Preparation of Silver Nanoplates and Application in PCB Ink-Jet

2011 ◽  
Vol 380 ◽  
pp. 129-132 ◽  
Author(s):  
Jian Yang ◽  
Jia Hai Chu ◽  
Yao Yang ◽  
Yu Bao Guo ◽  
Xi Gang Lou ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Edge Length ◽  
Nano Particles ◽  
Circuit Board ◽  
Phase System ◽  
Nano Silver ◽  
Silver Ink ◽  
Drop On Demand ◽  
Ink Jet ◽  
Electrostatic And Steric Stabilization

Compared with traditional etch processing, inkjet technology has the features of simpler workmanship, less resources-utilizing, lower cost and environmentally friendly adaptation, which is sure to be another innovation of printed circuit board(PCB) technology. In this paper, size and shape controlled silver nanoparticles have been synthesized，which was used as conductive medium in ink-jet inks. Then it was printed into conductive lines on epoxy resin by a drop-on-demand inkjet printer. PVP was used as a polymeric stabilizer providing both electrostatic and steric stabilization. Ag2C2O4 was used to prepared spherical nano-silver. In the preparation of flake-like silver powders, the fully inorganic phase system contains AgNO3 as a silver precursor, DMF as a as a media dissolving silver salt, and PVP as a reducing reagent. The morphologies and structures of the nanoparticles were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). It was shown that the sample is silver with cubic asymmetry from the pattern of XRD. TEM images indicated that the size of spherical nano-particles was no more than 20 nm. But the small triangular nanoplates, with rather narrow size distribution, were in the range from 20nm up to 60 nm in edge length. The electrical conductivity was also measured by the four-probe tested method after calcined on the substrates. It was shown that the conductivity was 25S/cm when adding the spherical powders and the nano-silver ink has been successfully designed for inkjet printing.

Ink Jet Printing for Direct Mask Deposition in Printed Circuit Board Fabrication

2009 ◽  
Vol 53 (5) ◽  
pp. 050304 ◽  
Author(s):  
Wen-Kai Hsiao ◽  
Stephen D. Hoath ◽  
Graham D. Martin ◽  
Ian M. Hutchings
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Ink Jet Printing ◽  
Printed Circuit ◽  
Ink Jet ◽  
Jet Printing

Flexible Electronics Fabrication for Missile Wiring Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001096-001114
Author(s):  
Michael R. Whitley ◽  
Tracy D. Hudson
Keyword(s):  
Unmanned Aerial Vehicles ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polyimide Films ◽  
Passive Components ◽  
Printed Circuit ◽  
Data Formats ◽  
Aerial Vehicles ◽  
Ink Jet

The increased usage of unmanned aerial vehicles has driven the desire for smaller and lighter missile bodies. The wiring harnesses required to connect the missile subsystems constitute a significant portion of the missile weight and cost. We have been exploring the development of flexible electronics substrates manufactured using ink jet technology on polyimide films. This technology has an advantage over traditional flex circuit manufacturing because in addition to creating traditional wiring patterns the ink jet technology enables the creation of passive components such as resistors and capacitors. The Dimatix DMP-2831 ink jet system uses individually controllable piezoelectric driven MEMS nozzles to precisely deposit nanoparticle inks. These inks are then annealed to form wiring patterns. We will present the process for converting traditional printed circuit board data formats to inkjet printable data, the process for depositing the ink, annealing and testing.

Reliability of Interconnections Made of Sintered Silver Nano Particles

2015 ◽  
Author(s):  
Przemyslaw K. Matkowski ◽  
Tomasz Falat ◽  
Andrzej Moscicki
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Temperature Cycling ◽  
Nano Particles ◽  
Circuit Board ◽  
X Ray ◽  
Detection Failure ◽  
X Ray Computed ◽  
Sintered Silver

This study investigates the effect of silver paste composition on reliability of sintered silver interconnections. The interconnections are formed between SMD 1206 chip jumpers and electroless nickel immersion gold (ENIG) coating of FR4 printed circuit board (PCB) solder pads. They are made of pastes that vary in their composition (various proportions of micro and nano particles). The sintering process was conducted in convective oven. After the process the interconnections were subjected to X-Ray inspection in order to characterize the structure of interconnections (presence of voids, total surface of interconnection etc.). During accelerated reliability tests the PCBs were subjected to combined temperature cycling and vibration loading. During the tests daisy chains of interconnections were connected to dedicated programmable multichannel event detector developed in LIPEC lab. The event detector is able to detect and store information about object condition based on the real-time resistance measurements and applied novel algorithm of event detection. Failure modes were confirmed by using X-Ray computed tomography. The paper presents results of comparative Weibull analysis.

Bare die connections via aerosol jet technology for millimeter wave applications

2019 ◽  
Vol 11 (5-6) ◽  
pp. 441-446
Author(s):  
Franz Xaver Röhrl ◽  
Johannes Jakob ◽  
Werner Bogner ◽  
Robert Weigel ◽  
Stefan Zorn
Keyword(s):  
Printed Circuit Board ◽  
Mechanical Stability ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Circuit Board ◽  
Silver Ink ◽  
Measurement Results ◽  
Bonding Wires ◽  
Technology Transitions ◽  
Rf Performance

AbstractThis paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

scholarly journals Cost-effective sensors and sensor nodes for monitoring environmental parameters

2018 ◽  
Vol 31 (1) ◽  
pp. 11-23 ◽  
Author(s):  
Dragana Vasiljevic ◽  
Cedo Zlebic ◽  
Goran Stojanovic ◽  
Mitar Simic ◽  
Libu Manjakkal ◽  
...  
Keyword(s):  
Screen Printing ◽  
Printed Circuit Board ◽  
Environmental Parameters ◽  
Cost Effective ◽  
Electronic System ◽  
Water Quality Monitoring ◽  
Sensor Nodes ◽  
Circuit Board ◽  
Film Sensor ◽  
Ink Jet

This paper reviews the design and characterization of humidity and pH sensors manufactured in the printed circuit board (PCB), ink-jet, and screen printing technologies. The first one (PCB technology) provides robust sensors with PET film which can be exposed to harsh environment. The second (ink-jet technology) can manufacture sensors on flexible substrates (foils and papers). The third (screen printing technology) has been used to implement a thick-film sensor. In addition to this, a multi-sensor cloud-based electronic system with autonomous power supply (solar panels) for air and water quality monitoring has been described. Finally, a flexible and modular hardware platform for remote and reliable sensing of environmental parameters has been presented.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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