Self-Assembly of Carbon Nanotubes and Boron Nitride via Electrostatic Interaction for Epoxy Composites of High Thermal Conductivity and Electrical Resistivity

2018 ◽  
Vol 26 (6) ◽  
pp. 521-528 ◽  
Author(s):  
Minh Canh Vu ◽  
Tuan Sang Tran ◽  
Young Han Bae ◽  
Min Ji Yu ◽  
Vu Chi Doan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Electrical Resistivity ◽  
Boron Nitride ◽  
Electrostatic Interaction ◽  
Self Assembly ◽  
High Thermal Conductivity ◽  
Epoxy Composites

Boron nitride@graphene oxide hybrids for epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2016 ◽  
Vol 6 (42) ◽  
pp. 35847-35854 ◽  
Author(s):  
Tao Huang ◽  
Xiaoliang Zeng ◽  
Yimin Yao ◽  
Rong Sun ◽  
Fanling Meng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Self Assembly ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Assembly Strategy ◽  
Enhanced Thermal Conductivity

Boron nitride/graphene oxide hybrids prepared by an electrostatic self-assembly strategy were used as fillers for epoxy composites with high thermal conductivity.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

scholarly journals Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5251
Author(s):  
Yutao Hao ◽  
Qihan Li ◽  
Xianhai Pang ◽  
Bohong Gong ◽  
Chengmei Wei ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Mesoporous Silica ◽  
Epoxy Composite ◽  
Dielectric Materials ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Charge Movement ◽  
Boron Nitride Nanosheet

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m−1 K−1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.

High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

2012 ◽  
Vol 537 ◽  
pp. 70-75 ◽  
Author(s):  
Jung-Pyo Hong ◽  
Sung-Woon Yoon ◽  
Taeseon Hwang ◽  
Joon-Suk Oh ◽  
Seung-Chul Hong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Bimodal Distribution ◽  
High Thermal Conductivity ◽  
Epoxy Composites

Study of the synergistic effect of boron nitride and carbon nanotubes in the improvement of thermal conductivity of epoxy composites

2019 ◽  
Vol 69 (3) ◽  
pp. 280-290 ◽  
Author(s):  
Isaac Isarn ◽  
Leïla Bonnaud ◽  
Lluís Massagués ◽  
Àngels Serra ◽  
Francesc Ferrando
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Boron Nitride ◽  
Synergistic Effect ◽  
Epoxy Composites

High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration

2021 ◽  
pp. 109264
Author(s):  
Eun-Sung Lee ◽  
Jong-Gu Kang ◽  
Min-Kyeong Kang ◽  
Ki-Hong Kim ◽  
Seon-Tae Park ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals A Novel Method to Prepare Transparent, Flexible and Thermally Conductive Polyethylene/Boron Nitride Films

Nanomaterials ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 111
Author(s):  
Mingming Yi ◽  
Meng Han ◽  
Junlin Chen ◽  
Zhifeng Hao ◽  
Yuanzhou Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Self Assembly ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Polyethylene Film ◽  
High Concentration ◽  
Thermally Conductive ◽  
Novel Method

The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene/boron nitride nanoplates (PE/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE/BNNPs composites reach 0.47 W/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.

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