Microstructure and superior quenching sensitivity of a novel Sc, Zr alloyed Al-Zn-Mg-Cu alloy

2022 ◽  
Vol 309 ◽  
pp. 131422
Author(s):  
Jiwu Huang ◽  
Chenglong Xu ◽  
Shichao Liu ◽  
Fuqing Jiang
Keyword(s):  
Author(s):  
Shrikant P. Bhat

deformation behavior of Al-Cu alloys aged to contain θ ' has been the subject of many investigations (e.g., Ref. 1-5). Since θ ' is strong and hard, dislocations bypass θ ' plates (Orowan mechanism) at low strains. However, at high strains the partially coherent θ ' plates are probably sheared, although the mechanism is complex, depending on the form of deformation. Particularly, the cyclic straining of the bulk alloy is known to produce gross bends and twists of θ '. However, no detailed investigation of the deformation of θ ' has yet been reported; moreover, Calabrese and Laird interpreted the deformation of θ ' as largely being elastic.During an investigation of high temperature cyclic deformation, the detailed electron-microscopic observation revealed that, under reversed straining conditions, θ ' particles are severely distorted--bent and twisted depending on the local matrix constraint. A typical electronmicrograph, showing the twist is shown in Fig. 1. In order to establish whether the deformation is elastic or plastic, a sample from a specimen cycled at room temperature was heated inside the microscope and the results are presented in a series of micrographs (Fig. 2a-e).


Author(s):  
Atul S. Ramani ◽  
Earle R. Ryba ◽  
Paul R. Howell

The “decagonal” phase in the Al-Co-Cu system of nominal composition Al65CO15Cu20 first discovered by He et al. is especially suitable as a topic of investigation since it has been claimed that it is thermodynamically stable and is reported to be periodic in the dimension perpendicular to the plane of quasiperiodic 10-fold symmetry. It can thus be expected that it is an important link between fully periodic and fully quasiperiodic phases. In the present paper, we report important findings of our transmission electron microscope (TEM) study that concern deviations from ideal decagonal symmetry of selected area diffraction patterns (SADPs) obtained from several “decagonal” phase crystals and also observation of a lattice of main reflections on the 10-fold and 2-fold SADPs that implies complete 3-dimensional lattice periodicity and the fundamentally incommensurate nature of the “decagonal” phase. We also present diffraction evidence for a new transition phase that can be classified as being one-dimensionally quasiperiodic if the lattice of main reflections is ignored.


Author(s):  
J. R. Reed ◽  
D. J. Michel ◽  
P. R. Howell

The Al6Li3Cu (T2) phase, which exhibits five-fold or icosahedral symmetry, forms through solid state precipitation in dilute Al-Li-Cu alloys. Recent studies have reported that the T2 phase transforms either during TEM examination of thin foils or following ion-milling of thin foil specimens. Related studies have shown that T2 phase transforms to a microcrystalline array of the TB phase and a dilute aluminum solid solution during in-situ heating in the TEM. The purpose of this paper is to report results from an investigation of the influence of ion-milling on the stability of the T2 phase in dilute Al-Li-Cu alloy.The 3-mm diameter TEM disc specimens were prepared from a specially melted Al-2.5%Li-2.5%Cu alloy produced by conventional procedures. The TEM specimens were solution heat treated 1 h at 550°C and aged 1000 h at 190°C in air to develop the microstructure. The disc specimens were electropolished to achieve electron transparency using a 20:80 (vol. percent) nitric acid: methanol solution at -60°C.


1987 ◽  
Vol 48 (C6) ◽  
pp. C6-349-C6-354
Author(s):  
K. Hono ◽  
T. Sakurai ◽  
H. W. Pickering

2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.


2018 ◽  
Vol 1 (1) ◽  
pp. 77-90
Author(s):  
Walaa Abdelaziem ◽  
Atef Hamada ◽  
Mohsen A. Hassan

Severe plastic deformation is an effective method for improving the mechanical properties of metallic alloys through promoting the grain structure. In the present work, simple cyclic extrusion compression technique (SCEC) has been developed for producing a fine structure of cast Al-1 wt. % Cu alloy and consequently enhancing the mechanical properties of the studied alloy. It was found that the grain structure was significantly reduced from 1500 µm to 100 µm after two passes of cyclic extrusion. The ultimate tensile strength and elongation to failure of the as-cast alloy were 110 MPa and 12 %, respectively. However, the corresponding mechanical properties of the two pass CEC deformed alloy are 275 MPa and 35%, respectively. These findings ensure that a significant improvement in the grain structure has been achieved. Also, cyclic extrusion deformation increased the surface hardness of the alloy by 49 % after two passes. FE-simulation model was adopted to simulate the deformation behavior of the material during the cyclic extrusion process using DEFORMTM-3D Ver11.0. The FE-results revealed that SCEC technique was able to impose severe plastic strains with the number of passes. The model was able to predict the damage, punch load, back pressure, and deformation behavior.


2004 ◽  
Vol 95 (1) ◽  
pp. 57-59 ◽  
Author(s):  
W. Mao ◽  
H. Ren ◽  
Y. Yu

2009 ◽  
Vol 46 (2) ◽  
pp. 97-114 ◽  
Author(s):  
Mile Djurdjevic ◽  
Jelena Pavlovic ◽  
Glenn Byczynski

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