(La0.8Sr0.2)MnO3-Ni composite for the interconnect of solid oxide cells: effect of starting Ni particle size on sintering and electrical properties

2021 ◽  
Vol 56 (31) ◽  
pp. 17721-17731
Author(s):  
Fen Qin ◽  
Anqi Wang ◽  
Jong-Sung Park ◽  
Sun-Dong Kim ◽  
Sang Kook Woo ◽  
...  
Keyword(s):  
Particle Size ◽  
Electrical Properties ◽  
Solid Oxide

Relationship of Electrical Properties and Partical Size of Piezoelectric Ceramics Fabricated by Digital Light Processing 3D Printing

2021 ◽  
Author(s):  
Kai Liu ◽  
Jiaming Hu ◽  
Yusheng Shi ◽  
Chenyang Zhou ◽  
Yunfei Sun ◽  
...  
Keyword(s):  
Particle Size ◽  
Electrical Properties ◽  
3D Printing ◽  
Piezoelectric Sensor ◽  
Piezoelectric Ceramics ◽  
Particle Sizes ◽  
Digital Light Processing ◽  
Relationship Of ◽  
Partical Size ◽  
Functional Ceramics

Abstract To improve electrical properties of BaTiO3 piezoelectric ceramics fabricated by 3D printing, effects of particle sizes was investigated on rheological and curing properties of ceramic slurries, electrical properties of BaTiO3 fabricated by Digital Light Processing 3D printing method. It was found that the curing ability of ceramic slurries decreased first and then increased with the increase of particle size from 136 nm to 1486 nm, while the viscosity of the slurries kept decreasing. When the particle size in a range of submicron, the grain size of sintered ceramics decreased from 13.27 μm to 6.84 μm as particle size increasing. Immediately, the relative density, piezoelectric constant, relative permittivity and remanent polarization of sintered ceramics were measured and it turns out to reach 95.32%, 161.4 pC/N, 1512 and 7.59 uC/cm2 respectively while using the BaTiO3 powder with particle sizes of 993 nm. Finally, a cellular structural BaTiO3 ceramics was fabricated by using optimized powder and process parameters and packaged as a piezoelectric sensor, showing a good function of force-electricity conversion. These results demonstrated the feasibility of fabricating high-quality functional ceramics with designed geometry by Digital Light Processing.

Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium

2010 ◽  
Vol 25 (2) ◽  
pp. 391-395 ◽  
Author(s):  
Chien-Neng Liao ◽  
Yen-Chun Huang
Keyword(s):  
Particle Size ◽  
Reaction Time ◽  
Electrical Properties ◽  
Bismuth Telluride ◽  
Molten Solder ◽  
Thermoelectric Modules ◽  
Ag Addition ◽  
Mean Particle Size ◽  
Mechanical And Electrical Properties ◽  
The Mean

SnTe is the most common compound formed at the bismuth telluride/metal soldered junction of thermoelectric modules. It affects the mechanical and electrical properties of the soldered junction. In the study we investigate the growth of SnTe compound during reaction between molten Sn–3.5Ag solder and tellurium at 250 °C. We found that the growth of SnTe is suppressed by Ag–Te bilayer compounds that block further reaction between liquid Sn and Te. With increasing reaction time, the SnTe morphology becomes rough as a result of coarsening of SnTe grains. The growth of SnTe grains follows the conservative ripening kinetics with the mean particle size proportional to one-third power of reaction time.

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