Effect of temperature on interface diffusion in micro solder joint under current stressing

2015 ◽  
Vol 25 (5) ◽  
pp. 1699-1703 ◽  
Author(s):  
Xue-mei LI ◽  
Feng-lian SUN ◽  
Hao ZHANG ◽  
Tong XIN
Keyword(s):  
Solder Joint ◽  
Effect Of Temperature ◽  
Interface Diffusion ◽  
Current Stressing

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

2008 ◽  
Vol 23 (10) ◽  
pp. 2591-2596 ◽  
Author(s):  
X. Gu ◽  
D. Yang ◽  
Y.C. Chan ◽  
B.Y. Wu
Keyword(s):  
Activation Energy ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Direct Current ◽  
Solder Joints ◽  
Cathode Side ◽  
Anode Side ◽  
Kinetics Parameters ◽  
Ambient Temperatures ◽  
Current Stressing

In this study, the effects of electromigration (EM) on the growth of Cu–Sn intermetallic compounds (IMCs) in Cu/SnBi/Cu solder joints under 5 × 103 A/cm2 direct current stressing at 308, 328, and 348 K were investigated. For each Cu/SnBi/Cu solder joint under current stressing, the IMCs at the cathode side grew faster than that at the anode side. The growth of these IMCs at the anode side and the cathode side were enhanced by electric current. The growth of these IMCs at the cathode followed a parabolic growth law. The kinetics parameters of the growth of the IMCs were calculated from the thickness data of the IMCs at the cathode side at different ambient temperatures. The calculated intrinsic diffusivity (D0) of the Cu–Sn IMCs was 9.91 × 10−5 m2/s, and the activation energy of the growth of the total Cu–Sn IMC layer was 89.2 kJ/mol (0.92 eV).

Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing

2014 ◽  
Author(s):  
Lei Qiao ◽  
Yong Zuo ◽  
Limin Ma ◽  
Yutian Shu ◽  
Fu Guo
Keyword(s):  
Solder Joint ◽  
Current Stressing

Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging

2014 ◽  
Vol 25 (9) ◽  
pp. 3742-3746 ◽  
Author(s):  
Xuemei Li ◽  
Fenglian Sun ◽  
Yang Liu ◽  
Hao Zhang ◽  
Tong Xin
Keyword(s):  
Solder Joint ◽  
Size Effect ◽  
Thermal Coupling ◽  
Geometrical Size ◽  
Interface Diffusion

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

2020 ◽  
Vol 33 (1) ◽  
pp. 35-46 ◽  
Author(s):  
Guang Chen ◽  
Xinzhan Cui ◽  
Yaofeng Wu ◽  
Wei Li ◽  
Fengshun Wu
Keyword(s):  
Solder Joint ◽  
Composite Solder ◽  
Solder Joints ◽  
Experimental Results ◽  
High Current ◽  
Sac305 Solder ◽  
Content Type ◽  
Interfacial Imcs ◽  
Current Stressing ◽  
Isothermal Ageing

Purpose The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical-migration (EM) stressing. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% FNS was prepared via the powder metallurgy method. A sandwich-like sample and a U-shaped sample were designed and prepared to conduct an isothermal ageing test and an EM test. The isothermal ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were comparatively studied. Findings A growth of Ag3Sn intermetallic compounds (IMCs) in solder matrix and Cu-Sn interfacial IMCs in composite solder joints was notably suppressed under isothermal ageing condition, whereas the hardness and shear strength of composite solder joints significantly outperformed those of non-reinforced solder joints throughout the ageing period. The EM experimental results showed that for the SAC305 solder, the interfacial IMCs formulated a protrusion at the anode after 360 h of EM stressing, whereas the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, whereas the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/FNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode sides; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, whereas the hardness data showed a relatively homogeneous distribution in the SAC305/FNS solder joint. Originality/value The experimental results showed that the FNS reinforcement could effectively mitigate the failure risk in solder joints under isothermal ageing and high-current stressing. Specifically, the FNS particles in solder joints can work as a barrier to suppress the diffusion and migration of Sn and Cu atoms. In addition, the nanoidentation results also indicated that the addition of the FNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high-current densities.

Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150°C

2007 ◽  
Vol 91 (2) ◽  
pp. 021906 ◽  
Author(s):  
C. E. Ho ◽  
A. Lee ◽  
K. N. Subramanian ◽  
W. Liu
Keyword(s):  
Solder Joint ◽  
Early Stage ◽  
Current Stressing ◽  
Snpb Solder ◽  
Eutectic Snpb

Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint

2012 ◽  
Vol 8 (4) ◽  
pp. 463-466 ◽  
Author(s):  
Hongwen He ◽  
Liqiang Cao ◽  
Lixi Wan ◽  
Haiyan Zhao ◽  
Guangchen Xu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Joule Heating ◽  
Whisker Growth ◽  
Heating Effect ◽  
Joule Heating Effect ◽  
Current Stressing ◽  
Oxide Whisker

Effect of temperature cycling on reliability of flip chip solder joint

2014 ◽  
Author(s):  
Xueming Jiang ◽  
Pengrong Lin ◽  
Yuezhong Song ◽  
Yingzhuo Huang ◽  
Binhao Lian ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Temperature Cycling ◽  
Effect Of Temperature
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