High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics

2021 ◽  
pp. 117555
Author(s):  
Yueguang Deng ◽  
Yi Jiang
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Thermal Management Of Electronics ◽  
Soft Metal

DEVELOPMENT OF MINIATURE HEAT PIPES FOR THERMAL MANAGEMENT OF ELECTRONICS IN ISRO SPACECRAFT

2018 ◽  
Author(s):  
Akhil Jaiswal ◽  
A. R. Anand ◽  
Simhachal Rao Chikkala ◽  
Venkata Raghavendra
Keyword(s):  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Management Of Electronics

Optimal Flow Control and Single Split Architecture Exploration for Fluid-Based Thermal Management

2018 ◽  
Author(s):  
Satya R. T. Peddada ◽  
Daniel R. Herber ◽  
Herschel C. Pangborn ◽  
Andrew G. Alleyne ◽  
James T. Allison
Keyword(s):  
Flow Control ◽  
Thermal Management ◽  
High Performance ◽  
Dynamic Models ◽  
Cooling System ◽  
Rooted Tree ◽  
Modeling Framework ◽  
System Architectures ◽  
Tree Graphs ◽  
Heat Loads

High-performance cooling is often necessary for thermal management of high power density systems. Both human intuition and vast experience may not be adequate to identify optimal thermal management designs as systems increase in size and complexity. This paper presents a design framework supporting comprehensive exploration of a class of single phase fluid-based cooling architectures. The candidate cooling system architectures are represented using labeled rooted tree graphs. Dynamic models are automatically generated from these trees using a graph-based thermal modeling framework. Optimal performance is determined by solving an appropriate fluid flow control problem, handling temperature constraints in the presence of exogenous heat loads. Rigorous case studies are performed in simulation, with components having variable sets of heat loads and temperature constraints. Results include optimization of thermal endurance for an enumerated set of 4,051 architectures. In addition, cooling system architectures capable of steady-state operation under a given loading are identified.

scholarly journals High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Crystals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 398 ◽  
Author(s):  
Yongcun Zhou ◽  
Xiao Zhuang ◽  
Feixiang Wu ◽  
Feng Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Polymer Composites ◽  
Thermal Management ◽  
High Performance ◽  
Graphene Nanosheets ◽  
Multiwalled Carbon Nanotube ◽  
Processing Unit ◽  
Functionalized Graphene ◽  
Multiwalled Carbon

Polymer composites with high thermal conductivity have a great potential for applications in modern electronics due to their low cost, easy process, and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory thermal conductivity, primarily because of the high interfacial thermal resistance between inorganic fillers. Herein, we developed a novel method through silver functionalized graphene nanosheets (GNS) and multiwalled carbon nanotube (MWCNT) composites with excellent thermal properties to meet the requirements of thermal management. The effects of composites on interfacial structure and properties of the composites were identified, and the microstructures and properties of the composites were studied as a function of the volume fraction of fillers. An ultrahigh thermal conductivity of 12.3 W/mK for polymer matrix composites was obtained, which is an approximate enhancement of 69.1 times compared to the polyvinyl alcohol (PVA) matrix. Moreover, these composites showed more competitive thermal conductivities compared to untreated fillers/PVA composites applied to the desktop central processing unit, making these composites a high-performance alternative to be used for thermal management.

scholarly journals An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics

2019 ◽  
Vol 9 (12) ◽  
pp. 2341-2351 ◽  
Author(s):  
Tianyu Yang ◽  
Thomas Foulkes ◽  
Beomjin Kwon ◽  
Jin Gu Kang ◽  
Paul V. Braun ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Thermal Switch ◽  
Thermal Management Of Electronics

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

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