A feasible ultrafine grained Cu matrix composite microstructure for achieving high strength and high electrical conductivity
2016 ◽
Vol 682
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pp. 590-593
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2020 ◽
Vol 772
◽
pp. 138824
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Keyword(s):
2007 ◽
Vol 42
(18)
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pp. 7772-7779
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2018 ◽
pp. 247-251
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2019 ◽
Vol 155
◽
pp. 109775
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