Heating rate dependence of melting peak temperature examined by DSC of heat flux type

2015 ◽  
Vol 123 (3) ◽  
pp. 1795-1808 ◽  
Author(s):  
Akihiko Toda
2012 ◽  
Vol 512-515 ◽  
pp. 375-378
Author(s):  
Su Wen Yang ◽  
Jian Min Yi ◽  
Ke Qiang Qiu ◽  
Xin Deng ◽  
Jian Shan Chen

This thesis does thermal gravimetric analysis(TGA)studies on Chinese fir sawdust biomass by integrated thermal analyzer under vacuum conditions. Through the analysis on lostmass curve at different heating rate of 10, 15, 20 and 30°C/min, we found the process of Chinese fir sawdust vacuum pyrolysis can be mainly divided into three stages: evaporation of free water and combined water desorption, rapid lostmass of pyrolysis and slow decomposition of residues. The lostmass major temperature range is between 250 ~ 450°C, the peak temperature is between 365 ~ 400°C. When the pyrolysis temperature is 500°C, vacuum pyrolysis reaction of Chinese fir sawdust has basically completed. As the heating rate rises, the lostmass curve is moving to the right, the peak temperature is shifting to higher temperature, and the temperature range of thermal decomposition reaction widens significantly. According to experimental datas, we tried to obtain the vacuum pyrolysis dynamic parameters of Chinese fir sawdust, and the results are that the apparent activation energy of vacuum pyrolysis reaction of Chinese fir sawdust biomass is 128.34kJ/mol, with the pre-exponential factor being 6.42×109 and reaction order being 1.08, similar to first order reaction.


2021 ◽  
pp. 2140015
Author(s):  
Min Miao ◽  
Hao Zhang ◽  
Hejie Yu ◽  
Lili Cao

With the increasing flourishing of miniaturized, multifunctional, and heterogeneously integrated system in package (SiP), heating problem is becoming more and more serious. In this paper, to meet the heat dissipation needs of the chips thus assembled and to achieve effective thermal management, linear, serpent and spiral shaped microchannel heat sinks were designed and fabricated into copper substrate by electrical discharge machining (EDM) and precision machining technology, acting both as the cooler and mounting base for passive and active SiP interposers. A test platform was set up to characterize the heat dissipation performance of the copper-based microchannel heat sink. The experimental and simulation results show that heat dissipation rate increases with the increasing heat flux density in the range 5–30 W/cm2 for the three microchannel designs, and the peak temperature can all be kept below 340 K (67[Formula: see text]C) even for the highest heat flux. The three designs are compared from the perspective of peak temperature, temperature distribution uniformity and pressure drop. In all, the solution proposed hereby provides a new and optimal option for in-situ cooling for densely integrated electronic hardware.


2020 ◽  
pp. 157832
Author(s):  
Yohei Nomura ◽  
Jun Uzuhashi ◽  
Tatsuya Tomita ◽  
Toru Takahashi ◽  
Hidenori Kuwata ◽  
...  

2020 ◽  
Vol 124 (49) ◽  
pp. 26699-26713
Author(s):  
Tyler L. Spano ◽  
Jennifer L. Niedziela ◽  
Ashley E. Shields ◽  
Joanna McFarlane ◽  
Alex Zirakparvar ◽  
...  

2014 ◽  
Vol 126 ◽  
pp. 81-84 ◽  
Author(s):  
Jianjun Pang ◽  
Yongsheng Wang ◽  
Ming Jen Tan ◽  
Kim Meow Liew

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