Comparison of surface modification and deuterium retention in W and W-Cr alloy film under high energy deuterium ion implantation

There are too many methods to enhance the performance of ceramic cutting tools. All the methods can be sorted into two types: inner modification and surface modification. One of the main method to the inner modification of ceramic cutting tools is dispersion strengthening. Usually, in order to enhance the performance of ceramic cutting tools, some dispersed phases of TiN, TiC or TiCN, Al2O3, and/or ZrO2, and so on, and/or some whiskers, or fibers were added into the ceramic matrixes. And the new types of cutting tools, which possessed much more excellent performance than the original ones, were called composite ceramic cutting tools. For the composite Si3N4-based ceramic, Al2O3-based ceramic, and TiCN-based cermet, the cutting efficiency could be enhanced to 3~10 times, compared with cemented carbide tools. And they can be used for rough and finish machining of various cast iron workpieces and hardened steels, respectively, including milling and planning. Ion implantation is a surface modification for ceramic cutting tools. With certain doses of metals, for example, titanium, zirconium and chromium, and so on, implanted into the ceramics, the hardness, Young’s modulus, fractural toughness, and bending strength, etc., can be enhanced. For Al2O3 and Si3N4 ceramics, the hardness, Young’s modulus, and bending strength increased with a maximum factor of 50%, and the flank wear decreased with a factor of 2~12, compared with the unimplanted ceramic cutting tools. However, the main shortcoming of ion implantation to modify ceramics is the thickness of modified layers. They are, usually, too thin for cutting tools. The so-called PHEDP, pulsed high energy density plasma, is another surface modification method for ceramic cutting tools proposed recently. With such method, much thicker coatings of TiN, TiCN and (Ti,Al)N, etc, were deposited onto Si3N4 and WC ceramic cutting tools.The main merits involved in high hardness and Young’s modulus of the coatings, low residual stresses, and good adhesive strength between the coatings and substrates. And the flank wear of the as-depositedtools decreased with a factor of 5~10.

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Surface modification and deuterium retention of high energy rate forging W-Y2O3exposed to deuterium plasma

Journal of Nuclear Materials ◽

10.1016/j.jnucmat.2018.06.022 ◽

2018 ◽

Vol 509 ◽

pp. 145-151 ◽

Cited By ~ 5

Author(s):

Y. Tan ◽

Y.Y. Lian ◽

F. Feng ◽

Z. Chen ◽

J.B. Wang ◽

...

Keyword(s):

Surface Modification ◽

High Energy ◽

Deuterium Plasma ◽

Energy Rate ◽

High Energy Rate ◽

Deuterium Retention

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Surface Modification of Steel by High Energy Nitrogen Ion Implantation.

RADIOISOTOPES ◽

10.3769/radioisotopes.47.463 ◽

1998 ◽

Vol 47 (6) ◽

pp. 463-470

Author(s):

Syouhei TANIGUCHI ◽

Raita KITSUTAKA ◽

Akiharu KITAHARA

Keyword(s):

Surface Modification ◽

Ion Implantation ◽

High Energy ◽

Nitrogen Ion Implantation ◽

Nitrogen Ion

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New Developments in Metal Ion Implantation by Vacuum Arc Ion Sources and Metal Plasma Immersion

MRS Proceedings ◽

10.1557/proc-396-467 ◽

1995 ◽

Vol 396 ◽

Cited By ~ 2

Author(s):

I.G. Brown ◽

A. Anders ◽

S. Anders ◽

M.R. Dickinson ◽

R.A. MacGill ◽

...

Keyword(s):

Surface Modification ◽

Ion Implantation ◽

Metal Ion ◽

Arc Discharge ◽

High Energy ◽

Ion Source ◽

Plasma Sheath ◽

Vacuum Arc ◽

Large Area ◽

Metal Plasma

AbstractIon implantation by intense beams of metal ions can be accomplished using the dense metal plasma formed in a vacuum arc discharge embodied either in a vacuum arc ion source or in a ‘metal plasma immersion’ configuration. In the former case high energy metal ion beams are formed and implantation is done in a more-or-less conventional way, and in the latter case the substrate is immersed in the plasma and repetitively pulse-biased so as to accelerate the ions at the high voltage plasma sheath formed at the substrate. A number of advances have been made in the last few years, both in plasma technology and in the surface modification procedures, that enhance the effectiveness and versatility of the methods, including for example: controlled increase of the ion charge states produced; operation in a dual metal-gaseous ion species mode; very large area beam formation; macroparticle filtering; and the development of processing regimes for optimizing adhesion, morphology and structure. These complementary ion processing techniques provide the plasma tools for doing ion surface modification over a very wide parameter regime, from ‘pure’ ion implantation at energies approaching the MeV level, through ion mixing at energies in the ∼1 to ∼100 keV range, to IBAD-like processing at energies from a few tens of eV to a few keV. Here we review the methods, describe a number of recent developments, and outline some of the surface modification applications to which the methods have been put.

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Plasma Immersion Surface Modification With Metal Ion Plasma

MRS Proceedings ◽

10.1557/proc-223-371 ◽

1991 ◽

Vol 223 ◽

Cited By ~ 1

Author(s):

I. G. ◽

X. Godechot ◽

K. M. Yu

Keyword(s):

Surface Modification ◽

Ion Implantation ◽

Metal Ion ◽

Plasma Deposition ◽

Ion Beam ◽

High Energy ◽

Ion Beam Mixing ◽

Metal Plasma ◽

Modified Surface ◽

Plasma Guns

ABSTRACTWe describe here a novel technique for surface modification in which a metal plasma is employed and by which various blends of plasma deposition and ion implantation can be obtained. The new technique is a variation of the plasma immersion technique described by Conrad and co-workers. When a substrate is immersed in a metal plasma, the plasma that condenses on the substrate remains there as a film, and when the substrate is then implanted, qualitatively different processes can follow, including ‘conventional’ high energy ion implantation, recoil implantation, ion beam mixing, ion beam assisted deposition, and metallic thin film and multilayer fabrication with or without species mixing. Multiple metal plasma guns can be used with different metal ion species, films can be bonded to the substrate through ion beam mixing at the interface, and multilayer structures can be tailored with graded or abrupt interfaces. We have fabricated several different kinds of modified surface layers in this way.

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