Influence of the Bonding Force, Anisotropic Conductive Film (ACF) and Reflow Process on the Flip Chip Assembly
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2007 ◽
Vol 452-453
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pp. 267-272
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2009 ◽
Vol 32
(2)
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pp. 339-346
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2005 ◽
Vol 34
(11)
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pp. 1455-1461
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2003 ◽
Vol 43
(4)
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pp. 625-633
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2012 ◽
Vol 52
(6)
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pp. 1174-1181
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2000 ◽
Vol 23
(3)
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pp. 171-176
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1999 ◽
Vol 22
(4)
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pp. 575-581
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2015 ◽
Vol 36
(7)
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pp. 702-704
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