scholarly journals Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

2021 ◽  
Vol 3 (12) ◽  
Author(s):  
Hsing-I Hsiang ◽  
Chih-Cheng Chen ◽  
Han-Yang Su
Keyword(s):  
Electron Microscopy ◽  
Intermetallic Compound ◽  
Grain Boundaries ◽  
Deposition Time ◽  
Condensation Reaction ◽  
Silver Powder ◽  
Bulk Diffusion ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

AbstractThis study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures. Silica nanoparticles (NPs) were deposited onto a silver powder surface to inhibit silver leaching, which can lead to soldering joint failure during high-temperature soldering. The NPs were deposited through hydrolysis and a condensation reaction of tetraethyl orthosilicate (TEOS) based on the Stöber method. Fourier transform infrared spectroscopy and scanning electron microscopy were used to observe the microstructures of silver powders after the deposition of silica NPs with various TEOS concentrations and various deposition times. As the deposition time increased, the amount of silica NPs on the surface of the silver powder increased. The transmission electron microscopy results show that silica NPs were located at the IMC grain boundaries, which can hinder the dissolution of IMCs by lead-free solder melt along grain boundaries during soldering, retarding silver leaching. The growth kinetics and mechanism of IMCs during soldering were investigated. The results show that the growth of IMCs is mainly dominated by bulk diffusion. The activation energy for IMC growth increased and the growth rate decreased with increasing silica NP addition and deposition time.

The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

2015 ◽  
Vol 754-755 ◽  
pp. 493-497 ◽  
Author(s):  
Fatin Afeeqa Mohd Sobri ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Che Mohd Ruzaidi ◽  
Pavithiran Narayanan
Keyword(s):  
Intermetallic Compound ◽  
Molten Solder ◽  
Lead Free ◽  
Test Machine ◽  
Lead Free Solder ◽  
Time Scanning ◽  
Wetting Time ◽  
Free Solder ◽  
Scanning Electron ◽  
Dipping Time

The effect of dipping time to the intermetallic compound and free solder thickness of Sn-Cu-Ni (SN100C) lead-free solder has been investigated. Dipping of copper strips in molten solder was carried out using GEN3 solderability test machine with 20 s, 60 s, 120 s, 180 s, and 240 s of dipping time. Scanning Electron Microscope (SEM) was used to observe the solder coating on the copper strips. Thickness of IMC, free solder and total solder coating was calculated. The influence of dipping time was established. The results indicated that longer dipping time produced high IMC thickness while the free solder thickness reduced with the growth of IMC. Solderability test was also conducted to know the wettability of SN100C coating for the lowest dipping time which had resulted in 1.571 s of wetting time and 4.066 mN of maximum force.

Microstructural Study of Sn-3.0Ag0.5Cu Alloy on Cu/NiP-Coated Substrate by Addition of Fe, Sb and Ce

2013 ◽  
Vol 858 ◽  
pp. 116-121
Author(s):  
Abu Seman Anasyida ◽  
Mohd Sharif Nurulakmal ◽  
Mahani Yusoff ◽  
Chia Li Teh
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Alloying Element ◽  
Microstructural Study ◽  
Coated Substrate ◽  
Spreading Behavior ◽  
Free Solder

In this study, the effects of alloying elements Fe (0.2 wt.%), Sb (0.5 wt.%) and Ce (0.5 wt.%) on the Sn-3.0Ag-0.5Cu lead-free solder system were investigated. The solder alloy was reflowed on electroless Cu/NiP-coated substrates and their behavior such as microstructure, wetting angle and intermetallic compound (IMC) formation were analyzed. The results showed that the presence of Fe, Ce and Sb reduced the grain size of β-Sn as compared to solder without addition of alloying element. The addition of Fe and Ce was the most significantly refined the microstructure of Sn-3.0Ag-0.5Cu solder alloys. Sn3.0Ag0.5Cu0.2Fe0.5Ce solder was revealed better spreading behavior on Cu/NiP coated substrates which have the lowest IMC thickness of 0.558 μm.

Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

2015 ◽  
Vol 754-755 ◽  
pp. 166-170 ◽  
Author(s):  
Nurul Razliana Abdul Razak ◽  
Nisrin Adli ◽  
Norainiza Saud ◽  
Sayyidah Amnah Musa
Keyword(s):  
Powder Metallurgy ◽  
Grain Boundaries ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Weight Percentage ◽  
Aluminium Addition ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.

Sign in / Sign up

Export Citation Format

Share Document