Single-crystal Fe-bearing sphalerite: synthesis, lattice parameter, thermal expansion coefficient and microhardness

2016 ◽  
Vol 44 (4) ◽  
pp. 287-296 ◽  
Author(s):  
Dmitriy A. Chareev ◽  
Valentin O. Osadchii ◽  
Andrey A. Shiryaev ◽  
Alexey N. Nekrasov ◽  
Anatolii V. Koshelev ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Single Crystal ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Lattice Parameter

Reduction in Wear Rate of α-Alumina and Silicon Nitride by Diffusional Surface Modification

1988 ◽  
Vol 140 ◽  
Author(s):  
A.K. Gangopadhyay ◽  
M.E. Fine ◽  
H.S. Cheng
Keyword(s):  
Wear Resistance ◽  
Thermal Expansion ◽  
Surface Modification ◽  
Silicon Nitride ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Surface Region ◽  
Lattice Parameter ◽  
Lower Thermal Expansion ◽  
Wear Modes

AbstractThe surface regions of α-alumina and hot pressed silicon nitride were modified by suitable alloying in order to improve their wear resistance. The surface modification in polycrystalline α-alumina was done by diffusing chromia into the surface region which resulted in the formation of a thin layer of A12O3 - Cr9O3 solid solution which has a lower thermal expansion coefficient than pure α-alumina. Also Cr2O3 has a larger lattice parameter than α-alumina thus during cooling the surface was put into compression. The surface region of hot pressed silicon nitride was modified by diffusing α-alumina into the surface which resulted in the formation of a thin sialon layer. A surface compressive stress was again introduced due to the lower thermal expansion coefficient and larger latticeparameter of sialon compared to silicon nitride.Wear tests were conducted against 52100 steel under both lubricated and unlubricated sliding contact using a block on ring apparatus. The wear resistance of chromia surface alloyed α-alumina was improved considerably over unalloyed α-alumina under both lubricated and unlubricated conditions. The wear resistance of alumina surface alloyed silicon nitride was also improved over unalloyed silicon nitride under both lubricated and unlubricated conditions.Different wear modes were identified by examining the worn surfaces under the scanning electron microscope.

Measurement of thermal expansion coefficient of substrate GGG and its epitaxial layer YIG

1999 ◽  
Vol 14 (1) ◽  
pp. 2-4 ◽  
Author(s):  
Rui-sheng Liang ◽  
Feng-chao Liu
Keyword(s):  
Thin Film ◽  
Thermal Expansion ◽  
Single Crystal ◽  
Thermal Expansion Coefficient ◽  
Epitaxial Layer ◽  
Expansion Coefficient ◽  
Linear Thermal Expansion ◽  
New Method ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

A new method is used in measuring the linear thermal expansion coefficients in composite consisting of a substrate Gd3Ga2Ga3O12 (GGG) and its epitaxial layer Y3Fe2Fe3O12 (YIG) within the temperature range 13.88 °C–32.50 °C. The results show that the thermal expansion coefficient of GGG in composite is larger than that of the GGG in single crystal; the thermal expansion coefficient of thick film YIG is also larger than that of thin film. The results also show that the thermal expansion coefficient of a composite consisting of film and its substrate can be measured by using a new method.

Thermal expansion coefficients of a binary alloy Ni80Zr20 at elevated temperatures

1984 ◽  
Vol 17 (5) ◽  
pp. 359-360
Author(s):  
S. K. Shadangi ◽  
U. K. Shadangi ◽  
S. C. Panda
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Elevated Temperatures ◽  
Intermetallic Phase ◽  
Lattice Parameter ◽  
Solid Solution Phase ◽  
Linear Variation ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

The Debye–Scherrer pattern of the alloy Ni80Zr20 clearly shows the presence of a nickel solid-solution phase along with a new intermetallic phase Ni23Zr6, which seems to be isostructural with the Co23Zr6 phase. The thermal expansion coefficient of the Ni23Zr6 phase has been investigated in the temperature range 1003–1493 K. Linear variation of lattice parameter with temperature has been observed. The thermal expansion coefficient remains almost constant throughout this temperature interval.

Thermal Expansion Coefficient of Synthetic Diamond Single Crystal at Low Temperatures

1992 ◽  
Vol 31 (Part 1, No. 8) ◽  
pp. 2527-2529 ◽  
Author(s):  
Katsuji Haruna ◽  
Hiroshi Maeta ◽  
Kazutoshi Ohashi ◽  
Takuro Koike
Keyword(s):  
Thermal Expansion ◽  
Single Crystal ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Low Temperatures ◽  
Synthetic Diamond ◽  
Diamond Single Crystal

SIZE AND TEMPERATURE EFFECT ON THERMAL EXPANSION COEFFICIENT AND LATTICE PARAMETER OF NANOMATERIALS

2013 ◽  
Vol 27 (25) ◽  
pp. 1350180 ◽  
Author(s):  
RAGHUVESH KUMAR ◽  
GEETA SHARMA ◽  
MUNISH KUMAR
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Temperature Dependence ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Size Dependence ◽  
Coefficient Of Thermal Expansion ◽  
Lattice Parameter ◽  
Model Predictions ◽  
Good Agreement

A simple theoretical model is developed to study the effect of size and temperature on the coefficient of thermal expansion and lattice parameter of nanomaterials. We have studied the size dependence of thermal expansion coefficient of Pb , Ag and Zn in different shape viz. spherical, nanowire and nanofilm. A good agreement between theory and available experimental data confirmed the model predictions. We have used these results to study the temperature dependence of lattice parameter for different size and also included the results of bulk materials. The temperature dependence of lattice parameter of Zn nanowire and Ag nanowire are found to present a good agreement with the experimental data. We have also computed the temperature and size dependence of lattice parameter of Se and Pb for different shape viz. spherical, nanowire and nanofilm. The results are discussed in the light of recent research on nanomaterials.

Influence of thermal expansion on the lattice parameter of silicon

1994 ◽  
Vol 9 (4) ◽  
pp. 260-264 ◽  
Author(s):  
Fengchao Liu
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Lattice Parameter ◽  
Ambient Conditions ◽  
Best Value

Considering the thermal expansion of silicon at ambient conditions, the lattice parameter will change 0.00032 Å for a 10 °C range. This range is measurable with modern diffraction instrumentation illustrating the importance of knowing the accurate lattice parameter, the temperature of measurement, and the thermal expansion coefficient. The best value for the expansion coefficient is 2.45×10−6/°C.

Variation of the lattice parameter and thermal expansion coefficient of (U,Dy)O2 as a function of DyO1.5 content

2006 ◽  
Vol 407 (1-2) ◽  
pp. 263-267 ◽  
Author(s):  
Si-Hyung Kim ◽  
Han-Soo Kim ◽  
Young-Woo Lee ◽  
Dong-Seong Sohn ◽  
Dong-Soo Suhr
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Lattice Parameter
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