Principles for the determination of “spontaneous fission source strengths” by non-destructive analysis

1982 ◽  
Vol 9 (5) ◽  
pp. 241-247 ◽  
Author(s):  
W. Matthes
Keyword(s):  
Spontaneous Fission ◽  
Destructive Analysis ◽  
Non Destructive

Texture and Strain Experiments at OPAL

2010 ◽  
Vol 638-642 ◽  
pp. 2823-2828 ◽  
Author(s):  
Ulf Garbe ◽  
Oliver Kirstein ◽  
Andrew Studer ◽  
Vladimir Luzin ◽  
Klaus Dieter Liss
Keyword(s):  
Residual Stresses ◽  
New Technologies ◽  
Physical And Mechanical Properties ◽  
Local Variation ◽  
Inhomogeneous Deformation ◽  
New Materials ◽  
Destructive Analysis ◽  
Properties Of Materials ◽  
Non Destructive

In response to the development of new materials and the application of materials and components in new technologies the direct measurement, calculation and evaluation of textures and residual stresses has gained worldwide significance in recent years. Non-destructive analysis for phase specific residual stresses and textures is only possible by means of diffraction methods. The determination of global texture and the local variation of texture for example by inhomogeneous deformation are very important due to the coherence between the texture and the physical and mechanical properties of materials.

Determination of the Source of an Electrical Overstress Event to a Digital Variable Gain Amplifier Module

2014 ◽  
Author(s):  
Thiri Htun ◽  
Steve Brockett
Keyword(s):  
Mechanical Damage ◽  
Variable Gain Amplifier ◽  
Variable Gain ◽  
Root Cause ◽  
Physical Evidence ◽  
Electrical Stress ◽  
Destructive Analysis ◽  
Electrical Overstress ◽  
Non Destructive

Abstract This paper presents a systematic approach of failure analysis to determine the source of electrical overstress condition to a digital variable gain amplifier (DVGA) module where the failure was due to attenuation accuracy. Having consideration of the physical evidence on the failed devices and the root cause of the failure gives an insight of how the mechanical damage caused an electrical overstress exposure to the devices. The paper provides information on destructive analysis and non-destructive analysis conducted for determining the root cause of the failure of the DVGA module. Analysis revealed that devices failed due to an electrical overstress exposure through mechanical damage to the passivation of the metal-2 lines. The mechanical damage occurred during die-sort testing due to misalignment of the probes which delivered unintended electrical stress to the devices.

scholarly journals Usage of FTIR-ATR as Non-Destructive Analysis of Selected Toxic Dyes

2017 ◽  
Vol 25 (40) ◽  
pp. 103-111 ◽  
Author(s):  
Alica Bartošová ◽  
Lenka Blinová ◽  
Maroš Sirotiak ◽  
Anna Michalíková
Keyword(s):  
Detection Method ◽  
Rapid Determination ◽  
Infrared Spectrometry ◽  
Real Problem ◽  
Spectral Interpretation ◽  
Destructive Analysis ◽  
Non Destructive ◽  
Identification And Characterization

Abstract The degradation of the environment which is due to the discharge of polluting wastewater from industrial sources poses a real problem in several countries. Textile industries use large volumes of water in their operations, discharging thus large volume of wastewater into the environment, most of which is untreated. The wastewater contains a variety of chemicals from various stages of process operations, including desizing, scouring, bleaching and dyeing. The main purpose of this paper is to introduce Infrared Spectrometry with Fourier transformation as a non-destructive method for study, identifation and rapid determination of selected representatives of cationic (Methylene Blue), azo (Congo Red, Eriochrome Black T) and nitroso (Naphthol Green B) dyes. In conjunction with the ATR technique, FTIR offers a reliable detection method of dyes without extraction by other dangerous substances. Spectral interpretation of dye spectra revealed valuable information about the identification and characterization of each group of dyes.

Stoichiometric Determination of Graphite Intercalation Compounds Using Rutherford Backscatiering Spectrometry

1983 ◽  
Vol 27 ◽  
Author(s):  
L. Salamanca-Riba ◽  
B.S. Elman ◽  
M.S. Dresselhaus ◽  
T. Venkatesan
Keyword(s):  
Experimental Error ◽  
Rutherford Backscattering Spectrometry ◽  
Rutherford Backscattering ◽  
Intercalation Compounds ◽  
Graphite Intercalation Compounds ◽  
X Ray ◽  
Donor And Acceptor ◽  
Graphite Intercalation ◽  
Non Destructive

ABSTRACTRutherford backscattering spectrometry (RBS) is used to characterize the stoichiometry of graphite intercalation compounds (GIC). Specific application is made to several stages of different donor and acceptor compounds and to commensurate and incommensurate intercalants. A deviation from the theoretical stoichiometry is measured for most of the compounds using this non-destructive method. Within experimental error, the RBS results agree with those obtained from analysis of the (00ℓ) x-ray diffractograms and weight uptake measurements on the same samples.

Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

scholarly journals Non-Destructive Micromagnetic Determination of Hardness and Case Hardening Depth Using Linear Regression Analysis and Artificial Neural Networks

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 18
Author(s):  
Rahel Jedamski ◽  
Jérémy Epp
Keyword(s):  
Neural Network ◽  
Neural Networks ◽  
Regression Analysis ◽  
Artificial Neural Networks ◽  
Linear Regression ◽  
Linear Regression Analysis ◽  
Case Hardening ◽  
Artificial Neural ◽  
Non Destructive

Non-destructive determination of workpiece properties after heat treatment is of great interest in the context of quality control in production but also for prevention of damage in subsequent grinding process. Micromagnetic methods offer good possibilities, but must first be calibrated with reference analyses on known states. This work compares the accuracy and reliability of different calibration methods for non-destructive evaluation of carburizing depth and surface hardness of carburized steel. Linear regression analysis is used in comparison with new methods based on artificial neural networks. The comparison shows a slight advantage of neural network method and potential for further optimization of both approaches. The quality of the results can be influenced, among others, by the number of teaching steps for the neural network, whereas more teaching steps does not always lead to an improvement of accuracy for conditions not included in the initial calibration.

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