scholarly journals H113 Single phase cooling system with the use of nano-diamond dispersed nanofluids

2013 ◽  
Vol 2013 (0) ◽  
pp. 235-236
Author(s):  
Shin-Ichiro Suzuki ◽  
Masahide Sato ◽  
Takeshi Furusawa ◽  
Noboru Suzuki
Keyword(s):  
Single Phase ◽  
Cooling System

New Thermal Management Systems for Data Centers

2012 ◽  
Vol 4 (3) ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Single Phase ◽  
Data Centers ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Jacket ◽  
Cooling Methods

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44–53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42–50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

2020 ◽  
Author(s):  
Shuai Shao ◽  
Tianyi Gao ◽  
Huawei Yang ◽  
Jie Zhao ◽  
Jiajun Zhang
Keyword(s):  
Power Density ◽  
Thermal Performance ◽  
Data Center ◽  
High Performance ◽  
Single Phase ◽  
Cooling System ◽  
Thermal Power ◽  
Fluid Temperature ◽  
Primary Loop ◽  
Immersion Cooling

Abstract Along with advancements in microelectronics packaging, the power density of processor units has steadily increased over time. Data center servers equipped for high performance computing (HPC) often use multiple central processing units (CPUs) and graphical processing units (GPUs), thereby resulting in an increased power density, exceeding 1 kW per U. Many data center organizations are evaluating single phase immersion technology as a potential energy and resource saving cooling option. In this work immersion cooling was studied at a power level of 2.7kW/U with a 5U-height immersion cooling tank. Heat generated by a simulated GPU server was transferred to the secondary loop coolant, and then exchanged with the primary loop facility coolant through the heat exchanger. The chiller supply and return temperature and flow rate was controlled for the primary loop. The simulated GPU server chassis was designed to provide thermal power equivalent to a high power density server. Eight simulated power heaters, of which each unit was the size of a GPU chipset, was assembled in the comparable location to a real IT equipment on a 4U server chassis. Power for the GPU simulated chassis was able to support up to 2700 W maximum. Three investigations for this immersion cooling system evaluation were performed through comprehensive testing. The first is to identify the key decision making factor(s) for evaluating the thermal performance of 4 hydrocarbon-based dielectric coolants, including power parametric analysis, transient analysis, power cycling test, and fluid temperature profiling. The second is to develop an optimization strategy for the immersion system thermal performance. The third is to verify the capability of an 1U heat sink to support high density processor units over 300 W per GPU in an immersion cooling solution.

Cooling of Microelectronic Devices Packaged in a Single Chip Module Using Single Phase Refrigerant R-123

2009 ◽  
Author(s):  
Tushara Pasupuleti ◽  
Satish G. Kandlikar
Keyword(s):  
Single Phase ◽  
Cooling System ◽  
Electronic Devices ◽  
Working Fluid ◽  
Practical Application ◽  
Microelectronic Device ◽  
Single Chip ◽  
Microelectronic Devices ◽  
Cooling Devices ◽  
Microchannel Cooling

An approach towards practical application of microchannel cooling system is necessary as the demand of high power density devices is increasing. Colgan et. al. [1] have designed a unit known as Single Chip Module (SCM) by considering the practical issues for packaging a microchannel cooling system with a microelectronic device. The performance of the SCM has already been investigated by using water as working fluid by Colgan et. al. [1]. Considering the actual working conditions, water cannot be used in electronic devices as the working fluid because any leakage may lead to system damage. Alternative fluids like refrigerants were considered. In this research, the performance of SCM has been studied by using refrigerant R-123 as working fluid and compared with water cooled system. Cooling of 83.33 W/cm2 has been achieved for a powered area of 3 cm2 by maintaining chip temperature of 60°C. The heat transfer co-efficient obtained at a flowrate of 0.7 lpm was 34.87 kW/m2-K. The results obtained indicate that from a thermal viewpoint, R-123 can be considered as working fluid for microelectronic cooling devices.

Heat Transfer Enhancement Using Ultrasonic Waves in Presence of Liquid: A Basic Research for Cooling Electronic

2013 ◽  
Vol 464 ◽  
pp. 163-170 ◽  
Author(s):  
F. Baffigi ◽  
C. Bartoli
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Single Phase ◽  
Cooling System ◽  
Basic Research ◽  
Horizontal Cylinder ◽  
Ultrasonic Waves ◽  
Department Of Energy ◽  
Subcooled Boiling ◽  
Joule Effect

This work collects the experimental results obtained in the Thermal Fluid Dynamics Lab at the Department of Energy, Systems, Land and Constructions Engineering at the University of Pisa, concerning a basic physics research on the influence of ultrasounds in single phase free convection and in subcooled boiling, at atmospheric pressure. The ultrasounds are applied at the set frequency of 40 kHz, with a transducer output changing from 300 to 500W, on a circular horizontal cylinder heated by Joule effect, immersed in distilled water. The tests in single phase free convection, without ultrasonic waves, are validated by means of the classical correlations reported in literature, but they do not produce distinctive augmentation of the heat transfer. The enhancement of the heat transfer coefficient is maximum in subcooled boiling conditions (about 57%). In this regime a detailed investigation was performed to optimize the variables involved, such as the ultrasound generator power, the position of the cylinder and, especially, the subcooling degree. This paper, makes clear systematically the effects of ultrasounds on the heat transfer and shows as they could be very useful as cooling system for the last generation electronic components.

