages and the subsequent risk of damage to the device. Since the entire board is mounted, the contamination is restricted to the die surface and can be kept from the underside ball connections unlike current liquid immersion methods of package thinning or delayering. Since the camera is in line with the abrasion interface, imaging is real time during the entire milling and thinning process. Recent advances in automated tilt-table design have meant that a specific component’s angular orientation can be optimized for sample preparation. Improved tilt table technology also allows for improved mounting capability for boards of many types and sizes. The paper describes methods for decapsulation, thinning and backside polishing of a part ‘in situ’ on the polishing machine and allows the system to operate as a probe station for monitoring electrical characteristics while thinning. Considerations for designing board-level workholders are described – for boards that that are populated with components on one or even both sides. Using the techniques described, the quality of sample preparation and control is on a par with the processing of single package-level devices.

Electronic Package Failure Analysis Using TDR

2000 ◽  
Author(s):  
Dima A. Smolyansky
Keyword(s):  
Failure Analysis ◽  
Fault Location ◽  
Measurement Accuracy ◽  
Time Domain Reflectometry ◽  
Acoustic Imaging ◽  
X Ray ◽  
Analysis Techniques ◽  
Bga Packages ◽  
Impedance Profile ◽  
Nature Of Time

Abstract The visual nature of Time Domain Reflectometry (TDR) makes it a very natural technology that can assist with fault location in BGA packages, which typically have complex interweaving layouts that make standard failure analysis techniques, such as acoustic imaging and X-ray, less effective and more difficult to utilize. This article discusses the use of TDR for package failure analysis work. It analyzes in detail the TDR impedance deconvolution algorithm as applicable to electronic packaging fault location work, focusing on the opportunities that impedance deconvolution and the resulting true impedance profile opens up for such work. The article examines the TDR measurement accuracy and the comparative package failure analysis, and presents three main considerations for package failure analysis. It also touches upon the goal and the task of the failure analysts and TDR's specific signatures for the open and short connections.

Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

1999 ◽  
Vol 28 (11) ◽  
pp. 1231-1237 ◽  
Author(s):  
C. E. Ho ◽  
Y. M. Chen ◽  
C. R. Kao
Keyword(s):  
Reaction Kinetics ◽  
Reflow Soldering ◽  
Bga Packages ◽  
Solder Balls ◽  
Kinetics Of

Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation

2021 ◽  
Author(s):  
Joonsang Park ◽  
Minsu Kim ◽  
Seongguk Kim ◽  
Keeyoung Son ◽  
Taein Shin ◽  
...  
Keyword(s):  
Reinforcement Learning ◽  
Signal Integrity ◽  
Graph Representation ◽  
Bga Packages

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

2000 ◽  
Author(s):  
Jenn-Jiang Hwang ◽  
Chung-Hsing Chao
Keyword(s):  
Heat Sink ◽  
Power Dissipation ◽  
Thermal Characterization ◽  
Junction Temperature ◽  
Pin Fin ◽  
Bga Packages ◽  
Plastic Ball ◽  
Bga Package ◽  
Foam Metal ◽  
Forced Air

Abstract This study reported thermal performance of a thermally enhanced plastic ball grid array (PBGA), namely T2-BGA™ which incorporates a heat slug in package, with a foam-metal heat sink on the top of this package. Experimental measurement of junction-to-ambient thermal resistance is performed in accordance with the SEMI standards of G38-0996 and G42-0996 for thermal characterization of BGA packages. Allowable power dissipation is subject to the constraint of junction temperature (Tj) at 95°C and ambient temperature (Ta) in chassis at 35 °C under free and forced air (0 ∼ 3 m/s) conditions. Based on this constraint, allowable power dissipation of a regular PBGA with a commercial pin fin heat sink under free and 3 m/s forced air is 5.45 W and 9.17 W compared with those of T2-BGA with a foam heat sink of 6.80 W and 19.6 W respectively. This results show that T2-BGA™ with a foam heat sink offers enormous potential to high power package applications.

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