Process characterization with d.c. magnetron sputtering of CrSiC thin films in ArCH4 mixtures

1991 ◽  
Vol 201 (1) ◽  
pp. 109-122 ◽  
Author(s):  
Gerhard Sobe ◽  
Antje Neelmeijer ◽  
Günter Weise ◽  
Armin Heinrich
Author(s):  
OLIMPIA SALAS ◽  
Jianliang Lin ◽  
LIZBETH MELO-MAXIMO ◽  
Abril Erendira Murillo Sanchez ◽  
DULCE VIRIDIANA MELO MAXIMO ◽  
...  

Author(s):  
Erika Schutte ◽  
Jack Martin

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.


2018 ◽  
Vol 10 (3) ◽  
pp. 03005-1-03005-6 ◽  
Author(s):  
Rupali Kulkarni ◽  
◽  
Amit Pawbake ◽  
Ravindra Waykar ◽  
Ashok Jadhawar ◽  
...  

Author(s):  
K. E. Utkin ◽  
◽  
S. I. Torgashin ◽  
A. V. Khoshev ◽  
◽  
...  

2017 ◽  
Vol 4 (5) ◽  
pp. 6311-6316 ◽  
Author(s):  
Pongladda Panyajirawut ◽  
Nattha Pratumsuwan ◽  
Kornkamon Meesombad ◽  
Kridsana Thanawattana ◽  
Artit Chingsungnoen ◽  
...  

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