Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

Applied Surface Science ◽

10.1016/j.apsusc.2016.05.106 ◽

2016 ◽

Vol 384 ◽

pp. 505-510 ◽

Cited By ~ 32

Author(s):

Byoung-Jun Cho ◽

Shohei Shima ◽

Satomi Hamada ◽

Jin-Goo Park

Keyword(s):

Complex Formation ◽

Chemical Mechanical Planarization ◽

Planarization Process

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Effect of pH and chemical mechanical planarization process conditions on the copper–benzotriazole complex formation

Japanese Journal of Applied Physics ◽

10.7567/jjap.55.06jb01 ◽

2016 ◽

Vol 55 (6S3) ◽

pp. 06JB01 ◽

Cited By ~ 4

Author(s):

Byoung-Jun Cho ◽

Jin-Yong Kim ◽

Satomi Hamada ◽

Shohei Shima ◽

Jin-Goo Park

Keyword(s):

Complex Formation ◽

Chemical Mechanical Planarization ◽

Process Conditions ◽

Effect Of Ph ◽

Planarization Process

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Quantitative study of chemical mechanical planarization process affected by bare silicon wafer front surface topography

Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ◽

10.1116/1.590895 ◽

1999 ◽

Vol 17 (5) ◽

pp. 2210

Author(s):

C. Shan Xu ◽

Jerry Liu ◽

Yong Xia

Keyword(s):

Surface Topography ◽

Silicon Wafer ◽

Quantitative Study ◽

Chemical Mechanical Planarization ◽

Front Surface ◽

Planarization Process

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Statistical Feature Extraction and Hybrid Feature Selection for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ◽

10.1109/edtm50988.2021.9421002 ◽

2021 ◽

Author(s):

Wenlan Jiang ◽

Chunpu Lv ◽

Bing Yang ◽

Fuquan Zhang ◽

Ying Gao ◽

...

Keyword(s):

Feature Extraction ◽

Feature Selection ◽

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Chemical Mechanical Planarization ◽

Statistical Feature ◽

Rate Prediction ◽

Planarization Process ◽

Selection For

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Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process

Journal of Intelligent Manufacturing ◽

10.1007/s10845-018-1437-4 ◽

2018 ◽

Vol 31 (1) ◽

pp. 73-86 ◽

Cited By ~ 3

Author(s):

Ki Bum Lee ◽

Chang Ouk Kim

Keyword(s):

Neural Network ◽

Convolutional Neural Network ◽

Chemical Mechanical Planarization ◽

Virtual Metrology ◽

Planarization Process

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Note: Evaluation of slurry particle size analyzers for chemical mechanical planarization process

Review of Scientific Instruments ◽

10.1063/1.4945692 ◽

2016 ◽

Vol 87 (4) ◽

pp. 046101 ◽

Cited By ~ 3

Author(s):

Sunjae Jang ◽

Atul Kulkarni ◽

Hongyi Qin ◽

Taesung Kim

Keyword(s):

Particle Size ◽

Chemical Mechanical Planarization ◽

Planarization Process

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Effect of Glycine Adsorption on Polishing of Silicon Nitride in Chemical Mechanical Planarization Process

Journal of the Korean Ceramic Society ◽

10.4191/kcers.2003.40.1.077 ◽

2003 ◽

Vol 40 (1) ◽

pp. 77-80 ◽

Cited By ~ 2

Keyword(s):

Silicon Nitride ◽

Chemical Mechanical Planarization ◽

Planarization Process

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Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process

Journal of The Electrochemical Society ◽

10.1149/1.3273077 ◽

2010 ◽

Vol 157 (3) ◽

pp. H250 ◽

Cited By ~ 10

Author(s):

Anand Meled ◽

Yun Zhuang ◽

Xiaomin Wei ◽

Jiang Cheng ◽

Yasa Adi Sampurno ◽

...

Keyword(s):

Chemical Mechanical Planarization ◽

Diamond Disk ◽

Planarization Process ◽

Disk Substrate

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Virtual metrology on Chemical Mechanical Planarization process based on Just-In-Time Learning

2016 5th International Conference on Systems and Control (ICSC) ◽

10.1109/icosc.2016.7507082 ◽

2016 ◽

Author(s):

M.A. Jebri ◽

G. Graton ◽

E.M. El Adel ◽

M. Ouladsine ◽

J. Pinaton

Keyword(s):

Chemical Mechanical Planarization ◽

Just In Time ◽

Virtual Metrology ◽

Planarization Process

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A stack fusion model for material removal rate prediction in chemical-mechanical planarization process

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-018-2578-5 ◽

2018 ◽

Vol 99 (9-12) ◽

pp. 2407-2416 ◽

Cited By ~ 2

Author(s):

Shuai Zhao ◽

Yixiang Huang

Keyword(s):

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Chemical Mechanical Planarization ◽

Fusion Model ◽

Rate Prediction ◽

Planarization Process

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A run-to-run controller for a chemical mechanical planarization process using least squares generative adversarial networks

Journal of Intelligent Manufacturing ◽

10.1007/s10845-020-01639-1 ◽

2020 ◽

Author(s):

Sinyoung Kim ◽

Jaeyeon Jang ◽

Chang Ouk Kim

Keyword(s):

Least Squares ◽

Chemical Mechanical Planarization ◽

Generative Adversarial Networks ◽

Adversarial Networks ◽

Planarization Process

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