Surface deformation of the InGaN thin films deposited on a sapphire substrate

1997 ◽  
Vol 295 (1-2) ◽  
pp. 193-198 ◽  
Author(s):  
R. Nowak ◽  
T. Soga ◽  
M. Umeno
2021 ◽  
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Vincent Polewczyk ◽  
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Jun-Ki Chung ◽  
Rae-Young Jung ◽  
Sung-Jin Kim ◽  
Sang-Yeup Park

2000 ◽  
Vol 39 (Part 1, No. 11) ◽  
pp. 6170-6173 ◽  
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Min-Ho Kim ◽  
Sung-Nam Lee ◽  
Nae-Man Park ◽  
Seong-Ju Park

2007 ◽  
Vol 61 (11-12) ◽  
pp. 2443-2445 ◽  
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Kyoung-Kook Kim ◽  
Dae-Kue Hwang ◽  
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Tae Geol Lee ◽  
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2020 ◽  
Vol 23 ◽  
pp. 276-283
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V.P. Malekar ◽  
V.J. Fulari

2007 ◽  
Vol 1040 ◽  
Author(s):  
Hiroki Iwane ◽  
Naoki Wakiya ◽  
Naonori Sakamoto ◽  
Takato Nakamura ◽  
Hisao Suzuki

AbstractEpitaxial aluminum nitride (AlN) thin films were successfully prepared on the (0001) sapphire substrate by chemical vapor deposition (CVD) using aluminum iodide (AlI3) and ammonia (NH3) under atmospheric pressure at 750 ºC. The crystallographic relationship between AlN thin films and Al2O3 substrate is in the following; AlN(0001)//Al2O3(0001) and AlN[1010]//Al2O3[1120]. Lattice parameters of AlN thin film measured by X-ray diffraction revealed that c=0.498 and a=0.311 nm, respectively. Residual stress estimated by modified sin2ψ method was 0.38 GPa in compressive stress. Cross-sectional TEM observation revealed that an interlayer lies between the AlN films and the sapphire substrate. It was suggested that relaxation of residual stress caused by the mismatching of lattice parameter and thermal expansion coefficient was brought about by the interlayer.


1994 ◽  
Vol 235-240 ◽  
pp. 665-666 ◽  
Author(s):  
C. Thivet ◽  
M. Guilloux-Viry ◽  
J. Padiou ◽  
A. Perrin ◽  
G. Dousselin ◽  
...  

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