Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity

2018 ◽  
Vol 44 (8) ◽  
pp. 8870-8876 ◽  
Author(s):  
Hiroyuki Miyazaki ◽  
You Zhou ◽  
Shoji Iwakiri ◽  
Hideki Hirotsuru ◽  
Kiyoshi Hirao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Fatigue ◽  
High Thermal Conductivity ◽  
Silicon Nitrides ◽  
Power Modules ◽  
Active Metal

The Thermal Expansion Behaviors of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 237-240
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Matrix ◽  
Experimental Results ◽  
High Thermal Conductivity ◽  
Coating Process ◽  
Electroless Coating

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

Sintered reaction-bonded silicon nitrides with high thermal conductivity: The effect of the starting Si powder and Si3N4 diluents

2014 ◽  
Vol 34 (5) ◽  
pp. 1105-1113 ◽  
Author(s):  
Young-Jo Park ◽  
Mi-Jung Park ◽  
Jin-Myung Kim ◽  
Jae-Wook Lee ◽  
Jae-Woong Ko ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Silicon Nitrides

scholarly journals Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Polyamide 6 ◽  
High Thermal Conductivity ◽  
Silicon Carbide Whiskers ◽  
Plane Direction

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

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