Design and characterization of a copper microchannel heat sink for SiP cooling

2021 ◽  
pp. 2140015
Author(s):  
Min Miao ◽  
Hao Zhang ◽  
Hejie Yu ◽  
Lili Cao
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Electrical Discharge Machining ◽  
Copper Substrate ◽  
Integrated System ◽  
Peak Temperature ◽  
Microchannel Heat Sink ◽  
Set Up ◽  
Electronic Hardware

With the increasing flourishing of miniaturized, multifunctional, and heterogeneously integrated system in package (SiP), heating problem is becoming more and more serious. In this paper, to meet the heat dissipation needs of the chips thus assembled and to achieve effective thermal management, linear, serpent and spiral shaped microchannel heat sinks were designed and fabricated into copper substrate by electrical discharge machining (EDM) and precision machining technology, acting both as the cooler and mounting base for passive and active SiP interposers. A test platform was set up to characterize the heat dissipation performance of the copper-based microchannel heat sink. The experimental and simulation results show that heat dissipation rate increases with the increasing heat flux density in the range 5–30 W/cm2 for the three microchannel designs, and the peak temperature can all be kept below 340 K (67[Formula: see text]C) even for the highest heat flux. The three designs are compared from the perspective of peak temperature, temperature distribution uniformity and pressure drop. In all, the solution proposed hereby provides a new and optimal option for in-situ cooling for densely integrated electronic hardware.

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Numerical and Experimental Investigations on Heat Transfer Phenomena of an Aluminium Microchannel Heat Sink

2011 ◽  
Vol 145 ◽  
pp. 129-133 ◽  
Author(s):  
Thanhtrung Dang ◽  
Ngoctan Tran ◽  
Jyh Tong Teng
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Heat Sink ◽  
Inlet Temperature ◽  
Outlet Temperature ◽  
Microchannel Heat Sink ◽  
Maximum Heat

The study was done both numerically and experimentally on the heat transfer behaviors of a microchannel heat sink. The solver of numerical simulations (CFD - ACE+software package) was developed by using the finite volume method. This numerical method was performed to simulate for an overall microchannel heat sink, including the channels, substrate, manifolds of channels as well as the covered top wall. Numerical results associated with such kinds of overall microchannel heat sinks are rarely seen in the literatures. For cases done in this study, a heat flux of 9.6 W/cm2was achieved for the microchannel heat sink having the inlet temperature of 25 °C and mass flow rate of 0.4 g/s with the uniform surface temperature of bottom wall of the substrate of 50 °C; besides, the maximum heat transfer effectiveness of this device reached 94.4%. Moreover, in this study, when the mass flow rate increases, the outlet temperature decreases; however, as the mass flow rate increases, the heat flux of this heat sink increases also. In addition, the results obtained from the numerical analyses were in good agreement with those obtained from the experiments as well as those from the literatures, with the maximum discrepancies of the heat fluxes estimated to be less than 6 %.

Design and Tests of a Water-Cooling Micro-Channel Heat Sink Made by WEDM

2012 ◽  
Vol 459 ◽  
pp. 609-614
Author(s):  
Kuo Zoo Liang ◽  
A Cheng Wang ◽  
Chun Ho Liu ◽  
Lung Tasi ◽  
Yan Cherng Lin
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Electrical Discharge ◽  
Heat Dissipation ◽  
Electrical Discharge Machining ◽  
Input Power ◽  
Wire Electrical Discharge Machining ◽  
Micro Channel ◽  
Water Cooling ◽  
Computer Aided

The purpose of this research is to design a new heat sink of water-cooling. With the aid of CAE (computer aided engineering), WEDM (wire electrical discharge machining), and the concept of micro-channel design, a heat sink of water-cooling can then be built with the merit of a smaller volume and lower thermal resistance. From this paper, results of the experiment indicate that the thermal resistance of heat sink can be decreased to 0.12 °C/W with input power of 60W, flow rate of 0.6 LPM, and a better heat dissipation with the in input power of 100W or 140W can be revealed.

scholarly journals Constructal Optimization of Rectangular Microchannel Heat Sink with Porous Medium for Entropy Generation Minimization

Entropy ◽  
2021 ◽  
Vol 23 (11) ◽  
pp. 1528
Author(s):  
Wenlong Li ◽  
Zhihui Xie ◽  
Kun Xi ◽  
Shaojun Xia ◽  
Yanlin Ge
Keyword(s):  
Heat Flux ◽  
Aspect Ratio ◽  
Entropy Generation ◽  
Heat Sink ◽  
Width Ratio ◽  
Microchannel Heat Sink ◽  
Rectangular Microchannel ◽  
Entropy Generation Minimization ◽  
Aspect Ratios ◽  
Length Width

