Immersion, single phase free convection cooling of multichip modules on a printed circuit board in a pool of dielectric fluid was examined numerically, with experimental verification of baseline cases. A multi-chip module with multiple thermal test cells with temperature sensing capability was simulated. The commercially available computational fluid dynamics program from ANSYS, Fluent, was used with the electronics packaging front end, Icepak, employed to create the models and compact conduction modules. Simulations were first performed of an experimental test vehicle which had five 18 mm by 18 mm die, arranged in a cross pattern, equally spaced die, 25 mm between them. Two of the die were aligned vertically with the center die, two aligned horizontally with it. The board was suspended vertically in a large pool of dielectric fluid. Heat was dissipated in the die at a flux of up to 2 W/cm2, based on the die surface area. Simulation results were compared with experimentally measured die temperature values and excellent agreement was seen for the cases of one die heated and all five die uniformly heated with the board cooled by FC-72. A numerical parametric study was performed to examine the effect of die size and spacing on temperature rise. In addition to FC-72, immersion cooling in Novec 649 and HFE 7100 were modeled. Design guidelines are suggested for dielectric fluid immersion cooled multichip modules.
H113 Single phase cooling system with the use of nano-diamond dispersed nanofluids
