Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures

2015 ◽  
Vol 46 (6) ◽  
pp. 2637-2645 ◽  
Author(s):  
Thi-Thuy Luu ◽  
Nils Hoivik ◽  
Kaiying Wang ◽  
Knut E. Aasmundtveit ◽  
Astrid-Sofie B. Vardøy
Keyword(s):  
Elevated Temperatures ◽  
Wafer Level

Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

1996 ◽  
Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn
Keyword(s):  
Process Development ◽  
Process Integration ◽  
Wafer Level ◽  
Electrical Failure ◽  
Analysis Techniques ◽  
Integration Approach ◽  
Intermetal Dielectric ◽  
Metallization Process ◽  
Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

scholarly journals Characterization of Wafer-Level Thermocompression Bonds

2004 ◽  
Vol 13 (6) ◽  
pp. 963-971 ◽  
Author(s):  
C.H. Tsau ◽  
S.M. Spearing ◽  
M.A. Schmidt
Keyword(s):  
Wafer Level

In-Situ Characterization of Growth and Intermixing at a Heteroepitaxial Interface: Fe on Au(001)

1993 ◽  
Vol 318 ◽  
Author(s):  
Q. Jiang ◽  
A. Chan ◽  
Y.-L. He ◽  
G.-C. Wang
Keyword(s):  
Elevated Temperatures ◽  
Chemical Elements ◽  
Background Intensity ◽  
In Situ Characterization ◽  
Initial Stage ◽  
Monolayer Growth ◽  
Low Energy Electron ◽  
Energy Dependent

ABSTRACTThe growth and chemical intermixing of submonolayer and a few monolayer thick Fe films on a Au(001) surface was studied by High Resolution Low Energy Electron Diffraction (HRLEED) technique. Through the analysis of the energy dependent angular profiles as a function of time, we obtained the distribution of islands and distribution of spacings during submonolayer growth. The interference of electron waves from different chemical elements in terraces at different heights in the surface contributes to the background intensity and broadening in the angular profiles of diffraction beams. A subsurface Fe capped by Au islands as a result of atomic place exchange was observed at the initial stage of monolayer growth. From the energy dependent angular profiles as a function of temperature, we determine the quantitative change of inhomogeneity length (∼20 Å) at the interface of ultrathin films at elevated temperatures due to intermixing.

The High Temperature Deformation Behavior of A Cr2Nb Ordered Intermetallic System

1990 ◽  
Vol 213 ◽  
Author(s):  
G. E. Vignoul ◽  
J.M. Sanchez ◽  
J. K. Tien
Keyword(s):  
Deformation Behavior ◽  
Elevated Temperatures ◽  
High Temperature Deformation ◽  
Temperature Deformation ◽  
Deformation Law ◽  
Ordered Intermetallic ◽  
Intermetallic System ◽  
Increasing Temperature ◽  
Stress Term

ABSTRACTA basic characterization of the deformation behavior of Cr2Nb by microindention at ambient and elevated temperatures (up to 1400 °C) was undertaken. The microhardness of this system was seen to decrease with increasing temperature, from 1040 MPa at 25°C to 322 MPa at 1400 °C. Further, the microindention creep behavior of this system was studied by varying time on load at T = 1000 and 1200°C. Analysis of the data showed that m = 24 and Qapp = 477.61 kJ/mole. These unusually high values are indicative of the existence of an effective resisting stress against creep. When the data was fit against a microindention creep deformation law which was modified to incorporate an effective resisting stress term, it was determined that m = 4.5, Qcreep = 357 kJ/mole and the resisting stress term σr = 300 MPa.

Measurement of the Material State Including the Effects of Recovery and Recrystallization

2000 ◽  
Author(s):  
M. E. Bange ◽  
A. J. Beaudoin ◽  
M. G. Stout ◽  
S. R. MacEwen
Keyword(s):  
Elevated Temperatures ◽  
High Strain ◽  
Quantitative Measure ◽  
Experimental Program ◽  
Strain Rates ◽  
Compression Tests ◽  
State Variable ◽  
Mechanical Threshold ◽  
Material State

Abstract Deformation at elevated temperatures in combination with high strain rates leads to recovery and recrystallization in aluminum alloys. Previous work in recrystallization has emphasized the detailing of microstructural trend in progression from the deformed to the annealed state. In the following, we examine the effect of rate dependence on deformation on AA 5182 and AA 6061. It is demonstrated that identification of underlying microstructural mechanisms is critical. An experimental program is then outlined for characterization of recovery and recrystallization of AA 5182. Instantaneous hardening rate and flow stress are developed from interrupted compression tests. These data are used to establish a quantitative measure of recovery through evaluation of a state variable for work hardening, the mechanical threshold. It is intended that the results serve as a foundation for development of relations for evolution of a mechanical state variable in the presence of recrystallization. Such a framework is necessary for the practical prediction of interstand recrystallization in hot rolling operations.

Enhancing the Thermal and Mechanical Characteristics of Polyvinyl Alcohol (PVA)-Hemp Protein Particles (HPP) Composites

2021 ◽  
Vol 36 (2) ◽  
pp. 137-143
Author(s):  
S. A. Awad
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperatures ◽  
Composite Films ◽  
Tensile Tests ◽  
Mechanical Analysis ◽  
Decomposition Temperature ◽  
Scanning Calorimetry ◽  
Solution Casting Method ◽  
Protein Particles

Abstract This paper aims to describe the thermal, mechanical, and surface properties of a PVA/HPP blend whereby the film was prepared using a solution casting method. The improvements in thermal and mechanical properties of HPP-based PVA composites were investigated. The characterization of pure PVA and PVA composite films included tensile tests, thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC). The results of TGA and DSC indicated that the addition of HPP increased the thermal decomposition temperature of the composites. Mechanical properties are significantly improved in PVA/HPP composites. The thermal stability of the PVA composite increased with the increase of HPP filler content. The tensile strength increased from 15.74 ± 0.72 MPa to 27.54 ± 0.45 MPa and the Young’s modulus increased from 282.51 ± 20.56 MPa to 988.69 ± 42.64 MPa for the 12 wt% HPP doped sample. Dynamic mechanical analysis (DMA) revealed that at elevated temperatures, enhanced mechanical properties because of the presence of HPP was even more noticeable. Morphological observations displayed no signs of agglomeration of HPP fillers even in composites with high HPP loading.

Sign in / Sign up

Export Citation Format

Share Document