Study on the Behavior of an Asymmetrically Heated Reactor Cavity Cooling System with Water in Single Phase

2013 ◽  
Vol 183 (1) ◽  
pp. 75-87 ◽  
Author(s):  
D. D. Lisowski ◽  
T. C. Haskin ◽  
A. Tokuhiro ◽  
M. H. Anderson ◽  
M. L. Corradini
Keyword(s):  
Single Phase ◽  
Cooling System ◽  
Cavity Cooling

Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

1992 ◽  
Vol 114 (3) ◽  
pp. 290-299 ◽  
Author(s):  
C. O. Gersey ◽  
I. Mudawar
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Single Phase ◽  
Cooling System ◽  
Flow Boiling ◽  
Flow Channel ◽  
Two Phase ◽  
Channel Orientation ◽  
Two Phase Cooling ◽  
Layer Development

Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux (CHF). The simulated chips, measuring 10 mm × 10 mm, were flush-mounted to one wall of a 20 mm × 5 mm flow channel. The channel was rotated in increments of 45 degrees through 360 degrees such that the chips were subjected to coolant in upflow, downflow, or horizontal flow with the chips on the top or bottom walls of the channel with respect to gravity. Flow velocity was varied between 13 and 400 cm/s for subcoolings of 3, 14, 25, and 36°C and an inlet pressure of 1.36 bar. While changes in angle of orientation produced insignificant variations in the single-phase heat transfer coefficient, these changes had considerable effects on the boiling pattern in the flow channel and on CHF for velocities below 200 cm/s,’ with some chips reaching CHF at fluxes as low as 18 percent of those corresponding to vertical upflow. Increased subcooling was found to slightly dampen this adverse effect of orientation. The highest CHF values were measured with near vertical upflow and/or upward-facing chips, while the lowest values were measured with near vertical downflow and/or downward-facing chips. These variations in CHF were attributed to differences in flow boiling regime and vapor layer development on the surfaces of the chips between the different orientations. The results of the present study reveal that, while some flexibility is available in the packaging of multi-chip modules in a two-phase cooling system, some orientations should always be avoided.

Variable-Gravity Effects on a Single-Phase Partially-Confined Spray Cooling System

2006 ◽  
Vol 20 (3) ◽  
pp. 361-370 ◽  
Author(s):  
Kirk L. Yerkes ◽  
Travis E. Michalak ◽  
Kerri M. Baysinger ◽  
Rebekah Puterbaugh ◽  
Scott K. Thomas ◽  
...  
Keyword(s):  
Single Phase ◽  
Cooling System ◽  
Spray Cooling ◽  
Gravity Effects ◽  
Variable Gravity

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

2011 ◽  
Author(s):  
Anjali Chauhan ◽  
Bahgat Sammakia ◽  
Kanad Ghose ◽  
Gamal Refai-Ahmed ◽  
Dereje Agonafer
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Sink ◽  
Single Phase ◽  
Cooling System ◽  
Three Dimensional ◽  
Form Factors ◽  
Memory Access ◽  
Thermal Interface Material ◽  
Level Energy

The stacking of processing and memory components in a three-dimensional (3D) configuration enables the implementation of processing systems with small form factors. Such stacking shortens the interconnection length between processing and memory components to dramatically lower the memory access latencies, and contributes to significant improvements in the memory access bandwidth. Both of these factors elevate overall system performance to levels that are not realizable with prevailing and other proposed solutions. The shorter interconnection lengths in stacked architectures also enable the use of smaller drivers for the interconnections, which in turn reduces interconnection-level energy dissipations. On the down side, stacking of processing and memory components introduces a significant thermal management challenge that is rooted in the high thermal resistance of stacked designs. This paper examines and evaluates three distinct solutions that address thermal management challenges in a system that stacks DRAM components onto a processing core. We primarily focus on three different configurations of a microchannel-based single-phase liquid cooling system with a traditional air-cooled heat sink. Our evaluations, which are intended to study the limits of each solution, assume a uniform power dissipation model for the processor and accounts for the thermal resistance offered by the thermal interface material (TIM), the interconnect layer, and through-silicon vias (TSVs). The liquid-cooled microchannel heat sink shows more promising results when integrated into the package than when added to the microprocessor package from outside.

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