Influence of the silicon substrate thickness on the response of thin film pyroelectric detectors

2002 ◽  
Vol 46 (8) ◽  
pp. 1155-1161 ◽  
Author(s):  
Jong Soo Ko ◽  
Weiguo Liu ◽  
Weiguang Zhu ◽  
Byung Man Kwak
2010 ◽  
Vol 10 (10) ◽  
pp. 1564-1565 ◽  
Author(s):  
M Schossig ◽  
V Norkus ◽  
G Gerlach

1992 ◽  
Vol 264 ◽  
Author(s):  
Y.H. Jeng ◽  
Mirng-Ji Lii

AbstractA laser based surface scanning technique was utilized to measure the polyimide coated silicon wafer curvature resulting from thermal cycling and mismatch, Meanwhile, mechanical properties of polyimide thin film were characterized by DMA, TMA and tensile test. Based on the obtained material properties, A FEA model was developed to analyze the experimental results -reasonable correlation was obtained.Similar approaches were taken one step further in the MCM silicon substrate curvature measurement. In a MCM package with silicon substrate, epoxy adhesive, and ceramic package, substrate warpage was developed in a thermal cycle due to thermal mismatch between the substrate and the package and coupling effect linked by epoxy adhesive. Three different substrate curvature measurement techniques were applied to identify the substrate curvature and epoxy thin film properties were also well characterized. A 3D FEA model incorporating with the epoxy material properties was developed to analyze the substrate warpage and investigate an optimal package design.


1990 ◽  
Vol 67 (6) ◽  
pp. 2985-2991 ◽  
Author(s):  
Yuhuan Xu ◽  
Ching Jih Chen ◽  
Ren Xu ◽  
John D. Mackenzie

2008 ◽  
Vol 34 (10) ◽  
pp. 838-840 ◽  
Author(s):  
I. P. Pronin ◽  
E. Yu. Kaptelov ◽  
S. V. Senkevich ◽  
V. A. Klimov ◽  
N. A. Feoktistov ◽  
...  

1995 ◽  
Vol 36 (5) ◽  
pp. 861-864 ◽  
Author(s):  
Weiguo Liu ◽  
Liangying Zhang ◽  
Xi Yao

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