The failure mechanisms and phase formation for Ni, Co and Cu contacts on ion implanted ()Si under high current stress

2000 ◽  
Vol 169 (1-4) ◽  
pp. 161-165 ◽  
Author(s):  
H.H Lin ◽  
S.L Cheng ◽  
L.J Chen
Keyword(s):  
Phase Formation ◽  
Failure Mechanisms ◽  
High Current ◽  
Current Stress ◽  
Ion Implanted

Failure mechanisms of silver and aluminum on titanium nitride under high current stress

2005 ◽  
Vol 474 (1-2) ◽  
pp. 235-244 ◽  
Author(s):  
E. Misra ◽  
C. Marenco ◽  
N.D. Theodore ◽  
T.L. Alford
Keyword(s):  
Titanium Nitride ◽  
Failure Mechanisms ◽  
High Current ◽  
Current Stress

The effect of high-current pulsed electron beam on phase formation and surface properties of chromium/copper system

Vacuum ◽  
2020 ◽  
Vol 174 ◽  
pp. 109222 ◽  
Author(s):  
Conglin Zhang ◽  
Nana Tian ◽  
Lei Li ◽  
Zirun Yang ◽  
Peng Lv ◽  
...  
Keyword(s):  
Electron Beam ◽  
Surface Properties ◽  
Phase Formation ◽  
High Current ◽  
Pulsed Electron Beam

The Study on LED Accelerated Life Testes and Failure Mechanism

2013 ◽  
Vol 462-463 ◽  
pp. 678-682
Author(s):  
Yue Zong Zhang ◽  
Chun Xia Li ◽  
Wen Bin Zhang
Keyword(s):  
Active Region ◽  
Failure Mechanism ◽  
High Power ◽  
Light Emitting Diode ◽  
Characteristic Curve ◽  
Optical Parameter ◽  
Thermal Parameter ◽  
High Current ◽  
Current Stress ◽  
High Power Led

The paper is studied on the performances of low power light-emitting diode and high power LED under high-current. After observing and measuring the degeneration of them, the Analysis of the failure mechanism is given. The degenerations of the optical parameter, electronic parameter and thermal parameter of high power LED under 600mA current stress are measured and the failure mechanism is analyzed. The I-V characteristic curve proves that the degeneration is happened in active region. Under high-current stress, the active region of high power LED is ageing which leads to much more defects. The degenerations of pins on the resin package, metal wire and surface layer metal pads are found with scanning electron microscope.

Thermal and Electrical Transport in Carbon Nanofiber Interconnects

2008 ◽  
Author(s):  
Tsutomu Saito ◽  
Hirohiko Kitsuki ◽  
Makoto Suzuki ◽  
Toshishige Yamada ◽  
Drazen Fabris ◽  
...  
Keyword(s):  
Heat Transport ◽  
Carbon Nanofibers ◽  
Joule Heating ◽  
Current Density ◽  
Electrical Transport ◽  
Heat Dissipation ◽  
Carbon Nanofiber ◽  
Transport Model ◽  
High Current ◽  
Current Stress

We study reliability of carbon nanofibers (CNFs) under high-current stress by examining CNF breakdown on four different configurations, suspended or supported, with/without tungsten deposition. The suspended results are consistently explained with a heat transport model taking into account Joule heating and heat dissipation along the CNF, while supported cases show a consistently larger current density just before breakdown, reflecting effective heat dissipation to the substrate.

Percolative approach for failure time prediction of thin film interconnects under high current stress

2005 ◽  
Vol 45 (2) ◽  
pp. 391-395 ◽  
Author(s):  
E. Misra ◽  
Md M. Islam ◽  
Mahbub Hasan ◽  
H.C. Kim ◽  
T.L. Alford
Keyword(s):  
Thin Film ◽  
Failure Time ◽  
High Current ◽  
Current Stress ◽  
Time Prediction
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