Double epitaxial layer power Schottky diodes with end in the ramp oxide technique

1996 ◽  
Vol 27 (1) ◽  
pp. 67-72 ◽  
Author(s):  
Marian Badila ◽  
Gheorghe Brezeanu
2019 ◽  
Author(s):  
Bohumír Zaťko ◽  
Ladislav Hrubčín ◽  
Pavol Boháček ◽  
Jozef Osvald ◽  
Andrea Šagátová ◽  
...  

2005 ◽  
Vol 2 (7) ◽  
pp. 2559-2563 ◽  
Author(s):  
Sung-Jong Park ◽  
Heon-Bok Lee ◽  
Wang Lian Shan ◽  
Soo-Jin Chua ◽  
Jung-Hee Lee ◽  
...  

2009 ◽  
Vol 7 (5) ◽  
pp. 707-711 ◽  
Author(s):  
Tarek Ben Salah ◽  
Mahbouba Amairi ◽  
Zina Sassi ◽  
Hervé Morel

2008 ◽  
Vol 600-603 ◽  
pp. 123-126 ◽  
Author(s):  
Francesco La Via ◽  
Gaetano Izzo ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Condorelli ◽  
...  

The growth rate of 4H-SiC epi layers has been increased up to 100 µm/h with the use of trichlorosilane instead of silane as silicon precursor. The epitaxial layers grown with this process have been characterized by electrical, optical and structural characterization methods. Schottky diodes, manufactured on the epitaxial layer grown with trichlorosilane at 1600 °C, have higher yield and lower defect density in comparison to diodes realized on epilayers grown with the standard epitaxial process.


2006 ◽  
Vol 527-529 ◽  
pp. 199-202 ◽  
Author(s):  
Francesco La Via ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
Fabrizio Roccaforte ◽  
Salvatore di Franco ◽  
...  

The influence of the epitaxial layer growth parameters on the electrical characteristics of Schottky diodes has been studied in detail. Several diodes were manufactured on different epitaxial layers grown with different Si/H2 ratio and hence with different growth rates. From the electrical characterization a maximum silicon dilution ratio can be fixed at 0.04 %. This limit fixes also a maximum growth rate that can be obtained in the epitaxial growth, with this process, at about 8 μm/h. Several epitaxial layers have been grown, using this dilution ratio, with different temperatures (1550÷1650 °C). At 1600 °C the best compromise between the direct and the reverse characteristics has been found. With this process the yield decreases from 90% for a Schottky diode area of 0.25 mm2 to 61% for the 2 mm2 diodes. Optimizing the deposition process to reduce the defects introduced by the epitaxial process, yield of the order of 80% can be reached on 1 mm2 diodes.


Author(s):  
Francesco La Via ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
Fabrizio Roccaforte ◽  
Salvatore Di Franco ◽  
...  

2006 ◽  
Vol 527-529 ◽  
pp. 163-166 ◽  
Author(s):  
Francesco La Via ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
Fabrizio Roccaforte ◽  
Salvatore di Franco ◽  
...  

The growth rate of 4H-SiC epi layers has been increased by a factor 3 (up to 18μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. An optimized process without the addition of HCl is reported for comparison. The Schottky diodes, manufactured on the epitaxial layer grown with the addition of HCl at 1600 °C, have electrical characteristics comparable with the standard epitaxial process with the advantage of an epitaxial growth rate three times higher.


1987 ◽  
Vol 34 (9) ◽  
pp. 1963-1970 ◽  
Author(s):  
J.G. Adams ◽  
A. Jelenski ◽  
D.H. Navon ◽  
Ting-Wei Tang

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