J-Integral Analysis of the Elastic Strain Fields of Ferrite Deformation Twins using Electron Backscatter Diffraction

2021 ◽  
pp. 117203
Author(s):  
Abdalrhaman Koko ◽  
Elsiddig Elmukashfi ◽  
Kalin Dragnevski ◽  
Angus J. Wilkinson ◽  
Thomas James Marrow
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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