Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
2007 ◽
Vol 452-453
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pp. 267-272
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Keyword(s):
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2003 ◽
Vol 43
(4)
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pp. 625-633
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Keyword(s):
1999 ◽
Vol 22
(4)
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pp. 575-581
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2015 ◽
Vol 36
(7)
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pp. 702-704
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Keyword(s):
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2003 ◽
Vol 2003.16
(0)
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pp. 675-676
Keyword(s):
2009 ◽
Vol 32
(2)
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pp. 339-346
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Keyword(s):
2004 ◽
Vol 33
(1)
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pp. 76-82
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