Effect of deposition rate on structural and electrical properties of Al films deposited on glass by electron beam evaporation

2002 ◽  
Vol 414 (1) ◽  
pp. 150-153 ◽  
Author(s):  
Hong Qiu ◽  
Fengping Wang ◽  
Ping Wu ◽  
Liqing Pan ◽  
Lingyu Li ◽  
...  
2017 ◽  
Vol 121 (5) ◽  
pp. 055303 ◽  
Author(s):  
V. Théry ◽  
A. Boulle ◽  
A. Crunteanu ◽  
J. C. Orlianges ◽  
A. Beaumont ◽  
...  

1983 ◽  
Vol 25 ◽  
Author(s):  
Robert M. Fletcher ◽  
D. Ken Wagner ◽  
Joseph M. Ballantyne

ABSTRACTEpitaxial GaAs layers have been grown on Ge-coated Si substrates. Deposition of epitaxial Ge was performed by electron beam evaporation onto a <100> Si substrate. GaAs was then deposited by organometallic vapor-phase epitaxy. Films grown over large areas (∼1 cm2) and by selective epitaxy in stripe patterns (∼50 μm wide) have been evaluated by a number of techniques to determine structural and electrical properties. In addition, we report what we believe to be the first LEDs fabricated in GaAs/Ge/Si heterostructures.


1990 ◽  
Vol 187 ◽  
Author(s):  
C. S. Chang ◽  
J. C. Wang ◽  
L. C. Kuo

AbstractAn electron beam evaporation method has been used to prepare tin doped indium oxide (ITO) films with 95 wt.% In2O3 and 5 wt.% SnO2 in an oxygen atmosphere. It was found that the deposition rate and oxygen pressure strongly influence the film properties when the substrate temperature was lower than 200°C. In an optimal condition, highly transparent (transmittance ˜ 90% at wavelength 570 nm) and conductive (resistivity – 3×10−4Ω-cm) films of thickness around 2000 Å at substrate temperature as low as 180°C can be obtained.


2021 ◽  
Vol 2 ◽  
pp. 59-65
Author(s):  
I. Yu. Bakeev ◽  
◽  
Yu. A. Burachevsky ◽  
E. S. Dvilis ◽  
D. B. Zolotukhin ◽  
...  

The work is devoted to the study of electrical properties (temperature dependences of conductivity, relative dielectric constant, dielectric loss tangent for various frequencies) of an aluminum oxide ceramic film deposited on a metal substrate. The film was created by the original method of electron beam evaporation of a non-conductive target, consisting of a compressed alumina powder, using a plasma electron source, which is able to reliably operate in the fore-vacuum pressure range (5 – 100 Pa). Such increased working gas pressures ensures the generation of a dense beam plasma near the target, which neutralizes the charging of a non-conducting target and thereby provides its effective melting and electron beam evaporation.


1995 ◽  
Vol 10 (1) ◽  
pp. 26-33 ◽  
Author(s):  
L.M. Porter ◽  
R.F. Davis ◽  
J.S. Bow ◽  
M.J. Kim ◽  
R.W. Carpenter

Thin films (4–1000 Å) of Co were deposited onto n-type 6H-SiC(0001) wafers by UHV electron beam evaporation. The chemistry, microstructure, and electrical properties were determined using x-ray photoelectron spectroscopy, high resolution transmission electron microscopy, and I-V and C-V measurements, respectively. The as-deposited contacts exhibited excellent rectifying behavior with low ideality factors and leakage currents of n < 1.06 and 2.0 × 10−8 A/cm2 at −10 V, respectively. During annealing at 1000 °C for 2 min, significant reaction occurred resulting in the formation of CoSi and graphite. These annealed contacts exhibited ohmic-like character, which is believed to be due to defects created in the interface region.


2015 ◽  
Vol 15 (9) ◽  
pp. 964-969 ◽  
Author(s):  
Hui Kyung Park ◽  
Jaeseung Jo ◽  
Hee Kyeung Hong ◽  
Gwang Yeom Song ◽  
Jaeyeong Heo

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