Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Liuying Zhao; Sheng Chu; Xuechen Chen; Guang Chu

doi:10.1007/s12034-019-1872-7

Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Bulletin of Materials Science ◽

10.1007/s12034-019-1872-7 ◽

2019 ◽

Vol 42 (4) ◽

Cited By ~ 6

Author(s):

Liuying Zhao ◽

Sheng Chu ◽

Xuechen Chen ◽

Guang Chu

Keyword(s):

Liquid Metal ◽

Thermal Interface Materials ◽

Heat Conducting ◽

Conducting Liquid ◽

Thermal Interface ◽

Interface Materials

Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-based Thermal Interface Materials

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00107 ◽

2021 ◽

Author(s):

Seokkan Ki ◽

Jaehwan Shim ◽

Seungtae Oh ◽

Seunggeol Ryu ◽

Jaechoon Kim ◽

...

Keyword(s):

Thermal Conductivity ◽

Liquid Metal ◽

Thermal Interface Materials ◽

Copper Nanoparticle ◽

Thermal Interface ◽

Conductive Liquid ◽

Nanoparticle Clusters ◽

Interface Materials

Gallium Oxide-Stabilized Oil in Liquid Metal Emulsions

Soft Matter ◽

10.1039/d1sm00982f ◽

2021 ◽

Author(s):

Najam Ul Hassan Shah ◽

Wilson Kong ◽

Nathan Casey ◽

Shreyas Kanetkar ◽

Robert Yue-Sheng Wang ◽

...

Keyword(s):

Energy Storage ◽

Liquid Metal ◽

Gallium Oxide ◽

Liquid Metals ◽

Soft Robotics ◽

Stretchable Electronics ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Energy Storage Applications ◽

Interface Materials

Gallium based liquid metals (LM) have prospective biomedical, stretchable electronics, soft robotics, and energy storage applications, and are being widely adopted as thermal interface materials. The danger of gallium corroding...

Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2021.121012 ◽

2021 ◽

Vol 170 ◽

pp. 121012

Author(s):

Seokkan Ki ◽

Jaehwan Shim ◽

Seungtae Oh ◽

Eunjoo Koh ◽

Donghyun Seo ◽

...

Keyword(s):

Liquid Metal ◽

High Performance ◽

Metal Alloy ◽

Thermal Interface Materials ◽

Copper Nanoparticle ◽

Thermal Interface ◽

Nanoparticle Clusters ◽

Liquid Metal Alloy ◽

Interface Materials

Liquid Metal-based Thermal Interface Materials with a High Thermal Conductivity for Electronic Cooling and Bioheat-Transfer Applications

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2021.116937 ◽

2021 ◽

pp. 116937

Author(s):

Xiaohong Wang ◽

Chennan Lu ◽

Wei Rao

Keyword(s):

Thermal Conductivity ◽

Liquid Metal ◽

Electronic Cooling ◽

High Thermal Conductivity ◽

Bioheat Transfer ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

Liquid metal nano/micro-channels as thermal interface materials for efficient energy saving

Journal of Materials Chemistry C ◽

10.1039/c8tc03417f ◽

2018 ◽

Vol 6 (39) ◽

pp. 10611-10617 ◽

Cited By ~ 8

Author(s):

Liuying Zhao ◽

Huiqiang Liu ◽

Xuechen Chen ◽

Sheng Chu ◽

Han Liu ◽

...

Keyword(s):

Liquid Metal ◽

Thermal Resistance ◽

Thermal Management ◽

Thermal Interface Material ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Efficient Energy ◽

Micro Channels ◽

High Elasticity ◽

Interface Materials

Thermal interface material (TIMs) pads/sheets with both high elasticity and low thermal resistance are indispensable components for thermal management.

Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480668 ◽

2018 ◽

Author(s):

Song Wei ◽

Li-Jun Zhou ◽

Jing-Dong Guo

Keyword(s):

Melting Temperature ◽

Thermal Interface Materials ◽

Heat Conducting ◽

Thermal Interface ◽

Highly Efficient ◽

Interface Materials

(Invited) Heterogeneous Liquid Metal Particle Composites for Thermal Interface Materials

ECS Meeting Abstracts ◽

10.1149/ma2018-02/32/1093 ◽

2018 ◽

Keyword(s):

Liquid Metal ◽

Metal Particle ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

High performance liquid metal thermal interface materials

Nanotechnology ◽

10.1088/1361-6528/abcbc2 ◽

2020 ◽

Vol 32 (9) ◽

pp. 092001

Author(s):

Sen Chen ◽

Zhongshan Deng ◽

Jing Liu

Keyword(s):

Liquid Metal ◽

High Performance ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

Advanced Thermal Interface Materials for Thermal Management

Engineered Science ◽

10.30919/es8d710 ◽

2018 ◽

Cited By ~ 9

Author(s):

Wei Yu ◽

◽

Changqing Liu ◽

Lin Qiu ◽

Ping Zhang ◽

...

Keyword(s):

Thermal Management ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

Highly Thermally Conductive Graphene-Based Thermal Interface Materials with a Bilayer Structure for Central Processing Unit Cooling

ACS Applied Materials & Interfaces ◽

10.1021/acsami.1c01223 ◽

2021 ◽

Author(s):

Zhi-Guo Wang ◽

Jia-Cheng Lv ◽

Zi-Li Zheng ◽

Ji-Guang Du ◽

Kun Dai ◽

...

Keyword(s):

Central Processing Unit ◽

Thermal Interface Materials ◽

Processing Unit ◽

Bilayer Structure ◽

Thermal Interface ◽

Central Processing ◽

Thermally Conductive ◽

Interface Materials