Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization
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2019 ◽
Vol 6
(10)
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pp. 1900097
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2008 ◽
Vol 155
(10)
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pp. G185
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2008 ◽
Vol 155
(11)
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pp. G253
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2015 ◽
Vol 764-765
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pp. 138-142
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