Mechanical properties, microstructure and thermal stability of a nanocrystalline CoCrFeMnNi high-entropy alloy after severe plastic deformation

The article studies an influence of temperature of severe plastic deformation (SPD) and post-deformation heat treatment on microstructure, mechanical properties and thermal stability of the Cu-0.5Cr-0.2Zr alloy. The results demonstrate that strength is considerably increased to 900 MPa by high pressure torsion (HPT) at room temperature. Subsequent ageing at 450 °С during 1 hour leads to a decay of solid solution and an allocation of dispersion particles that further incrises strength to 900 MPa, restores electrical conductivity to 70% IACS (International annealed copper standard) and enhances thermal stability of the alloy. When deformation temperature is increased to 300°С, strength is 690 MPa that is lower than in the case of deformation at room temperature that is related to reversion process at deformation. Additional a aging does not lead to an increase of strength characteristics.

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Thermal Stability of MoNbTaVW High Entropy Alloy Thin Films

Coatings ◽

10.3390/coatings10100941 ◽

2020 ◽

Vol 10 (10) ◽

pp. 941

Author(s):

Ao Xia ◽

Robert Franz

Keyword(s):

Thin Films ◽

Mechanical Properties ◽

Thermal Stability ◽

Solid Solution ◽

Electrical Conductivity ◽

High Entropy Alloy ◽

Solid Solution Phase ◽

Body Centered Cubic ◽

High Entropy ◽

Thermal Stability Of

Refractory high entropy alloys are an interesting material class because of their high thermal stability, decent electrical conductivity, and promising mechanical properties at elevated temperature. In the present work, we report on the thermal stability of body-centered cubic MoNbTaVW solid solution thin films that were synthesized by cathodic arc deposition. After vacuum annealing up to 1600 °C, the morphology, chemical composition, crystal structure, and electrical conductivity, as well as the mechanical properties, were analyzed. The observed body-centered cubic MoNbTaVW solid solution phase is stable up to 1500 °C. The evolution of electrical and mechanical properties due to the annealing treatment is discussed based on the observed structural changes of the synthesized thin films.

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Evolution of microstructure, mechanical properties, electrochemical behaviour and thermal stability of Ti0.25-Al0.2-Mo0.2-Si0.25W0.1 high entropy alloy fabricated by spark plasma sintering technique

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-019-04185-0 ◽

2019 ◽

Vol 104 (5-8) ◽

pp. 3163-3171

Author(s):

L. R. Kanyane ◽

N. Malatji ◽

A. P. I. Popoola ◽

M. B. Shongwe

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Spark Plasma Sintering ◽

Electrochemical Behaviour ◽

High Entropy Alloy ◽

High Entropy ◽

Plasma Sintering ◽

Spark Plasma ◽

Evolution Of Microstructure ◽

Thermal Stability Of

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Structure, mechanical properties and thermal stability of nitrogen-doped TaNbSiZrCr high entropy alloy coatings and their application to glass moulding and micro-drills

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2020.126539 ◽

2021 ◽

Vol 405 ◽

pp. 126539

Author(s):

W.H. Kao ◽

Y.L. Su ◽

J.H. Horng ◽

C.M. Wu

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

High Entropy Alloy ◽

High Entropy ◽

Nitrogen Doped ◽

Thermal Stability Of

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Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains

Materials Science Forum ◽

10.4028/www.scientific.net/msf.503-504.971 ◽

2006 ◽

Vol 503-504 ◽

pp. 971-976 ◽

Cited By ~ 13

Author(s):

Alexei Vinogradov ◽

T. Suzuki ◽

Satoshi Hashimoto ◽

Kazuo Kitagawa ◽

A.A. Kuznetsov ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Plastic Deformation ◽

Severe Plastic Deformation ◽

Strain Path ◽

Tensile Ductility ◽

Tensile Behavior ◽

Number Of Passes ◽

Very High ◽

Thermal Stability Of

The present work is aimed at linking the microstuctutral features obtained after severe plastic deformation via ECAP to the tensile behavior and thermal stability of pure (99.98%) copper processed by routes A and Bc to different number of passes. The main conclusion one can draw unambiguously from the currently available results is that the strain path exerts relatively little effect on the resultant tensile properties when the number of pressing is sufficiently large, although there have been some marked differences in crystallographic textures and distribution of grain-boundaries. The effect of the number of pressings on the tensile ductility is considerable.

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