Epitaxial Layers Grown with HCl Addition: A Comparison with the Standard Process

2006 ◽  
Vol 527-529 ◽  
pp. 163-166 ◽  
Author(s):  
Francesco La Via ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
Fabrizio Roccaforte ◽  
Salvatore di Franco ◽  
...  

The growth rate of 4H-SiC epi layers has been increased by a factor 3 (up to 18μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. An optimized process without the addition of HCl is reported for comparison. The Schottky diodes, manufactured on the epitaxial layer grown with the addition of HCl at 1600 °C, have electrical characteristics comparable with the standard epitaxial process with the advantage of an epitaxial growth rate three times higher.

2007 ◽  
Vol 556-557 ◽  
pp. 157-160 ◽  
Author(s):  
Francesco La Via ◽  
Stefano Leone ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Condorelli ◽  
...  

The growth rate of 4H-SiC epi layers has been increased by a factor 19 (up to 112 μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. An optimized process without the addition of HCl is reported for comparison. The Schottky diodes, manufactured on the epitaxial layer grown with the addition of HCl at 1600 °C, have electrical characteristics comparable with the standard epitaxial process with the advantage of an epitaxial growth rate three times higher.


2008 ◽  
Vol 600-603 ◽  
pp. 123-126 ◽  
Author(s):  
Francesco La Via ◽  
Gaetano Izzo ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Condorelli ◽  
...  

The growth rate of 4H-SiC epi layers has been increased up to 100 µm/h with the use of trichlorosilane instead of silane as silicon precursor. The epitaxial layers grown with this process have been characterized by electrical, optical and structural characterization methods. Schottky diodes, manufactured on the epitaxial layer grown with trichlorosilane at 1600 °C, have higher yield and lower defect density in comparison to diodes realized on epilayers grown with the standard epitaxial process.


2009 ◽  
Vol 615-617 ◽  
pp. 55-60 ◽  
Author(s):  
Francesco La Via ◽  
Gaetano Izzo ◽  
Massimo Camarda ◽  
Giuseppe Abbondanza ◽  
Danilo Crippa

The growth rate of 4H-SiC epi layers has been increased up to 100 µm/h by chlorine addition. The epitaxial layers grown with this process have been characterized by electrical, optical and structural characterization methods. Very thick (> 100 µm) epitaxial layer has been grown and the Schottky diodes realized on these layers have good yield (> 87%) with a low defect density (10/cm2). This process gives the opportunity to realize very high power devices with breakdown voltages in the range of 10 kV or X-Ray and particle detectors with a low cost epitaxy process.


2005 ◽  
Vol 483-485 ◽  
pp. 429-432 ◽  
Author(s):  
Francesco La Via ◽  
Fabrizio Roccaforte ◽  
Salvatore di Franco ◽  
Alfonso Ruggiero ◽  
L. Neri ◽  
...  

The effects of the Si/H2 ratio on the growth of the epitaxial layer and on the epitaxial defects was studied in detail. A large increase of the growth rate has been observed with the increase of the silicon flux in the CVD reactor. Close to a Si/H2 ratio of 0.05 % silicon nucleation in the gas phase occurs producing a great amount of silicon particles that precipitate on the wafers. The epitaxial layers grown with a Si/H2 ratio of 0.03% show a low defect density and a low leakage current of the Schottky diodes realized on these wafers. For these diodes the DLTS spectra show thepresence of several peaks at 0.14, 0.75, 1.36 and 1.43 eV. For epitaxial layers grown with higher values of the Si/H2 ratio and then with an higher growth rate, the leakage current of the Schottky diodes increases considerably.


2019 ◽  
Vol 954 ◽  
pp. 31-34
Author(s):  
Guo Guo Yan ◽  
Xing Fang Liu ◽  
Feng Zhang ◽  
Zhan Wei Shen ◽  
Wan Shun Zhao ◽  
...  

Homoepitaxial growths of 4H-SiC were performed on Si-face (0001) on-axis substrates in a SiH4-C2H4-H2-HCl system by using our home-made vertical hot wall CVD reactor. The influence mechanism of the growth temperature and C/Si ratio on the morphology and growth rate was studied. It is found that the steps in the epilayer become more clear with the increasing temperatures. The result indicates that the C/Si ratio window of on-axis epitaxial growth is very narrow. Only when the C/Si ratio was 1.2, a slightly improved surface morphology can be achieved. The results indicate that 4H-SiC epitaxial layers were obtained on on-axis substrates and the films were highly-oriented 4H-SiC.


2006 ◽  
Vol 911 ◽  
Author(s):  
Yaroslav Koshka ◽  
Bharat Krishnan ◽  
Huang-De Lin ◽  
Galyna Melnychuk

AbstractLow-temperature homoepitaxial growth of 4H-SiC using halo-carbon precursors was further investigated to address the problems limiting increase of the growth rate of the defect-free epilayers at growth temperatures below 1300°C. Enhanced etching of Si clusters in the gas phase was achieved by adding HCl during the low-temperature growth. The effective Si/C ratio above the growth surface was increased as a result of reduced depletion of silicon vapor species by cluster condensation, which resulted in drastically improved epilayer morphology and significant increase of the growth rate. An intentional insitu nitrogen doping of epitaxial layers during 1300°C growth on Si and C faces revealed more than an order of magnitude higher nitrogen donor incorporation in the C-face epitaxial layers. Finally, a feasibility of selective epitaxial growth using low-temperature masking materials such as SiO2 was demonstrated.


