Failure analysis of cracking in S30408 weld joint between cylinder and flange of pure steam sterilization pot

Author(s):  
Yun Luo ◽  
Baozhu Zhang ◽  
Liang Long ◽  
Xingcai Li ◽  
Wei Liang ◽  
...  
2013 ◽  
Vol 577-578 ◽  
pp. 529-532 ◽  
Author(s):  
Jiří Sís ◽  
Bedřich Votava

Corrosion processes are frequent reasons of failure of materials in many applications. Results of failure analysis of the crude-oil tank after more than 30 years of service are summarized in this work. The failure was caused by two different and independent corrosion processes – corrosion in crude oil inside the tank and corrosion from concrete base under the tank. Both corrosion processes usually occur equally over the whole surface. In this case, however, both the corrosion processes occurred with distinctly higher corrosion rate in basic material alongside of heat affected zone of weld joint as well. The crack with length about 420 mm was the final result of these processes. The effect of low-cycle fatigue from filling and draining of crude oil is usually significant and was discussed as well.


2011 ◽  
Vol 12 (2) ◽  
pp. 168-180 ◽  
Author(s):  
Fawad Tariq ◽  
Nausheen Naz ◽  
Muhammad Amir Khan ◽  
Rasheed Ahmed Baloch

2018 ◽  
Vol 7 (4.7) ◽  
pp. 401
Author(s):  
Abbas Kamil ALrubaeiy ◽  
. . ◽  
. .

The development of steel alloy which result thin walled, high strength API 5L X75 grade, a restricting parameter controlling widespread use of X75 is the susceptibility to weld metal tracks. The excellent weld ability of this grade of the pipe steel has enhanced the potential for the use of high strength cellulose consumable like E6010 in root pass welding, but the risk of hydrogen assisted cold cracking (HACC) is also increased because of the high strength weld metal. This investigation outlines , the use of grade (E6010) of commercial cellulose consumable to assess conditions leading to hydrogen assisted cold cracking in the diluted weld metal. The research contained clarification of the link among microstructure; preheat temperature and hardness amounts for the weld consumable and its effect on cracking susceptibility. The cracking morphology studies indicated that there are many ways in which the crack can propagate in the weld metal and HAZ region. The mode of cracking observed was microvoide coalescence.    


2020 ◽  
Vol 14 (2) ◽  
pp. 87-92
Author(s):  
Sukandar Sukandar ◽  
Triwibowo Triwibowo ◽  
Yana Heryana

Slinger disk pipe is a rotary part of PTA vessel with function as anti-fog by swinging hot water to the shell wall to remove solid PTA at the shell wall. Failure took place on this slinger disk pipe. The purpose of failure analysis is to find the root cause of failure. Methods conducted in this failure analysis are examination and testing of fractography, metallography, chemical composition, hardness, and calculation of bending stress. Examination on the fracture surface by fractographic method revealed fatigue fracture with the presence of multiple beachmarks. The position of those multiple beachmarks gave indication of alternation rotation of slinger disk pipe. Examination by metallographic method revealed that initial cracks initiated from heat affected zone of pipe and strengthening plates weld joint. However, result of chemical composition examination and hardness test showed that material of slinger disk pipe were in accordance with lean duplex 2205. Calculation of bending stress gave supporting data of various load effects to slinger disk pipe. Therefore, failure of the slinger disk pipe was caused by fatigue fracture which were initiated from head affected zone of pipe and strengthening plates weld joint.


2013 ◽  
Vol 13 (4) ◽  
pp. 403-408
Author(s):  
A. Nusair Khan ◽  
W. Mohammad ◽  
I. Salam

2021 ◽  
Vol 859 (1) ◽  
pp. 012012
Author(s):  
Lin Yu ◽  
Yongliang Liu ◽  
Hongda Deng ◽  
Shitong Zhang ◽  
Yang Wang ◽  
...  
Keyword(s):  

Author(s):  
John R. Devaney

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.


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