A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints

2015 ◽  
Vol 96 (1) ◽  
pp. 1-6
Author(s):  
Jyotishman Nath ◽  
Sabuj Mallik ◽  
Anil Borah
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joints ◽  
Surface Mount Technology ◽  
Surface Mount ◽  
Intermetallic Compound Growth

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Solder Joint Formation in Surface Mount Technology—Part II: Design

1990 ◽  
Vol 112 (3) ◽  
pp. 219-222 ◽  
Author(s):  
S. M. Heinrich ◽  
N. J. Nigro ◽  
A. F. Elkouh ◽  
P. S. Lee
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
Solder Joints ◽  
Cross Sectional Area ◽  
Surface Mount Technology ◽  
Sectional Area ◽  
Cross Sectional ◽  
Joint Formation ◽  
Surface Mount ◽  
Surface Tension Model

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints

2004 ◽  
Vol 261-263 ◽  
pp. 501-506 ◽  
Author(s):  
H.T. Lee ◽  
C.L. Yang ◽  
Ming He Chen ◽  
C.S. Li
Keyword(s):  
Mechanical Properties ◽  
Growth Rate ◽  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joints ◽  
Thermal Storage ◽  
Experimental Results ◽  
Storage Test ◽  
Ag3sn Phase ◽  
Epma Analysis

The effect of Sb addition on microstructure, intermetallic compound (IMC) and mechanical properties of Sn-Ag solder joints is investigated. The compositions of selected solders are Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb and Sn2.7Ag8.78Sb. Experimental results show that most of the added Sb are solved in -Sn matrix, and the rest react with the Ag3Sn to form Ag3(Sb,Sn) phase, which contributes to suppress the coarsening of Ag3Sn phase. SbSn phase can be observed in β-Sn matrix as the Sb addition exceeds 4.75% and remains stable during the thermal storage test. The solder microhardness increases with increasing Sb. And the growth rate of interfacial IMC layer decreases as Sb addition increases. EPMA analysis indicates there are some Sb diffusing into the interfacial IMC layer. Shear strength of solder joints are raised by adding Sb. The shear strength by as-soldered condition are 27.8MPa (0%Sb), 29MPa (1.75%Sb), 30.4MPa (4.75%Sb) and 43.4MPa (8.78%Sb) respectively

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