Damage based PoF model of solder joints under temperature cycling and electric coupling condition

2020 ◽  
Vol 114 ◽  
pp. 113814
Author(s):  
Jiaxin Yuan ◽  
Sujuan Zhang ◽  
Bo Wan ◽  
Guicui Fu ◽  
Maogong Jiang
Keyword(s):  
Solder Joints ◽  
Temperature Cycling ◽  
Coupling Condition ◽  
Electric Coupling

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Effective Thermal-Mechanical Modeling of Solder Joints

2002 ◽  
Author(s):  
Hsien-Chie Cheng ◽  
Chin-Yin Yu ◽  
Wen-Hwa Chen
Keyword(s):  
Solder Joints ◽  
Global Analysis ◽  
Temperature Cycling ◽  
Constitutive Law ◽  
Modeling Technique ◽  
Fe Model ◽  
Fe Modeling ◽  
Mechanical Behaviors ◽  
Fine Mesh ◽  
Modeling Strategy

An effective, two-staged global/local finite element (FE) modeling technique is proposed for characterizing the thermal-mechanical behaviors of solder joints in area array type packages under the temperature cycling. It consists of two essential features: the employment of a compact global FE model in the global analysis, and a two-staged, hybrid constitutive modeling strategy for solder materials, which is to apply the elastoplasticity constitutive law for solder joints in the global analysis during the first temperature rise while utilize the viscoelasticity in the rest of periods. To substantiate the proposed modeling technique, a large-scaled, 3-D FE model with a very fine mesh is constructed as a baseline model. The result derived from the proposed approach is then accordingly compared with those of the baseline solution. From these comparing results, it turns out that the proposed 3-D global/local FE modeling technique is an effective mean for simulating the thermal-mechanical behaviors of solder joints.

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

2007 ◽  
Vol 4 (3) ◽  
pp. 112-120 ◽  
Author(s):  
John Lau ◽  
Todd Castello ◽  
Dongkai Shangguan ◽  
Walter Dauksher ◽  
Joe Smetana ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Surface Finish ◽  
Failure Modes ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Organic Solderability Preservative ◽  
Solder Pastes ◽  
Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint

2013 ◽  
Vol 2013 (1) ◽  
pp. 000109-000114
Author(s):  
Hao Zhang ◽  
Qing-Sheng Zhu ◽  
Zhi-Quan Liu ◽  
Li Zhang ◽  
Hongyan Guo ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Growth Speed ◽  
Fe Content ◽  
Ball Shear Test ◽  
High Temperature Storage ◽  
Interfacial Reliability ◽  
Temperature Storage

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, as well as temperature cycling. The shear strength for Fe-75Ni, Fe-50Ni, and Fe-30Ni solder joints after reflow were 42.57, 53.94, 53.98 MPa respectively, which are all satisfied with the requirement of industrialization (>34.3 MPa ). High temperature storage was conducted at 150°C and 200°C respectively. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region at 150°C, and the growth speed of intermetallic compound (IMC) decreased with the increase of Fe concentration. When stored at 200°C, the thickness of IMC would reach a limitation for all these three films after 4 days, and cracks occurred at the interface between IMC and Fe-Ni layer. Temperature cycling tests revealed that SnAgCu/Fe-50Ni solder joint had the lowest failure rate (less than 10%), which has the best interfacial reliability among three compositions.

Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.

2011 ◽  
Vol 2011 (1) ◽  
pp. 000409-000417 ◽  
Author(s):  
Natalja Schafet ◽  
Bruno Schrempp ◽  
Manfred Spraul ◽  
Ulrich Becker ◽  
Herbert Güttler
Keyword(s):  
Solder Joints ◽  
Mechanical Strain ◽  
Temperature Cycling ◽  
System Level ◽  
Transient Temperature ◽  
Snagcu Solder ◽  
System Level Simulation ◽  
Solder Balls ◽  
Board Level ◽  
Sac Solder

PBGAs with SnPb and SnAgCu (SAC) solder joints were stressed with temperature cycles on board- and system-level. A significant influence of the different solder materials on the location of the most damaged PBGA solder balls was observed in the experiment. The reason for this experimental finding was investigated and explained by FE–simulation. The simulations of the PBGAs were done on package-, board- and system-level (PCB within a metal housing). For the system level simulation a 2-step sub-model technique described in [1] was used. Through such an approach the transient PCB deformation and the transient temperature field within the ECU-housing can be incorporated into a creep simulation of the PBGA solder joints. The creep results for both SnPb and SnAgCu solder joints from the board- and system-level simulation were compared. The calculated damage factor due to the ECU-housing influence is different for PBGA with SnPb and SAC solder joints. The simulation results were validated step by step with measurements and experiments: warpage of the non-soldered PBGA, mechanical strain and temperature on the mounted PCB, crack length evaluation of all PBGA solder joints.

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

2002 ◽  
Vol 124 (3) ◽  
pp. 246-253 ◽  
Author(s):  
Y. W. Chan ◽  
T. H. Ju ◽  
Saeed A. Hareb ◽  
Y. C. Lee ◽  
Jih-Shun Wu ◽  
...  
Keyword(s):  
Solder Joints ◽  
Fatigue Behavior ◽  
Three Dimensional ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Substrate Thickness ◽  
Reliability Model ◽  
Efficient Computation ◽  
Surface Evolver ◽  
Plastic Ball

A reliability model is established to study thermal fatigue behavior of solder joints in plastic ball grid array (PBGA) assemblies. The model is able to simulate a configuration with a large number of warpage affected solder joints. For efficient computation, regression models are used to calculate the force acting on each solder joint to determine its height under different warpage conditions. With the height and specified solder parameters, the shapes of selected solder joints are calculated using the Surface Evolver. In addition, the displacements of these solder joints can be determined by a macro model using equivalent beams to represent hundreds of solder joints. With the shapes and displacements, three-dimensional micro models for the selected joints are established to compute strain energy densities during temperature cycling. The energy densities can be used to estimate fatigue lives through an empirical correlation. Two PBGA assemblies with 72-I/O cavity-up and 540-I/O cavity-down packages are studied using the reliability model. Silicon chip size and substrate thickness are critical to solder fatigue in the cavity-up assembly. Their effects are reduced substantially for the cavity-down assembly, which is more reliable due to small global thermal mismatch. However, its reliability is strongly affected by the warpage. The warpage changes the shapes of solder joints and can reduce the corner joint’s fatigue life from 20,000 to 7800 temperature cycles for an arch-type warpage of 0.28 mm across a 42.5 mm×42.5 mm region.

Sign in / Sign up

Export Citation Format

Share Document