Ohmic contacts formation of silicon schottky diodes by screen printing and rapid isothermal processing

1998 ◽  
Vol 27 (5) ◽  
pp. 402-404 ◽  
Author(s):  
D. Ratakonda ◽  
R. Singh ◽  
L. Vedula ◽  
S. Narayanan
1989 ◽  
Vol 162 ◽  
Author(s):  
G. Sh. Gildenblat ◽  
S. A. Grot ◽  
C. W. Hatfield ◽  
C. R. Wronski ◽  
A. R. Badzian ◽  
...  

ABSTRACTWe describe the electrical characteristics of boron doped homoepitaxial diamond films fabricated using a plasma assisted CVD process, formation of ohmic contacts, high temperature (580°C) Schottky diodes, and a rudimentary diamond MESFET. We also report reversible changes of the conductive state of the diamond surface by various surface treatments for both natural and thin-film diamonds.


2011 ◽  
Vol 679-680 ◽  
pp. 816-819 ◽  
Author(s):  
Amador Pérez-Tomás ◽  
A. Fontserè ◽  
Marcel Placidi ◽  
N. Baron ◽  
Sébastien Chenot ◽  
...  

The temperature dependence of Ohmic contacts to GaN devices is investigated in this paper via by measuring TLM contact resistances TLM vs Tas a function of temperature. measurements. In particular, the two types of Ohmic contacts are considered: (1) Contacts to highly doped implanted regions (such as the MOSFET drain/source contacts or the back contact of Schottky diodes) and (2) contacts to the 2 dimensional electron gas (2DEG) of an AlGaN/GaN heterojunction.


1997 ◽  
Vol 46 (1-3) ◽  
pp. 254-258 ◽  
Author(s):  
M.G. Rastegaeva ◽  
A.N. Andreev ◽  
A.A. Petrov ◽  
A.I. Babanin ◽  
M.A. Yagovkina ◽  
...  

1992 ◽  
Vol 283 ◽  
Author(s):  
K. Sohn ◽  
H. Lee ◽  
D. A. Hensley

ABSTRACTAl was deposited on the both sides of p-type Si by the sputtering, and the pulsed KrF excimer laser was irradiated on the one side and both sides of Al dot contacts. Due to the thin-high doping recrystallized layer, the transitions from the Schottky diodes to the ohmic contacts via backward diodes were observed in I-V measurement. Good N-shape negative resistances and notches were observed in the diodes, and ohmic contacts. Possible interpretations of the orgin of these phenomena are discussed. And, the simple model of the effective barrier height reduction under the thermionic field emission was developed using WKB approximation, and tunneling theory. By the depth Auger analysis, Al, and Si profiles near Al-Si interface after the laser irradiation were observed.


Author(s):  
Н.А. Торхов ◽  
В.А. Новиков

Abstract Using atomic-force-microscopy investigations of the electrostatic system of the crystal surface of AuNi/ n – n ^+-GaN planar Schottky diodes, it is shown that the electron work function for the surface of metal Schottky contacts depends on their linear size (diameter D ). At D > 120 μm, the work function of the central contact region approaches the work function e φ_Au ≈ 5.40 eV of a continuous metallic gold film. A decrease in the diameter leads to a decrease in the work function to 5.34 eV at D = 120 μm, 5.21 eV at D = 40 μm, 5.18 eV at D = 10 μm, and 5.14 eV at D = 5 μm. The observed decrease in the work function with diameter is related to the increasing influence of the built-in periphery electrostatic field E _ l , which is determined by the area and perimeter of the Schottky contact. The fundamental differences between the thermodynamic and electrostatic systems of TiAlNiAu/ n ^+-GaN ohmic contacts, in contrast to analogous AuNi/ n -GaN Schottky systems, are indicative of the absence of a Schottky barrier in them and the decisive role of the thermionic transport of mobile carriers.


2011 ◽  
Vol 20 (03) ◽  
pp. 417-422
Author(s):  
QUENTIN DIDUCK ◽  
IAN WALSH ◽  
DUBRAVKO BABIĆ ◽  
LESTER F. EASTMAN

We have found that Scandium metal is near ohmic as deposited on GaN , but when it is annealed at high temperatures a large barrier height Schottky forms. In this study we used Sc - Au contacts to form Schottky barrier diodes on AlGaN / GaN HEMT material. We have found that the morphology remains unchanged even after an 800 degrees centigrade anneal. This investigation has revealed that the reverse leakage current of this metal system is an order of magnitude lower than a conventional Ni - Au contact and supports a reverse breakdown that is 1/3rd larger. The similarity of the anneal temperatures to ohmic contacts enable gates and contacts to be annealed at the same time thus simplifying processing. The lack of morphology change supports the use of Sc - Au for E -beam alignment marks as well. Diode contacts on AlGaN / GaN with Schottky-ohmic separation of 10 microns demonstrated reverse breakdown in excess of 100V when the contacts were annealed at 800C. These results suggest this metallization may have applications as a new HEMT gate metal, and Schottky diodes.


2010 ◽  
Vol 24 (09) ◽  
pp. 1129-1135 ◽  
Author(s):  
L. S. CHUAH ◽  
Z. HASSAN ◽  
H. ABU HASSAN

High quality GaN layers doped with Mg were grown on Si (111) substrates using high temperature AlN as buffer layer by radio-frequency molecular beam epitaxy. From the Hall measurements, fairly uniform high hole concentration as high as (4–5) × 1020 cm -3 throughout the GaN was achieved. The fabrication of the device is very simple. Nickel ohmic contacts and Schottky contacts using indium were fabricated on Mg -doped p-GaN films. The light emission has been obtained from these thin film electroluminescent devices. Thin film electroluminescent devices were operated under direct current bias. Schottky and ohmic contacts used as cathode and anode were employed in these investigations. Alternatively, two Schottky contacts could be probed as cathode and anode. Thin film electroluminescent devices were able to emit light. However, electrical and optical differences could be observed from the two different probing methods. The red light color could be observed when the potential between the electrodes was increased gradually under forward bias of 8 V at room temperature. Electrical properties of these thin film electroluminescent devices were characterized by current–voltage (I–V) system, the heights of barriers determined from the I–V measurements were found to be related to the electroluminescence.


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