Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface

Microelectronics Reliability ◽

10.1016/j.microrel.2013.09.005 ◽

2014 ◽

Vol 54 (1) ◽

pp. 252-258 ◽

Author(s):

Jun Shen ◽

Zhongming Cao ◽

Dajun Zhai ◽

Mali Zhao ◽

Peipei He

Keyword(s):

Growth Rate ◽

Intermetallic Compound ◽

Isothermal Aging ◽

Lead Free ◽

Density Current ◽

Low Density ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

Free Solder ◽

Solder Interface

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Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Journal of Materials Science ◽

10.1007/s10853-018-2907-y ◽

2018 ◽

Vol 54 (2) ◽

pp. 1741-1768 ◽

Author(s):

Ming-yue Xiong ◽

Liang Zhang

Keyword(s):

Intermetallic Compound ◽

Electronic Packaging ◽

Solder Joints ◽

Interface Reaction ◽

Growth Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

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Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

Journal of Material Science and Technology ◽

10.1016/s1005-0302(11)60136-9 ◽

2011 ◽

Vol 27 (8) ◽

pp. 741-745 ◽

Author(s):

T.Y. Kang ◽

Y.Y. Xiu ◽

L. Hui ◽

J.J. Wang ◽

W.P. Tong ◽

...

Keyword(s):

Intermetallic Compound ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

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Effect of 0.05% Cr on intermetallic compound layer growth for Sn-Ag-Cu Lead-free Solder joint during isothermal aging

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232623 ◽

2009 ◽

Author(s):

Guobiao Su ◽

Yongjiu Han ◽

Chunyan Wang ◽

Hongbin Wang ◽

Xicheng Wei

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Isothermal Aging ◽

Compound Layer ◽

Layer Growth ◽

Lead Free ◽

Intermetallic Compound Layer ◽

Lead Free Solder ◽

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Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Microelectronics Reliability ◽

10.1016/j.microrel.2019.05.019 ◽

2019 ◽

Vol 99 ◽

pp. 62-73 ◽

Author(s):

Junghwan Bang ◽

Dong-Yurl Yu ◽

Yong-Ho Ko ◽

Jun-Hyuk Son ◽

Hiroshi Nishikawa ◽

...

Keyword(s):

Intermetallic Compound ◽

Lead Free ◽

Lead Free Solder ◽

Cu Substrate ◽

Intermetallic Compound Growth ◽

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Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

ACS Applied Materials & Interfaces ◽

10.1021/acsami.5b11903 ◽

2016 ◽

Vol 8 (8) ◽

pp. 5679-5686 ◽

Author(s):

Yong-Ho Ko ◽

Jong-Dae Lee ◽

Taeshik Yoon ◽

Chang-Woo Lee ◽

Taek-Soo Kim

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Interfacial Reactions ◽

Lead Free ◽

Layer By Layer ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

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Electromigration Effect on Kinetics of Cu–Sn Intermetallic Compound Growth in Lead-Free Solder Joint

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2017.2766447 ◽

2017 ◽

Vol 17 (4) ◽

pp. 773-779 ◽

Author(s):

Z. W. Fu ◽

B. Zhou ◽

R. H. Yao ◽

Y. R. Liu ◽

X. P. Li

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

Electromigration Effect ◽

Free Solder ◽

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Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors

2008 31st International Spring Seminar on Electronics Technology ◽

10.1109/isse.2008.5276481 ◽

2008 ◽

Author(s):

Silke Bramlage ◽

Klaus-Jurgen Wolter

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

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Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

International Journal of Minerals Metallurgy and Materials ◽

10.1007/s12613-013-0810-8 ◽

2013 ◽

Vol 20 (9) ◽

pp. 883-889 ◽

Author(s):

Guo-qiang Wei ◽

Lei Wang ◽

Xin-qiang Peng ◽

Ming-yang Xue

Keyword(s):

Shear Strength ◽

Intermetallic Compound ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

Interfacial Intermetallic Compound ◽

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Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

Journal of Materials Science ◽

10.1007/s10853-006-4501-y ◽

2006 ◽

Vol 41 (8) ◽

pp. 2359-2364 ◽

Author(s):

Yanghua Xia ◽

Xiaoming Xie ◽

Xiaoming Xie ◽

Chuanyan Lu

Keyword(s):

Intermetallic Compounds ◽

Isothermal Aging ◽

Lead Free ◽

Lead Free Solder ◽

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Isothermal Aging Dependent Anand Parameters of SAC305 Lead Free Solder at Extreme High Temperatures

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190596 ◽

2020 ◽

Author(s):

KM Rafidh Hassan ◽

Mohammad S. Alam ◽

Jing Wu ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

High Temperatures ◽

Isothermal Aging ◽

Lead Free ◽

Lead Free Solder ◽

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