Experimental behavior and failure modes of hybrid beam-to-column connections with RC wing-walls in industrial construction

2019 ◽  
Vol 218 ◽  
pp. 628-643 ◽  
Author(s):  
Bo Wang ◽  
Shaoyu Guan ◽  
Yi Zhang ◽  
Yongtao Bai
2013 ◽  
Vol 2013 ◽  
pp. 1-13 ◽  
Author(s):  
Zhenyu Wang ◽  
Yang Zhao ◽  
Xu Liang ◽  
Zhiguo He

Carbon fiber-reinforced polymer composites (CFRPs) are good candidates in enhancing the blast resistant performance of vulnerable public buildings and in reinforcing old buildings. The use of CFRP in retrofitting and strengthening applications is traditionally associated with concrete structures. Nevertheless, more recently, there has been a remarkable aspiration in strengthening metallic structures and components using CFRP. This paper presents a relatively simple analytical solution for the deformation and ultimate strength calculation of hybrid metal-CFRP beams when subjected to pulse loading, with a particular focus on blast loading. The analytical model is based on a full interaction between the metal and the FRP and is capable of producing reasonable results in a dynamic loading scenario. A nonlinear finite element (FE) model is also developed to reveal the full dynamic behavior of the CFRP-epoxy-steel hybrid beam, considering the detailed effects, that is, large strains, high strain rates in metal, and different failure modes of the hybrid beam. Experimental results confirm the analytical and the FE results and show a strong correlation.


Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


2008 ◽  
Author(s):  
S. S. Arndt ◽  
M. C. Laarakker ◽  
H. A. van Lith ◽  
F. J. van der Staay ◽  
F. Ohl

2019 ◽  
Vol 7 (2B) ◽  
Author(s):  
Vanderley Vasconcelos ◽  
Wellington Antonio Soares ◽  
Raissa Oliveira Marques ◽  
Silvério Ferreira Silva Jr ◽  
Amanda Laureano Raso

Non-destructive inspection (NDI) is one of the key elements in ensuring quality of engineering systems and their safe use. This inspection is a very complex task, during which the inspectors have to rely on their sensory, perceptual, cognitive, and motor skills. It requires high vigilance once it is often carried out on large components, over a long period of time, and in hostile environments and restriction of workplace. A successful NDI requires careful planning, choice of appropriate NDI methods and inspection procedures, as well as qualified and trained inspection personnel. A failure of NDI to detect critical defects in safety-related components of nuclear power plants, for instance, may lead to catastrophic consequences for workers, public and environment. Therefore, ensuring that NDI is reliable and capable of detecting all critical defects is of utmost importance. Despite increased use of automation in NDI, human inspectors, and thus human factors, still play an important role in NDI reliability. Human reliability is the probability of humans conducting specific tasks with satisfactory performance. Many techniques are suitable for modeling and analyzing human reliability in NDI of nuclear power plant components, such as FMEA (Failure Modes and Effects Analysis) and THERP (Technique for Human Error Rate Prediction). An example by using qualitative and quantitative assessesments with these two techniques to improve typical NDI of pipe segments of a core cooling system of a nuclear power plant, through acting on human factors issues, is presented.


2010 ◽  
Vol 5 (1) ◽  
pp. 3-36 ◽  
Author(s):  
Miklos Iványi ◽  
Miklos Iványi ◽  
Peter Iványi

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.


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