Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints

2008 ◽  
Vol 48 (3) ◽  
pp. 455-470 ◽  
Author(s):  
Dwayne R. Shirley ◽  
Hamid R. Ghorbani ◽  
Jan K. Spelt
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Primary Creep ◽  
Snagcu Solder

scholarly journals A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

2018 ◽  
Vol 47 (5) ◽  
pp. 2526-2544 ◽  
Author(s):  
Peter Borgesen ◽  
Luke Wentlent ◽  
Sa’d Hamasha ◽  
Saif Khasawneh ◽  
Sam Shirazi ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Snagcu Solder ◽  
Fatigue Model

Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue

2020 ◽  
Vol 10 (2) ◽  
pp. 288-295
Author(s):  
T. Alghoul ◽  
L. Wentlent ◽  
R. Sivasubramony ◽  
C. Greene ◽  
P. Thompson ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Diffusion Creep ◽  
Snagcu Solder

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

2007 ◽  
Vol 47 (12) ◽  
pp. 2161-2168 ◽  
Author(s):  
Weiqun Peng ◽  
Eduardo Monlevade ◽  
Marco E. Marques
Keyword(s):  
Thermal Aging ◽  
Solder Joints ◽  
Interfacial Structure ◽  
Snagcu Solder

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life
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