Rational design and evaluation of UV curable nano-silver ink applied in highly conductive textile-based electrodes and flexible silver-zinc batteries

Author(s):  
Hong Hong ◽  
Lihong Jiang ◽  
Huating Tu ◽  
Jiyong Hu ◽  
Kyoung-Sik Moon ◽  
...  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.


2019 ◽  
Vol 14 (1) ◽  
Author(s):  
Lixin Mo ◽  
Zhenxin Guo ◽  
Zhenguo Wang ◽  
Li Yang ◽  
Yi Fang ◽  
...  

Author(s):  
Yi Fang ◽  
Lixin Mo ◽  
Zhiqing Xin ◽  
Yinjie Chen ◽  
Xiu Li ◽  
...  

Printed electronics is an emerging technology that applies traditional printing or coating processes to the manufacture of electronic devices and products. In order to find a low-cost, high-performance, environmentally-friendly flexible substrate suitable for electronic devices, the printability between four kinds of inkjet photo papers and nano-silver ink was investigated. First, different surface morphologies of the inkjet photo papers were measured by a confocal laser scanning microscopy. Then, a pen and a gravure printer were used to test the printability between photo papers and nano-silver ink. It was found that the conductive track and pattern was influenced by the surface morphology of the photo papers. Furthermore, a four-probe test showed that the conductivity of the ink layers on the four photo papers was almost at the same level. Furthermore, a tearing test with 3 M tapes showed that the silk photo paper had the best tearing resistance. In general, silk photo paper has the best overall performance. This research could be beneficial for the development of flexible electronic devices which are low-cost, mass manufacture suitable and environment friendly.


2011 ◽  
Vol 380 ◽  
pp. 129-132 ◽  
Author(s):  
Jian Yang ◽  
Jia Hai Chu ◽  
Yao Yang ◽  
Yu Bao Guo ◽  
Xi Gang Lou ◽  
...  

Compared with traditional etch processing, inkjet technology has the features of simpler workmanship, less resources-utilizing, lower cost and environmentally friendly adaptation, which is sure to be another innovation of printed circuit board(PCB) technology. In this paper, size and shape controlled silver nanoparticles have been synthesized,which was used as conductive medium in ink-jet inks. Then it was printed into conductive lines on epoxy resin by a drop-on-demand inkjet printer. PVP was used as a polymeric stabilizer providing both electrostatic and steric stabilization. Ag2C2O4 was used to prepared spherical nano-silver. In the preparation of flake-like silver powders, the fully inorganic phase system contains AgNO3 as a silver precursor, DMF as a as a media dissolving silver salt, and PVP as a reducing reagent. The morphologies and structures of the nanoparticles were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). It was shown that the sample is silver with cubic asymmetry from the pattern of XRD. TEM images indicated that the size of spherical nano-particles was no more than 20 nm. But the small triangular nanoplates, with rather narrow size distribution, were in the range from 20nm up to 60 nm in edge length. The electrical conductivity was also measured by the four-probe tested method after calcined on the substrates. It was shown that the conductivity was 25S/cm when adding the spherical powders and the nano-silver ink has been successfully designed for inkjet printing.


AIP Advances ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 085220
Author(s):  
Tiancheng Zhang ◽  
Zhiheng Yu ◽  
Fengli Huang ◽  
Chengli Tang ◽  
Chao Yang

2013 ◽  
Vol 76 (9) ◽  
pp. 1243-1250 ◽  
Author(s):  
R.D. Toker ◽  
N. Kayaman-Apohan ◽  
M.V. Kahraman

2020 ◽  
Vol 53 ◽  
pp. 356-363 ◽  
Author(s):  
Fanbo Meng ◽  
Jin Huang ◽  
Tong Cao ◽  
Pengbing Zhao ◽  
Peng Li

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