A model of rectangular microchannel heat sink (MCHS) with porous medium (PM) is developed. Aspect ratio of heat sink (HS) cell and length-width ratio of HS are optimized by numerical simulation method for entropy generation minimization (EGM) according to constructal theory. The effects of inlet Reynolds number (Re) of coolant, heat flux on bottom, porosity and volume proportion of PM on dimensionless entropy generation rate (DEGR) are analyzed. From the results, there are optimal aspect ratios to minimize DEGR. Given the initial condition, DEGR is 33.10% lower than its initial value after the aspect ratio is optimized. With the increase of Re, the optimal aspect ratio declines, and the minimum DEGR drops as well. DEGR gets larger and the optimal aspect ratio remains constant with the increasing of heat flux on bottom. For the different volume proportion of PM, the optimal aspect ratios are diverse, but the minimum DEGR almost stays unchanged. The twice minimized DEGR, which results from aspect ratio and length-width ratio optimized simultaneously, is 10.70% lower than the once minimized DEGR. For a rectangular bottom, a lower DEGR can be reached by choosing the proper direction of fluid flow.

scholarly journals Heat Transfer and Fluid Flow Analysis on Microchannel Heat Sink with Varying Plenum Size

2019 ◽  
Vol 8 (2) ◽  
pp. 1878-1889
Keyword(s):  
Heat Sink ◽  
Flow Analysis ◽  
Outlet Temperature ◽  
Microchannel Heat Sink ◽  
Liquid Stream ◽  
3 Dimensional ◽  
Fluid Analysis ◽  
Weight Drop ◽  
Set Up ◽  
Fluid Flow Analysis

Computational fluid analysis study has been carried out to find a better prospect of perfect design, shape and plenum size microchannel heat sink (MCHS). Distinctive structure parameters were chosen to plan microchannel heat sink with shifting channel planum sizes of 10 mm, 20 mm and 30 mm. The material taken of circle type heat sink is taken as copper. The liquid taken is plane fluid. Amid liquid stream distinctive speed stream states of significant worth 0.25 lpm, 0.50 lpm and 0.75 lpm were chosen. In computational liquid examination changing weight, temperature and speed conditions impacts were additionally contemplated. Huge weight drop is recorded in the speed rating of 0.25 lpm. Speed readings were recorded high en 30 mm plenum estimate with 0.75 lpm speed stream. Investigation gives thought of an ideal structure fit as a fiddle with stream of liquid at 0.75 speed stream. The stream space were understood utilizing ANSYS programming as economically accessible for CFD examination. A special plan is set up from the examination which can exchange extensive measure of warmth in the state of microchannel heat sinks with microchannel length of 48 mm long and with other chose structure paramters. To accomplish more warmth expulsion from the MCHS the microchannel estimate upgrade is done diagnostically. For ordinary convective warmth trade coefficient, outlet temperature, grinding and weight drop, siphoning power and warm impediment have been plotted against Nusselt number qualities for various stream conditions. By settling the correct control of the liquid stream and warmth exchange propensity of a 3- dimensional MCHS has been accomplished computationally.

Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Shailesh N. Joshi ◽  
Danny J. Lohan ◽  
Ercan M. Dede
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Heat Sink ◽  
Maximum Pressure ◽  
Microchannel Heat Sink ◽  
Large Area ◽  
Two Phase ◽  
Maximum Heat ◽  
Flow Rates

Abstract The heat transfer and fluid flow performance of a hybrid jet plus multipass microchannel heat sink in two-phase operation is evaluated for the cooling of a single large area, 3.61 cm2, heat source. The two-layer branching microchannel heat sink is evaluated using HFE-7100 as the coolant at three inlet volumetric flow rates of 150, 300, and 450 ml/min. The boiling performance is highest for the flow rate of 450 ml/min with the maximum heat flux value of 174 W/cm2. Critical heat flux (CHF) was observed at two of the tested flow rates, 150 and 300 ml/min, before reaching the maximum operating temperature for the serpentine heater. At 450 ml/min, the heater reached the maximum allowable temperature prior to observing CHF. The maximum pressure drop for the heat sink is 34.1 kPa at a heat flux of 164 W/cm2. Further, the peak heat transfer coefficient value of the heat sink is 28,700 W/m2 K at a heat flux value of 174 W/cm2 and a flow rate of 450 ml/min. Finally, a validated correlation of the single device cooler is presented that predicts heat transfer performance and can be utilized in the design of multidevice coolers.

Sign in / Sign up

Export Citation Format

Share Document