Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material

2017 ◽  
Vol 206 ◽  
pp. 1-4 ◽  
Author(s):  
Di Wang ◽  
Yun-Hui Mei ◽  
Haining Xie ◽  
Kun Zhang ◽  
Kim S. Siow ◽  
...  
Keyword(s):  
Electrochemical Migration ◽  
Silver Paste ◽  
Nano Silver ◽  
Bonding Material ◽  
Migration Resistance ◽  
Palladium Particles

Mechanical and electrical characteristics of silver stabilizer layer prepared by using nano silver paste for coated conductor

2009 ◽  
Vol 469 (15-20) ◽  
pp. 952-955 ◽  
Author(s):  
J.B. Lee ◽  
S.U. Lee ◽  
S.S. Kim ◽  
B.J. Kim ◽  
H.J. Kim ◽  
...  
Keyword(s):  
Coated Conductor ◽  
Electrical Characteristics ◽  
Silver Paste ◽  
Nano Silver

scholarly journals Dynamic Resistance Monitoring of Nano Silver Paste during Sintering and Thermoelectric Aging Process

2020 ◽  
Vol 56 (8) ◽  
pp. 60
Author(s):  
MA Jingxuan ◽  
WANG Shang ◽  
YANG Dongsheng ◽  
TIAN Yanhong
Keyword(s):  
Aging Process ◽  
Dynamic Resistance ◽  
Silver Paste ◽  
Nano Silver ◽  
Resistance Monitoring

High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste

2016 ◽  
Vol 37 (9) ◽  
pp. 1159-1165
Author(s):  
陈佳 CHEN Jia ◽  
李欣 LI Xin ◽  
孔亚飞 KONG Ya-fei ◽  
梅云辉 MEI Yun-hui ◽  
陆国权 LU Guo-quan
Keyword(s):  
High Temperature ◽  
High Power ◽  
Silver Paste ◽  
Nano Silver ◽  
Die Attach ◽  
High Power Led

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

2007 ◽  
Vol 36 (10) ◽  
pp. 1333-1340 ◽  
Author(s):  
Tao Wang ◽  
Xu Chen ◽  
Guo-Quan Lu ◽  
Guang-Yin Lei
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering ◽  
Silver Paste ◽  
Nano Silver

scholarly journals Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing

Nanomaterials ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 107 ◽  
Author(s):  
Hongke Li ◽  
Xiaoyang Zhu ◽  
Zhenghao Li ◽  
Jianjun Yang ◽  
Hongbo Lan
Keyword(s):  
3D Printing ◽  
Electric Field ◽  
Solid Content ◽  
No Oxidation ◽  
Basic Material ◽  
Transparent Electrodes ◽  
Printing Technology ◽  
Silver Paste ◽  
Nano Silver ◽  
Micro Scale

Nano-silver paste, as an important basic material for manufacturing thick film components, ultra-fine circuits, and transparent conductive films, has been widely used in various fields of electronics. Here, aiming at the shortcomings of the existing nano-silver paste in printing technology and the problem that the existing printing technology cannot achieve the printing of high viscosity, high solid content nano-silver paste, a nano-silver paste suitable for electric-field-driven (EFD) micro-scale 3D printing is developed. The result shows that there is no oxidation and settlement agglomeration of nano-silver paste with a storage time of over six months, which indicates that it has good dispersibility. We focus on the printing process parameters, sintering process, and electrical conductivity of nano-silver paste. The properties of the nano-silver paste were analyzed and the feasibility and practicability of the prepared nano-silver paste in EFD micro-scale 3D printing technology were verified. The experiment results indicate that the printed silver mesh which can act as transparent electrodes shows high conductivity (1.48 Ω/sq) and excellent transmittance (82.88%). The practical viability of the prepared nano-silver paste is successfully demonstrated with a deicing test. Additionally, the experimental results show that the prepared silver mesh has excellent heating properties, which can be used as transparent heaters.

Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

2012 ◽  
Vol 24 (2) ◽  
pp. 120-126 ◽  
Author(s):  
Xin Li ◽  
Gang Chen ◽  
Xu Chen ◽  
Guo‐Quan Lu ◽  
Lei Wang ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Shear Test ◽  
Silver Paste ◽  
Nano Silver ◽  
Lap Shear ◽  
Property Evaluation ◽  
Lap Shear Test

Interface evolution analysis of graded thermoelectric materials joined by low temperature sintering of nano-silver paste

2016 ◽  
Vol 659 ◽  
pp. 95-100 ◽  
Author(s):  
Huayi Li ◽  
Hongyang Jing ◽  
Yongdian Han ◽  
Guo-Quan Lu ◽  
Lianyong Xu ◽  
...  
Keyword(s):  
Low Temperature ◽  
Thermoelectric Materials ◽  
Low Temperature Sintering ◽  
Interface Evolution ◽  
Silver Paste ◽  
Nano Silver ◽  
Evolution Analysis
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