2006 ◽  
Vol 911 ◽  
Author(s):  
Francesco La Via ◽  
Giuseppa Galvagno ◽  
Andrea Firrincieli ◽  
Salvatore Di Franco ◽  
Andrea Severino ◽  
...  

AbstractThe growth rate of 4H-SiC epitaxial layer has been increased by a factor 19 (up to 112 μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. The effects of different deposition parameters on the epitaxial growth process have been described in detail. This process can be very promising for high power devices with a breakdown voltage of 10 kV.


1991 ◽  
Vol 69 (3-4) ◽  
pp. 390-406 ◽  
Author(s):  
E. Koskiahde ◽  
D. Cossement ◽  
N. Guelton ◽  
R. Fillit ◽  
R. G. Saint-Jacques ◽  
...  

Epitaxial layers of GaAs on (100) GaAs substrates can be grown by close-spaced vapor transport using water vapor as the transporting agent. The parameters for the transport are [Formula: see text], ΔT′ = 45 °C, and δ = 0.03 cm (where [Formula: see text] is the temperature of the graphite heating the substrate; ΔT′, the temperature difference between the graphite heating the source and the one heating the substrate; and δ, the thickness of the spacer separating the GaAs source and the substrate). Mirrorlike epitaxial layers of GaAs are obtained with these parameters when water vapor, at a partial pressure of 4.58 Torr (1 Torr = 133.3 Pa), is introduced with H2 at the beginning of the temperature rise of the reactor. The dimensions of the epitaxial layer are only limited by the size of the reactor. Using the same growth conditions, it is not possible to obtain mirrorlike films of GaAs on (100) Ge substrates. Instead, the layers are dull grey (sample no. 1). It is however not a polycrystalline deposition since the pole figures, obtained by X-ray diffraction, reveal only four crystallographic orientations; {100} the main one, {221} the secondary one, and {021} + {112} two minor contributions. Mirrorlike films of GaAs on (100) Ge substrates of less than 1 cm2 have been obtained with [Formula: see text], ΔT′ = 25 °C, and δ = 0.03 cm. With these conditions, the growth rate is 0.25 ± 0.08 μm min−1. The time evolution of [Formula: see text] and ΔT′, from room temperature up to the equilibrium temperature also influences the surface morphology of GaAs films on Ge while this was not the case for GaAs films on GaAs substrates. When the Ge substrate is larger than 1 cm2, the centre of the film becomes textured but the edges remain mirrorlike (sample no. 2). Pole figures obtained for the center and the edges of sample no. 2 are similar. They are characterized by one large diffraction due to the {100} orientation. A few random crystallographic orientations and sometimes the {221} orientation, however, bearly emerge from the background of these pole figures. Also transmission electron microscopy does not reveal any major difference between the center and the edges of sample no. 2. The density of threading dislocations is the same for both regions, varying from 108 cm−2, close (2–3 μm) to the interface, to 107 cm−2 in the thickness of the film. No misfit dislocations were observed. Antiphase boundaries are present in both regions as well. The only difference between the centre and the edges of sample no. 2 involves microtwin bundles: in the center region, there are two microtwin bundles per micrometre of interface, extending up to 6 μm in the GaAs film while on the edges, there is one bundle per micrometre with an extension of only one micrometre into the epitaxial layer. Mirrorlike GaAs films can be obtained on (100) Ge substrates of at least 1 in (1 in = 2.5 cm) in diameter by increasing δ to 0.2 cm and by injecting water vapor in the reactor only when [Formula: see text] reached 650 °C; the other deposition parameters remain the same as for sample no. 2. In these conditions, the growth rate of GaAs is 0.075 ± 0.020 μm min−1. By using a transport model based on thermodynamics, it is demonstrated that the flux intensity of GaAs transported from the source to the substrate, as well as the eventual presence of GeO as a nucleation site for GaAs on Ge, are both important for the morphology of the epitaxial layer.


2006 ◽  
Vol 527-529 ◽  
pp. 199-202 ◽  
Author(s):  
Francesco La Via ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
Fabrizio Roccaforte ◽  
Salvatore di Franco ◽  
...  

The influence of the epitaxial layer growth parameters on the electrical characteristics of Schottky diodes has been studied in detail. Several diodes were manufactured on different epitaxial layers grown with different Si/H2 ratio and hence with different growth rates. From the electrical characterization a maximum silicon dilution ratio can be fixed at 0.04 %. This limit fixes also a maximum growth rate that can be obtained in the epitaxial growth, with this process, at about 8 μm/h. Several epitaxial layers have been grown, using this dilution ratio, with different temperatures (1550÷1650 °C). At 1600 °C the best compromise between the direct and the reverse characteristics has been found. With this process the yield decreases from 90% for a Schottky diode area of 0.25 mm2 to 61% for the 2 mm2 diodes. Optimizing the deposition process to reduce the defects introduced by the epitaxial process, yield of the order of 80% can be reached on 1 mm2 diodes.


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