Non-destructive Microstructural Evaluation of Intact and Restored Human Teeth Using Tabletop X-Ray $$\upmu $$ μ CT System

2017 ◽  
Vol 36 (1) ◽  
Author(s):  
A. Fatima ◽  
V. K. Kulkarni ◽  
A. K. Agrawal ◽  
N. R. Banda ◽  
P. S. Sarkar ◽  
...  
Aerospace ◽  
2021 ◽  
Vol 8 (4) ◽  
pp. 119
Author(s):  
Józef Błachnio ◽  
Marek Chalimoniuk ◽  
Artur Kułaszka ◽  
Henryk Borowczyk ◽  
Dariusz Zasada

X-ray computed tomography is more often applied in non-destructive testing the quality of construction elements significantly crucial for reliability and safety of device elements, machines and complex industrial systems. This article describes the computed tomography (CT) system used to inspect the technical condition of turbine blades of the aircraft engine. The impact of the experimental conditions on the correctness of the obtained results was determined. The appropriate selection of parameters for the experiment was given, and the correct test results of gas turbine blades were presented. Failures, manufacturing defects, material deviations of nickel-cobalt alloyed blades were identified. The thickness of walls was measured in the selected cross-sections with the accuracy of 0.01 mm, and selected manufacturing defects of cooling passages were diagnosed. It was demonstrated that the application of the CT system allows for detailed non-destructive inspection of the technical condition of machine parts. The test results proved that the X-ray computed tomography could be applied in the production and repairs of machines.


2014 ◽  
Vol 2014 (1) ◽  
pp. 000641-000646
Author(s):  
D. Laloum ◽  
C. Ribière ◽  
M. Gottardi ◽  
T. Mourier ◽  
F. Lorut ◽  
...  

3D integration is a promising technology to overcome miniaturization challenges and chips densification. It consists in increasing the number of components by realizing vertical pileups of interconnected chips. Solder balls, through silicon vias (TSVs) and copper pillars are widely used for that purpose. It is essential to characterize these metallic structures in order to validate the fabrication process and to ensure an optimal connection between the different chips. Here, X-ray tomography is proposed as a non-destructive technique to investigate metallic interconnections. In particular, the potential of an innovative computerized tomography (CT) system, the X-ray tomography hosted in a scanning electron microscope (SEM), is presented. Since sample preparation is an important step of the X-ray characterization process, the use of a Plasma Focused Ion Beam (P-FIB) to extract large chunks out of the bulk silicon is reported. We expose an original work towards systematic studies: in order to validate a new copper filling chemistry, five samples containing TSVs at various filling rates have been scanned and the 3D results are shown. Chunks containing completely filled TSVs have then been scanned and their resulting 3D reconstructions demonstrate that the instrument is able to detect 500 nm diameter voids. The advantages and limitations of this characterization method are finally pointed out.


2012 ◽  
Vol 1475 ◽  
Author(s):  
Kozo Katsuyama ◽  
Akihiro Ishimi ◽  
Koji Maeda ◽  
Tsuyoshi Nagamine ◽  
Takeo Asaga

ABSTRACTIn order to observe the structural change in the interior of irradiated fuel assembly, the non-destructive post irradiation examination technique using X-ray computer tomography (X-ray CT) was developed.In this X-ray CT system, the 12 MeV X-ray pulses were used in synchronization with the switch-in of the detector in order to minimize the effects of the gamma ray emissions from the irradiated fuel assembly then clear cross section CT image of irradiated fuel assembly could be successfully obtained. Also, this non-destructive technique can be applied to observe the inner condition of the high radioactive materials such as a radioactive waste.


Author(s):  
A. R. Lang

AbstractX-ray topography provides a non-destructive method of mapping point-by-point variations in orientation and reflecting power within crystals. The discovery, made by several workers independently, that in nearly perfect crystals it was possible to detect individual dislocations by X-ray diffraction contrast started an epoch of rapid exploitation of X-ray topography as a new, general method for assessing crystal perfection. Another discovery, that of X-ray Pendellösung, led to important theoretical developments in X-ray diffraction theory and to a new and precise method for measuring structure factors on an absolute scale. Other highlights picked out for mention are studies of Frank-Read dislocation sources, the discovery of long dislocation helices and lines of coaxial dislocation loops in aluminium, of internal magnetic domain structures in Fe-3 wt.% Si, and of stacking faults in silicon and natural diamonds.


1983 ◽  
Vol 27 ◽  
Author(s):  
L. Salamanca-Riba ◽  
B.S. Elman ◽  
M.S. Dresselhaus ◽  
T. Venkatesan

ABSTRACTRutherford backscattering spectrometry (RBS) is used to characterize the stoichiometry of graphite intercalation compounds (GIC). Specific application is made to several stages of different donor and acceptor compounds and to commensurate and incommensurate intercalants. A deviation from the theoretical stoichiometry is measured for most of the compounds using this non-destructive method. Within experimental error, the RBS results agree with those obtained from analysis of the (00ℓ) x-ray diffractograms and weight uptake measurements on the same samples.


Author(s):  
Deepak Goyal

Abstract Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.


Author(s):  
Wenbing Yun ◽  
Steve Wang ◽  
David Scott ◽  
Kenneth W. Nill ◽  
Waleed S. Haddad

Abstract A high-resolution table-sized x-ray nanotomography (XRMT) tool has been constructed that shows the promise of nondestructively imaging the internal structure of a full IC stack with a spatial resolution better than 100 nm. Such a tool can be used to detect, localize, and characterize buried defects in the IC. By collecting a set of X-ray projections through the full IC (which may include tens of micrometers of silicon substrate and several layers of Cu interconnects) and applying tomographic reconstruction algorithms to these projections, a 3D volumetric reconstruction can be obtained, and analyzed for defects using 3D visualization software. XRMT is a powerful technique that will find use in failure analysis and IC process development, and may facilitate or supplant investigations using SEM, TEM, and FIB tools, which generally require destructive sample preparation and a vacuum environment.


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