Anomalous magnetic behavior of iron thin films prepared by DC sputtering at very low temperatures

2000 ◽  
Vol 43 (10) ◽  
pp. 919-923 ◽  
Author(s):  
A Muñoz-Martı́n ◽  
C Prieto ◽  
C Ocal ◽  
J.L Martı́nez
2003 ◽  
Vol 17 (04n06) ◽  
pp. 942-947
Author(s):  
G. LAMURA ◽  
E. DI GENNARO ◽  
A. ANDREONE ◽  
M. BOFFA ◽  
A. M. CUCOLO

We present some experimental results on the temperature dependence of the surface resistance Rs and magnetic penetration depth λ of thin films of SmBa 2 Cu 3 O 7-δ. The samples, 0.25 μm thick, were grown by a dc sputtering technique on (100) K LaAlO 3 single crystal substrates, with critical temperatures ranging between 87 and 88 K Accurate measurements af the surface impedance Zs were performed down to 4 K by means of a dielectrically loaded cavity operating in the microwave region (20 GHz). Both λ and Rs show a monotonic temperature behavior, with no evidence of low temperature up-turn characteristic of other rare earth based cuprates like GdBa 2 Cu 3 O 7-δ. At low temperatures, we observed am almost linear behavior of λ with a slope of ~ 0.3 nm/K up to 25 K, as expected in a d-wave pairing scenario. The real part of complex conductivity σ1, shows a bump at around 40 K, in agreement with previous reports.


2001 ◽  
Vol 482-485 ◽  
pp. 1095-1100 ◽  
Author(s):  
A. Muñoz-Martı́n ◽  
C. Prieto ◽  
C. Ocal ◽  
J.L. Martı́nez ◽  
J. Colino

Author(s):  
O. Eibl ◽  
G. Gieres ◽  
H. Behner

The microstructure of high-Tc YBa2Cu3O7-X thin films deposited by DC-sputtering on SrTiO3 substrates was analysed by TEM. Films were either (i) deposited in the amorphous state at substrate temperatures < 450°C and crystallised by a heat treatment at 900°C (process 1) or (ii) deposited at around 740°C in the crystalline state (process 2). Cross sections were prepared for TEM analyses and are especially useful for studying film substrate interdiffusion (fig.1). Films deposited in process 1 were polycristalline and the grain size was approximately 200 nm. Films were porous and the size of voids was approximately 100 nm. Between the SrTiO3 substrate and the YBa2Cu3Ox film a densly grown crystalline intermediate layer approximately 150 nm thick covered the SrTiO3 substrate. EDX microanalyses showed that the layer consisted of Sr, Ba and Ti, however, did not contain Y and Cu. Crystallites of the layer were carefully tilted in the microscope and diffraction patterns were obtained in five different poles for every crystallite. These patterns were consistent with the phase (Ba1-XSrx)2TiO4. The intermediate layer was most likely formed during the annealing at 900°C. Its formation can be understood as a diffusion of Ba from the amorphously deposited film into the substrate and diffusion of Sr from the substrate into the film. Between the intermediate layer and the surface of the film the film consisted of YBa2Cu3O7-x grains. Films prepared in process 1 had Tc(R=0) close to 90 K, however, critical currents were as low as jc = 104A/cm2 at 77 K.


1988 ◽  
Vol 49 (C8) ◽  
pp. C8-1753-C8-1754
Author(s):  
H. Sakakima ◽  
M. Tessier ◽  
R. Krishnan ◽  
E. Hirota

2009 ◽  
Vol 94 (22) ◽  
pp. 222110 ◽  
Author(s):  
S. S. N. Bharadwaja ◽  
C. Venkatasubramanian ◽  
N. Fieldhouse ◽  
S. Ashok ◽  
M. W. Horn ◽  
...  

2021 ◽  
Vol 27 (S1) ◽  
pp. 2660-2662
Author(s):  
David Elam ◽  
Eduardo Ortega ◽  
Andrey Chabanov ◽  
Arturo Ponce

2012 ◽  
Vol 12 (12) ◽  
pp. 9234-9237 ◽  
Author(s):  
M. A. Vasquez-A. ◽  
Goiz O. ◽  
R. Baca-Arroyo ◽  
J. A. Andraca-Adame ◽  
G. Romero-Paredes ◽  
...  
Keyword(s):  

1997 ◽  
Vol 12 (5) ◽  
pp. 1176-1178 ◽  
Author(s):  
A. T. Chien ◽  
J. S. Speck ◽  
F. F. Lange

Pb(ZrxTi1−x)O3 and PbZrO3 heteroepitaxial thin films were produced in an aqueous solution (10 M KOH) at ambient pressure and low temperatures (90–150 °C) on (001) SrTiO3 and LaAlO3 single crystal substrates. Growth of the Pb(ZrxTi1−x)O3 and PbZrO3 thin films initiates by the formation of {100} faceted islands. Energy dispersive spectroscopy (EDS) analysis of the Pb(ZrxTi1−x)O3 thin film shows that the Zr: Ti ratio is 45: 56, nearly identical to the molar ratio of the precursors. This route might provide a viable low temperature alternative for the formation of high dielectric constant thin films for applications such as dynamic random access memory (DRAM).


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