scholarly journals Experimental study of bubble behaviors and CHF on printed circuit board (PCB) in saturated pool water at various inclination angles

2018 ◽  
Vol 50 (7) ◽  
pp. 1068-1078 ◽  
Author(s):  
Elvira F. Tanjung ◽  
Bernard O. Alunda ◽  
Yong Joong Lee ◽  
Daeseong Jo
Keyword(s):  
Experimental Study ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Pool Water ◽  
Inclination Angles

Experimental Study on PCB Micro Drilling Force

2012 ◽  
Vol 246-247 ◽  
pp. 1017-1021 ◽  
Author(s):  
Feng Gong ◽  
Bai Qiang Chen ◽  
Ji Bin Li
Keyword(s):  
Experimental Study ◽  
Cutting Force ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Drilling Machine ◽  
Drilling Force ◽  
Printed Circuit ◽  
Market Competitiveness ◽  
Pcb Design ◽  
Micro Drilling

With the development of high density, multi-functions, miniaturization and multi-layer on printed circuit board (PCB) design, great challenges have been presented to the miniaturization of drilling on PCB. In order to meet the hole precision, quality and improve the performance, efficiency of mechanical drilling, further research should be done on the cutting state. Kistler high-precision micro-force platform was used in this paper to test and analyze the cutting force, investigate the general laws of micro drilling, and optimize the parameters for HANS PCB drilling machine. Thereby, to improve the efficiency and precision of the drilling, range of processing, and increasing market competitiveness.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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