The Thermal Expansion Behaviors of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 237-240
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Matrix ◽  
Experimental Results ◽  
High Thermal Conductivity ◽  
Coating Process ◽  
Electroless Coating

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

Fabrication of Cu-SiCp Composites via the Electroless Copper Coating Process for the Electronic Packaging Applications

2013 ◽  
Vol 795 ◽  
pp. 272-275 ◽  
Author(s):  
K. Azmi ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
M.A.A. Mohd Salleh
Keyword(s):  
Thermal Management ◽  
Volume Fraction ◽  
High Volume ◽  
Copper Matrix ◽  
High Volume Fraction ◽  
Coating Process ◽  
Electroless Coating ◽  
Green Strength ◽  
Low Thermal Expansion ◽  
Powder Metallurgy Methods

Silicon carbide reinforced copper matrix (Cu-SiCp) composites are highly rated as thermal management materials due to their high thermal conductivity and low thermal expansion properties. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy methods have substandard properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to strengthen the bonding, the SiCp were coated with copper via electroless coating process. Based on the experimental results, a continuous copper deposition on the SiCp was obtained. The Cu-Coated layer improved the green strength of the composites thus allowed a high volume fraction of SiCp to be incorporated into the copper matrix. However, the increase in the volume fraction of SiCp has a significant effect on the apparent porosity of the Cu-SiCp composites. Nevertheless, the porosity of the Cu-Coated Cu-SiCp composites remained significantly lower than those of non-Coated Cu-SiCp composites especially at high volume fraction of SiCp.

Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications

2015 ◽  
Vol 825-826 ◽  
pp. 297-304 ◽  
Author(s):  
Martin Seiss ◽  
Tobias Mrotzek ◽  
Norbert Dreer ◽  
Wolfram Knabl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Content ◽  
Coefficient Of Thermal Expansion ◽  
Strong Anisotropy ◽  
Multilayer Composites ◽  
Properties Of Materials ◽  
Materials Used

The key properties of materials used for thermal management in electronics are thermal conductivity and the coefficient of thermal expansion. These properties can be tailored by stacking molybdenum and copper layers. Here, molybdenum copper multilayer composites with varying copper content, from 63 to 88 wt%, have been investigated. It is demonstrated, that thermal conductivity and coefficient of thermal expansion, can be adjusted by the copper content. Two flash methods for measuring the thermal conductivity are compared and the validity of the results is discussed since measurements on thin materials with strong anisotropy require a certain setup of the measurement device. For the studied compositions the thermal conductivity was determined to be between 220 to 270 W/m/K and the coefficient of thermal expansion between 6.1 to 11.5 ppm/K.

Fabrication and Properties of Copper/Carbon Composites for Thermal Management Applications

2008 ◽  
Vol 59 ◽  
pp. 169-172 ◽  
Author(s):  
Thomas Schubert ◽  
T. Weißgärber ◽  
Bernd Kieback
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Carbon Composites ◽  
Powder Mixing ◽  
Heat Spreader ◽  
Interfacial Behaviour ◽  
The Ideal

The ideal thermal management material working as heat sink and heat spreader should have a high thermal conductivity combined with a reduced and tailorable thermal expansion. To meet these market demands copper composites reinforced with diamond particles were fabricated by a powder metallurgical method (powder mixing with subsequent pressure assisted consolidation). In order to design the interfacial behaviour between copper and the reinforcement different alloying elements, chromium or boron, were added to the copper matrix. The produced composites exhibit a thermal conductivity up to 700 W/mK combined with a coefficient of thermal expansion (CTE) of 7-8 x 10-6/K. The copper composites with good interfacial bonding show only small decrease in thermal conductivity and a relatively stable CTE after the thermal cycling test.

The Influences of Cu-Coated SiCp on the Porosity and Thermal Expansion Behavior of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 241-244
Author(s):  
K. Azmi ◽  
M.I.M. Tajuddin ◽  
A. Azida
Keyword(s):  
Thermal Expansion ◽  
Thermal Management ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Electroless Coating ◽  
Expansion Behavior ◽  
Significant Difference ◽  
Powder Metallurgy Methods

The widespread use of metal matrix composites as the packaging materials is due to their tailorable thermal conductivity and coefficient of thermal expansion (CTE). For the same reason, silicon carbide reinforced copper matrix (Cu-SiCp) composites are highly rated as thermal management materials in the electronic packaging applications. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the presence of porosity in the interface of copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process. Based on the experimental results, the CTE values of the copper coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the composites tend to decrease as the porosity increases. The significant difference in the CTE values was related to the presence of sub-micron gap between the copper matrix and the SiCp reinforcement.

High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

1995 ◽  
Vol 390 ◽  
Author(s):  
Chris H. Stoessel ◽  
C. Pan ◽  
J. C. Withers ◽  
D. Wallace ◽  
R. O. Loutfy
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Graphite Fiber ◽  
Fiber Reinforced ◽  
Cathode Sputtering ◽  
Large Expansion ◽  
Thermal Conductivities

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.

Synthesis of Copper/Silicon-Carbide Composites in a Thermodynamic Disequilibrium

2015 ◽  
Vol 825-826 ◽  
pp. 189-196 ◽  
Author(s):  
Maren Klement ◽  
Alwin Nagel ◽  
Oliver Lott
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Quantitative Description ◽  
Casting Process ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Structure Property ◽  
Mechanical Loads

Composites with interpenetrating metal-ceramic microstructures (IPC, interpenetrating composites) can be tailored for specific applications, such as high thermal conductivity combined with low thermal expansion, e.g. for heat sinks. Heat sinks are required in power electronic devices or in future fusion reactor technology where extreme conditions and high cyclic thermo-mechanical loads appear. Due to its rigid ceramic backbone IPCs are expected to reveal high thermal stability. Pure silicon carbide exhibits high thermal conductivity, low coefficient of thermal expansion, high corrosion and wear resistance. But it is also known as a very brittle material when mechanical loads are applied. Thus a composite of silicon carbide with ductile and highly conductive copper seems to be a promising new material for a number of applications.This paper reports the synthesis of Cu-SiC composites using a unique high temperature squeeze casting process (HTSC). Microstructural design of SiC-preforms with open porosity and its synthesis progress is reported. Influence of preform properties, temperature, pressure and atmosphere during HTSC were investigated. A qualitative and quantitative description of the microstructure of the composites and their composition allows the creation of structure-property correlations that take effect retroactively to the casting process.

Synthesis and Characterization of Electroless Copper Coated SiC Particles

2013 ◽  
Vol 795 ◽  
pp. 233-236 ◽  
Author(s):  
K. Azmi ◽  
M.A.A. Mohd Salleh ◽  
M.N. Derman
Keyword(s):  
Silicon Carbide ◽  
Powder Metallurgy ◽  
Copper Film ◽  
Copper Matrix ◽  
Synthesis And Characterization ◽  
Coating Process ◽  
Electroless Coating ◽  
Electroless Copper ◽  
Powder Metallurgy Methods

Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The thickness of the coated copper layer was roughly estimated to be around 1μm.

scholarly journals High thermal conductivity polymer chains with reactive groups: a step towards true application

2020 ◽  
Vol 1 (6) ◽  
pp. 1996-2002
Author(s):  
Anqi Chen ◽  
Yanyan Wu ◽  
Shaoxin Zhou ◽  
Wenxue Xu ◽  
Wenlong Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Reactive Groups

Nanostructured polyethylene (PE, [–CH2–CH2–]n) films with metal-like thermal conductivity have opened up opportunities for polymers in advanced thermal management.

Sign in / Sign up

Export Citation Format

Share Document